6.24 CVD - Picosun ALD Al2O3 QM
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CVD - Picosun - Atomic Layer Deposition (ALD) - Al2O3
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Process Specification
Process Performance
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Tool Name:Picosun
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Description: This monitor tracks the ALD thickness, dep rate/cycle, and the uniformity of the deposition.
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Recipe:Al2O3 (standard recipe)
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Layer Material: Al2O3
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Cycles:500 :NOTE: prior to 20190926 the #cycles was 400
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Targeted Results:
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TargetDescription
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Thickness [A]:500 :NOTE: prior to 20190926 the #cycles was 4005 point avg using Ellips
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Non-Uniformity [%]:<5Calculated using (MAX-MIN) / (MAX+MIN) method on thickness data.
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Index of Refraction1.5-1.6measured using 5pt ellips average
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Process Conditions:
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ALD Deposition:
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TMA +H20:Open
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Chamber Temp:300C
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Cycles:500 :NOTE: prior to 20190926 the #cycles was 400
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QM Process Procedure:
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StepToolDescription
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Stock Wafer-Bare Si P-type Test wafer
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CVDPicosunStandard Al2O3 recipe
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Follow manual step by step everytime!
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FT1Ellips5 point thickness
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Ellipsometry Thickness/Index 25 pt maps
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2019/03/19
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2020/01/27
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Ellipse 2 ALD comparison Picosun vs Cambridge
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AL2O3 thickness 5/1/2018
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TiO2 thickness 5/1/2018
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