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Alloy informationMicrostructure information (um^(-1/2))Mechanical properties
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AlloyBin/TerSnCuAgBiAlNiSbZn λ1 -1/2 λ2 -1/2 λ3 -1/2 λfine -1/2 λcoarse -1/2 λCu6Sn5 -1/2 λAg3Sn -1/2Interphase (Zn)UTS (MPa)YTS (MPa)EF (%)Reference
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Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.193 0.2891.2700.6200.00000 0.00000 0.00000 66.10 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
4
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.131 0.1930.2390 1.0640.5700.00000 0.00000 0.00000 66.63 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
5
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.108 0.1570.2070 0.9840.5600.00000 0.00000 0.00000 65.70 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
6
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.096 0.1430.1820 0.9360.5500.00000 0.00000 0.00000 66.11 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
7
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.087 0.1390.1670 0.9010.5460.00000 0.00000 0.00000 65.56 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
8
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
9
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.076 0.1110.1490 0.8530.5370.00000 0.00000 0.00000 65.37 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
10
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.193 0.2891.2700.6200.00000 0.00000 0.00000 53.27 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
11
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.131 0.1930.2940 1.0640.5700.00000 0.00000 0.00000 52.02 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
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Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.108 0.1570.2700 0.9840.5600.00000 0.00000 0.00000 52.23 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
13
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.096 0.1430.2469 0.9360.5500.00000 0.00000 0.00000 51.80 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
14
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.087 0.1390.2258 0.9010.5460.00000 0.00000 0.00000 50.45 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
15
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
16
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.076 0.1110.1490 0.8530.5370.00000 0.00000 0.00000 49.13 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
17
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.193 0.2891.2700.6200.00000 0.00000 0.00000 23.22 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
18
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.131 0.1930.2940 1.0640.5700.00000 0.00000 0.00000 18.32 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
19
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.108 0.1570.2700 0.9840.5600.00000 0.00000 0.00000 19.51 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
20
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.096 0.1430.2469 0.9360.5500.00000 0.00000 0.00000 19.34 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
21
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.087 0.1390.2258 0.9010.5460.00000 0.00000 0.00000 20.95 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
22
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
23
Sn-34.0wt%BiBinary66.00%0.00%0.00%34.00%0.00%0.00%0.00%0.00%0.076 0.1110.1490 0.8530.5370.00000 0.00000 0.00000 17.01 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
24
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.076 0.2581.2301.0200.00000 0.00000 0.00000 59.80 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
25
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.059 0.2060.2940 0.9710.6740.00000 0.00000 0.00000 59.60 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
26
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.050 0.1790.2700 0.8450.6200.00000 0.00000 0.00000 58.20 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
27
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.045 0.1720.2469 0.8220.6140.00000 0.00000 0.00000 55.98 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
28
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.041 0.1420.2258 0.6740.5270.00000 0.00000 0.00000 57.05 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
29
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.040 0.1280.2160 0.6090.4710.00000 0.00000 0.00000 57.30 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
30
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
31
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.076 0.2581.2301.0200.00000 0.00000 0.00000 51.00 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
32
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.059 0.2060.2940 0.9710.6740.00000 0.00000 0.00000 50.30 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
33
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.050 0.1790.2700 0.8450.6200.00000 0.00000 0.00000 48.48 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
34
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.045 0.1720.2469 0.8220.6140.00000 0.00000 0.00000 46.00 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
35
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.041 0.1420.2258 0.6740.5270.00000 0.00000 0.00000 47.50 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
36
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.040 0.1280.2160 0.6090.4710.00000 0.00000 0.00000 48.60 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
37
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
38
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.076 0.2581.2301.0200.00000 0.00000 0.00000 53.28 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
39
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.059 0.2060.2940 0.9710.6740.00000 0.00000 0.00000 28.12 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
40
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.050 0.1790.2700 0.8450.6200.00000 0.00000 0.00000 17.81 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
41
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.045 0.1720.2469 0.8220.6140.00000 0.00000 0.00000 17.21 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
42
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.041 0.1420.2258 0.6740.5270.00000 0.00000 0.00000 15.73 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
43
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.040 0.1280.2160 0.6090.4710.00000 0.00000 0.00000 12.47 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
44
Sn-52.0wt%BiBinary48.00%0.00%0.00%52.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
45
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%1.0000.6900.00000 0.00000 0.00000 49.18 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
46
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
47
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
48
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7490.5670.00000 0.00000 0.00000 54.91 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
49
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7290.5460.00000 0.00000 0.00000 54.23 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
50
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7070.5380.00000 0.00000 0.00000 56.29 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
51
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%1.0001.0200.00000 0.00000 0.00000 40.63 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
52
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
53
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
54
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7490.5670.00000 0.00000 0.00000 47.40 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
55
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7290.5460.00000 0.00000 0.00000 45.14 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
56
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7070.5380.00000 0.00000 0.00000 47.80 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
57
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.6900.5300.00000 0.00000 0.00000 46.68 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
58
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%1.0001.0200.00000 0.00000 0.00000 15.11 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
59
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
60
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.00000 0.00000 0.00000 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
61
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7490.5670.00000 0.00000 0.00000 9.92 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
62
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7290.5460.00000 0.00000 0.00000 10.82 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
63
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.7070.5380.00000 0.00000 0.00000 8.77 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
64
Sn-58.0wt%BiBinary42.00%0.00%0.00%58.00%0.00%0.00%0.00%0.00%0.6900.5300.00000 0.00000 0.00000 8.61 SILVA, B. ; SILVA, V. C. ; Garcia, A. ; Spinelli, J.E. . Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017.
65
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.346470.0000.0001.34840 1.19523 0.00000 35.36 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
66
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.245840.0000.0001.18661 1.09855 0.00000 32.42 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
67
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.213140.0000.0001.05409 1.03695 0.00000 33.33 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
68
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.19270.0000.0000.98533 0.98533 0.00000 32.72 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
69
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.17890.0000.0000.92848 0.94916 0.00000 31.75 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
70
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.168670.0000.0000.89443 0.92450 0.00000 30.82 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
71
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.160130.0000.0000.82213 0.89719 0.00000 32.63 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
72
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.346470.0000.0001.34840 1.19523 0.00000 31.25 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
73
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.245840.0000.0001.18661 1.09855 0.00000 29.93 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
74
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.213140.0000.0001.05409 1.03695 0.00000 30.77 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
75
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.19270.0000.0000.98533 0.98533 0.00000 30.61 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
76
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.17890.0000.0000.92848 0.94916 0.00000 28.99 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
77
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.168670.0000.0000.89443 0.92450 0.00000 28.49 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
78
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.160130.0000.0000.82213 0.89719 0.00000 29.14 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
79
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.346470.0000.0001.34840 1.19523 0.00000 15.51 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
80
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.245840.0000.0001.18661 1.09855 0.00000 14.28 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
81
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.213140.0000.0001.05409 1.03695 0.00000 14.28 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
82
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.19270.0000.0000.98533 0.98533 0.00000 12.10 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
83
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.17890.0000.0000.92848 0.94916 0.00000 10.95 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
84
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.168670.0000.0000.89443 0.92450 0.00000 11.03 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
85
Sn-2.0wt%Ag-0.7wt%CuTernary97.30%0.70%2.00%0.00%0.00%0.00%0.00%0.00%0.160130.0000.0000.82213 0.89719 0.00000 10.85 FERREIRA SCHON, ALINE ; APOENA CASTRO, NICOLAU ; DOS SANTOS BARROS, ANDRÉ ; EDUARDO SPINELLI, JOSÉ ; Garcia, Amauri ; Cheung, Noé ; LUIZ SILVA, BISMARCK . Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. MATERIALS LETTERS, v. 304, p. 130587, 2021
86
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.150 0.00000.0000 0.0000.0000.00000 0.00000 19.55 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
87
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.159 0.00000.0000 0.0000.0000.00000 0.00000 22.21 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
88
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.167 0.00000.0000 0.0000.0000.00000 0.00000 21.17 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
89
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.177 0.00000.0000 0.0000.0000.00000 0.00000 22.97 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
90
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.191 0.00000.0000 0.0000.0000.00000 0.00000 25.45 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
91
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.215 0.00000.0000 0.0000.0000.00000 0.00000 25.85 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
92
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.274 0.00000.0000 0.0000.0000.00000 0.00000 32.32 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
93
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.150 0.00000.0000 0.0000.0000.00000 0.00000 23.14 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
94
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.159 0.00000.0000 0.0000.0000.00000 0.00000 19.90 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
95
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.167 0.00000.0000 0.0000.0000.00000 0.00000 17.06 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
96
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.177 0.00000.0000 0.0000.0000.00000 0.00000 16.89 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
97
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.191 0.00000.0000 0.0000.0000.00000 0.00000 19.81 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
98
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.215 0.00000.0000 0.0000.0000.00000 0.00000 20.42 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
99
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.274 0.00000.0000 0.0000.0000.00000 0.00000 23.70 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.
100
Sn-0.7wt%CuBinary99.30%0.70%0.00%0.00%0.00%0.00%0.00%0.00%0.150 0.00000.0000 0.0000.0000.00000 0.00000 16.78 Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli,Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient, Journal of Alloys and Compounds, Volume 632, 2015, Pages 274-285, ISSN 0925-8388, https://doi.org/10.1016/j.jallcom.2015.01.140.