Sub-topical area under Artificial Intelligence (AI) Hardware:

Teaming status:
(New idea or is there an existing team?)

Teaming needs:
(What are you looking for?)

bassem.tossoun@hpe.com

Hewlett Packard Enterprise

Novel Neuromorphic Computing Architectures Utilizing Emerging Technologies for Extreme Edge Applications, High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware, Emerging AI Processing Hardware, Neuroscience-Inspired Designs, Neural Network Architectures, Reconfigurable Application Specific Integrated Circuit (ASIC) Designs, Neurosynaptic Devices and Circuits for High-Endurance, Uniformity, and Repeatability, Neuromorphic Devices and Architectures for Few-Shot Learning Algorithms, Input/Output (I/O) Optimized for AI Processing

Expertise on algorithms, model/network architecture, CMOS design, and system level integration

High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware, Embedded Processing for Imaging Applications, Reconfigurable Application Specific Integrated Circuit (ASIC) Designs

industry and academic partners for realizing scalable chiplet assembly and CMOS + Bio ontegration

christopher.chua@sri.com

High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware

join chiplet ecosystem team interested in micro-rack 3DHI for re-configurable modular AI hardware

seeking to co-develop a topical area on modular reconfigurable 3D micro-systems for AI hardware

mark.nelson@skywatertechnology.com

Novel Neuromorphic Computing Architectures Utilizing Emerging Technologies for Extreme Edge Applications, High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware, Emerging AI Processing Hardware, Embedded Processing for Imaging Applications, Neurosynaptic Devices and Circuits for High-Endurance, Uniformity, and Repeatability, Neuromorphic Devices and Architectures for Few-Shot Learning Algorithms

Offering process development partnership

andy.miro@towersemi.com

Novel Neuromorphic Computing Architectures Utilizing Emerging Technologies for Extreme Edge Applications, High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware, Emerging AI Processing Hardware, Embedded Processing for Imaging Applications, Reconfigurable Application Specific Integrated Circuit (ASIC) Designs, Neurosynaptic Devices and Circuits for High-Endurance, Uniformity, and Repeatability

Offering Semiconductor Foundry services

Input/Output (I/O) Optimized for AI Processing

Offering scalable CMOS integratable photonics and optoelectronics

Trainable analog feature extraction

Want to team with owners of driver applications

james.lee@stratiotechnology.com

Embedded Processing for Imaging Applications

We are seeking partners, particularly foundries, capable of performing Cu-Cu wafer bonding. We have been developing and selling our Germanium-based SWIR image sensors and SWIR spectral sensors for over ten years, catering to various applications, including home appliances, agriculture, forensics, and drug detection. Our goal is to scale up to mass production and achieve HD resolution for our image sensors.

University of Nevada Reno

High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware, Neuromorphic Devices and Architectures for Few-Shot Learning Algorithms

Fabricate devices and demonstrate the concept

Feel free to contact me if you have any questions.

Novel Neuromorphic Computing Architectures Utilizing Emerging Technologies for Extreme Edge Applications, Emerging AI Processing Hardware, Neuroscience-Inspired Designs, Embedded Processing for Imaging Applications, Reconfigurable Application Specific Integrated Circuit (ASIC) Designs

We would like to team with a university or a large company

rafiqul.islam@cactusmaterials.com

Novel Neuromorphic Computing Architectures Utilizing Emerging Technologies for Extreme Edge Applications, High Performance, Energy Efficient, Reconfigurable, and Scalable Hardware, Emerging AI Processing Hardware, Embedded Processing for Imaging Applications