| A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1 | ASML CD Cals | – Prime Silicon w/ DUV42P-6(2.5krpm) + UVN30-0.8(5krpm) – 400nm Diam circle exposed with 300nm Gap, hexagonal array – Exposure: 30mJ/+0.15um/Annular/NA=0.63/sig_o=0.800/sig_i=0.500 – Follow "data" link for full process traveler | |||||||||||||||||
2 | |||||||||||||||||||
3 | Date | Sample # | Observations + Notes | Wf. Center Diameter MIN (nm) | Wf. Center Diameter MAX (nm) | 2cm from Cen. Diameter MIN (nm) | 2cm from Cen. Diameter MAX (nm) | Avg. Diameter (nm) | Std. Dev. Diam. (nm) | Link to Images/Data | Wafer-Stage Particle Check | SEM Center | SEM Right ~3cm from Center | SEM Left ~3cm from Center | SEM Top ~3cm from Center | SEM Bottom ~3cm from Center | SEM ~2cm from Center | ||
4 | 11/1/24 | 241101ASML | 405.8 | 409.6 | 377.7 | 403.4 | 399.125 | 14.51 | 2024-11-01 |  |  |  |  |  |  | ||||
5 | 10/29/24 | 241029ASML | W1 accidentally patterned with wrong reticle | 352 | 354.9 | 367.2 | 388.8 | 365.725 | 16.74 | 2024-10-29 |  |  |  |  |  |  | |||
6 | 10/22/24 | 241022ASML | 358.8 | 371.3 | 356.9 | 418.1 | 376.275 | 28.61 | 2024-10-22 |  |  |  |  |  |  | ||||
7 | 10/20/24 | 241020ASML | Did not set IQC offset on accident | 271.6 | 278.9 | 281.3 | 308 | 15.91 | 2024-10-20 |  |  |  |  |  |  | ||||
8 | 10/15/24 | 241015ASML | Messed up W2, had a lot of streaks after spinning | 360.8 | 377.8 | 359.9 | 391.7 | 372.55 | 15.19 | 2024-10-15 |  |  |  |  |  |  | |||
9 | 10/13/24 | 241013ASML | 339.5 | 343.9 | 358.6 | 393.1 | 358.775 | 24.30 | 2024-10-13 |  |  |  |  |  |  | ||||
10 | 10/9/24 | 241009ASML | 362.5 | 368.5 | 348.8 | 381.4 | 365.3 | 13.53 | 2024-10-09 |  |  |  |  |  |  | ||||
11 | 10/1/24 | 241001ASML | I screwed up W1 by not doing a heat treat after exposure | 342.8 | 355.1 | 324.4 | 377.1 | 349.85 | 22.12 | 2024-10-01 |  |  |  |  |  |  | |||
12 | 9/27/24 | 240927ASML_2 | 363.9 | 376.1 | 352.1 | 384 | 369.025 | 13.99 | 2024-09-27 |  |  |  |  |  |  | ||||
13 | 9/27/24 | 240927ASML | 324.1 | 330.1 | 324.2 | 340.1 | 329.625 | 7.53 | 2024-09-27 |  |  |  |  |  |  | ||||
14 | 9/26/24 | 240926ASML | 340.3 | 346.3 | 333.8 | 346.9 | 341.825 | 6.12 | 2024-09-26 |  |  |  |  |  |  | ||||
15 | 9/18/24 | 240918ASML | ASML is up now so ran first cal with fixed alignment laser. | 320.5 | 326.3 | 316.3 | 339.5 | 325.65 | 10.10 | 2024-09-18 |  |  |  |  |  |  | |||
16 | 9/6/24 | 240906ASML | 346.5 | 332.4 | 336.5 | 360.8 | 344.05 | 12.64 | 2024-09-06 |  |  |  |  |  |  | ||||
17 | 9/4/24 | 240904ASML | ASML had issues with alignment had to run program multiple times in order for it to expose wafer | 328.7 | 332.3 | 328.2 | 342.3 | 332.875 | 6.54 | 2024-09-04 |  |  |  |  |  |  | |||
18 | 8/30/24 | 240830ASML | Both wafers have a defect around the same area but at differing degrees | 345 | 349.1 | 328.7 | 378 | 350.2 | 20.52 | 2024-08-30 |  |  |  |  |  |  | |||
19 | 8/27/24 | 240827ASML | When half waythrough coating w/AuPd I noticed the stage was not spining even though the switch was flipped. When looking at sample the AuPd coat was not uniform. | 338.2 | 342.5 | 332.1 | 350 | 340.7 | 7.53 | 2024-08-27 |  |  |  |  |  |  | |||
20 | 8/22/24 | 240822ASML | When removing wafer from 4" wafer holder part of wafer broke off so i disposed in sharps dosposal . Other than that wafers were good. | 323.3 | 326.3 | 311.1 | 336 | 324.175 | 10.26 | 2024-08-22 |  |  |  |  |  |  | |||
21 | 8/20/24 | 240820ASML | 353 | 357.1 | 332.2 | 358.8 | 350.275 | 12.29 | 2024-08-20 |  |  |  |  |  |  | ||||
22 | 8/17/24 | 240817ASML | Both wafers have simmilar "defect" on mask. Unsure if due to ASML or development. When imaging bottom edge most circles were not uniform | 346.3 | 347.7 | 351.1 | 363.1 | 352.05 | 7.64 | 2024-08-17 |  |  |  |  |  |  | |||
23 | 8/14/24 | 240814ASML | W1 had streak on top right and when developed it became a hole in pattern. W2 had streaks on edge of wafer but not where pattern was developed(got worse after developemnt but not on pattern) | 323.3 | 330.1 | 320.3 | 337.6 | 327.825 | 7.70 | 2024-08-14 |  |  |  |  |  |  | |||
24 | 8/9/24 | 240809ASML | When doing final particle check and POLOS on W1 some ISO went to close to edge which caused it to hit PR film causing smudge on film | 336.9 | 346.2 | 322.3 | 337.9 | 335.825 | 9.93 | 2024-08-06 |  |  |  |  |  |  | |||
25 | 8/6/24 | 240806ASML | 310.6 | 325.1 | 318.8 | 334.3 | 322.2 | 10.02 | 2024-08-06 |  |  |  |  |  |  | ||||
26 | 8/5/24 | 240805ASML | Used wrong PR because normal one was very low so wafer did not devolop correct. did not SEM because of this |  | |||||||||||||||
27 | 7/31/24 | 240731ASML | Used SSP wafer and W2 was hit causing deffect near the bottom edge | 319.9 | 331.6 | 321.2 | 353.9 | 331.65 | 15.73 | 2024-07-31 |  |  |  |  |  |  | |||
28 | 7/24/24 | 240724ASML | now using new single shiny side wafer | 351.8 | 358.6 | 340.2 | 362.4 | 353.25 | 9.74 | 2024-07-24 |  |  |  |  |  |  | |||
29 | 7/22/24 | 240722ASML | still using reclaim on this one | 318.4 | 340.7 | 323.1 | 343.2 | 331.35 | 12.43 | 2024-07-22 |  |  |  |  |  |  | |||
30 | 7/19/24 | 240719ASML | reclaimed wafer | 340.8 | 364.9 | 357.4 | 409.6 | 368.175 | 29.40 | 2024-07-19 |  |  |  |  |  |  | |||
31 | 7/16/24 | 240716ASML | W1 was did not get post bake from ASML and all pattern was dissolved. Huge s.d. mainly due to difference between top and bottom edge. Might be because top was first dipped into developer, not sure. | 333.3 | 339.2 | 290.9 | 339.2 | 325.65 | 23.33 | 2024-07-16 |  |  |  |  |  |  | |||
32 | 7/15/24 | 240715ASML | 329.9 | 343.4 | 328.2 | 346.3 | 336.95 | 9.22 | 2024-07-15 |  |  |  |  |  | | ||||
33 | 7/10/24 | 240710ASML | patter still smudgable, but not as bad as last time. Some bald spots can be seen under SEM | 335.3 | 348.1 | 348.4 | 379.5 | 352.825 | 18.80 | 2024-07-10 |  |  |  |  |  |  | |||
34 | 7/5/24 | 240705ASML | pattern smudges, not solid(paste like texture) after developer, i smudged W1 hence no colour reflected on photo | 350.5 | 357.5 | 353.4 | 374.3 | 358.925 | 10.64 | 2024-07-05 |  |  |  |  |  |  | |||
35 | 6/28/24 | 240628ASML | two dent appeared on surface after Au coating for SEM | 331 | 338.5 | 337.8 | 353.7 | 340.25 | 9.58 | 2024-06-28 |  |  |  |  |  |  | |||
36 | 6/26/24 | 240626ASML | W2 had weird smudge, we imaged W1 | 339.1 | 347.5 | 342.7 | 359 | 347.075 | 8.66 | 2024-06-26 |  |  |  |  |  |  | |||
37 | 6/18/24 | 240618ASML | photos at edge are 3cm from center | 392.1 | 395.7 | 377.3 | 389.6 | 388.675 | 7.99 | 2024-06-18 |  |  |  |  |  |  | |||
38 | 6/3/24 | 240603ASML | Quantitative values are from Wafer 2 (W2) | 354.8 | 360.5 | 361.2 | 369.8 | 361.575 | 6.19 | 2024-06-03 |  |  |  | ||||||
39 | 5/30/24 | 30052024 | first cal after optics upgrade | 417 | 429 | 403 | 415 | 416 | 10.65 | 2024-05-29 |  |  |  | ||||||
40 | 4/29/24 | 29042024 | 360.6 | 369.2 | 382.8 | 385 | 374.4 | 11.55 | 2024-04-29 |  |  |  | |||||||
41 | 4/15/24 | 15042024 | 392.1 | 396.8 | 367.1 | 368.4 | 381.1 | 15.54 | 240415ASML |  |  |  | |||||||
42 | 4/9/24 | 9042024 | 384.7 | 392.8 | 404.7 | 407 | 397.3 | 10.45 | 240409ASML |  |  |  | |||||||
43 | 3/16/24 | 16032024 | 422 | 426.3 | 411.1 | 414.9 | 418.575 | 6.85 | 2024-03-14-Cals |  |  |  | |||||||
44 | 3/5/24 | 50324 | 370.6 | 388.8 | 394.7 | 396.8 | 387.725 | 11.91 | 2024-3-5-Cals |  |  |  | |||||||
45 | 2/22/24 | 220224ASML | look good | 351 | 356 | 360 | 370 | 359.25 | 8.06 | 240222ASML |  |  |  | ||||||
46 | 2/19/24 | 190219ASML | weird distortion on wafer one possible cuased by w1 being the wron kind of wafer | 369.8 | 377.5 | 379 | 381.9 | 377.05 |  |  |  | ||||||||
47 | 2/7/24 | WM24-02-07 | 408 | 411.8 | 389.2 | 390.9 | 399.975 | 11.59 | 2024-2-7Cals |  |  |  | |||||||
48 | 1/18/24 | WM24-1-18 | 388.4 | 397.5 | 367.3 | 368.9 | 380.525 | 14.83 | 2024-1-18Cals |  |  |  | |||||||
49 | 12/14/23 | WM23-12-14 | Wafers sat fro 24 hours after PEB before devloping | 390.4 | 404 | 383 | 392.4 | 392.45 | 8.70 | 2023-12-07 Cals |  |  |  | ||||||
50 | 12/7/23 | WM23-12-7 | more small particles than usual | 373.4 | 379.4 | 381.2 | 388.7 | 380.675 | 6.30 | 2023-12-07 Cals |  |  |  | ||||||
51 | 11/30/23 | WM23-11-20 | 388.8 | 397.1 | 378 | 380 | 385.975 | 8.78 | 2023-11-30 Cals |  |  |  | |||||||
52 | 11/19/23 | WM 23-11-20 | 333 | 335 | 371 | 384 | 355.75 | 25.68 | 2023-11-20 Cals |  |  |  | |||||||
53 | 11/6/23 | WM 23-11-06 | This was done after stone clean of stage | 357 | 357 | 367 | 367 | 362 | 5.77 | 2023-11-06 Cals |  |  |  | ||||||
54 | 5/18/23 | JS 2023-05-18 | Using "New #2 UVN" bottle (from Chem Stores Freezer) | 327 | 335 | 327 | 348 | 334.25 | 9.91 | 2023-05-18 Cals |  |  |  | ||||||
55 | 5/16/23 | JS 2023-05-16 | Using "New #1 UVN" from Bay 6 fridge. Wafer-stage Particles vsiible on both samples | 330 | 339 | 350 | 364 | 345.75 | 14.66 | 2023-05-16 Cals |  |  |  | ||||||
56 | 5/8/23 | JS 2023-05-08 | Wafer 2 had uneven UVN coat | 343 | 362 | 340 | 348 | 348.25 | 9.74 | 2023-05-08 Cals |  |  |  | ||||||
57 | 4/26/23 | JS 2023-04-26 | Small chuck particle on right side. Particle on wafer 2 | 336 | 343 | 333 | 340 | 338 | 4.40 | 2023-04-26 Cals |  |  |  | ||||||
58 | 4/19/23 | JS 2023-04-19 | Particle on processing chuck . See image to the right | 329 | 332 | 344 | 348 | 338.25 | 9.18 | 2023-04-19 Cals |  |  |  | ||||||
59 | 3/6/23 | ND 2023-03-06 | 332 | 344 | 323 | 331 | 332.5 | 8.66 | 2023-03-06 Cals |  |  |  | |||||||
60 | 2/24/23 | ND 2023-02-24 | 308 | 310 | 329 | 340 | 321.75 | 15.41 | 2023-02-24 Cals |  |  |  | |||||||
61 | 2/10/23 | ND 2023-02-10 | W2 came out bad, we think due to spinner issue on both wafers (too high accel.). W2 180° rotated in particle photo. | 320 | 325 | 315 | 325 | 321.25 | 4.79 | 2023-02-10 Cals |  |  |  | ||||||