A | B | C | D | E | F | G | H | I | |
---|---|---|---|---|---|---|---|---|---|
1 | Rule# | General Material Notes | |||||||
2 | F1 | Stackup is 4-layer, Laminate | |||||||
3 | F2 | BGA352: 1.0MM Pitch, 24MM square | |||||||
4 | F3 | Core thickness, prepreg thickness & cu foil thicknesses: See <Thickness Stack-up> tab | |||||||
5 | F4 | 50-ohm signal traces only on layer 1 | |||||||
6 | F5 | Plane layers only on layers 2, 3 | |||||||
7 | F6 | Solder mask P/N & thickness: PSR4000 AUS303 @ 29um | |||||||
8 | F7 | Finish, Top: ###uIn XXX Gold over ###uIn Nickel & ### Paladium | |||||||
9 | F8 | Finish, Bottom: ###uIn XXX Gold over ###uIn Nickel | |||||||
10 | F9 | Solder ball Sn/PB composition TBD | |||||||
11 | F10 | Solder ball height after substrate attach = 0.#MM | |||||||
12 | F11 | Solder ball diameter = 0.#MM | |||||||
13 | |||||||||
14 | Rule# | Geometry Dimensions | NOMINAL | Minimum | Maximum | ||||
15 | um | mils | um | mils | um | mils | Notes: | ||
16 | G1 | Signal Trace Width, 50-ohm, Top | 100.00 | 3.937 | 80.00 | 3.150 | - | #VALUE! | 50-ohm width TBD |
17 | G2 | Signal Trace Width, 100-ohm differential, Top | 80.00 | 3.150 | 80.00 | 3.150 | - | #VALUE! | 100-ohm differential pairs |
18 | G3 | Trace Spacing, 100-ohm differential, Top | 80.00 | 3.150 | 80.00 | 3.150 | - | Most traces 100-ohm differential pairs | |
19 | G4 | Plane clearance, internal | 80.00 | 3.150 | 80.00 | 3.150 | 150.00 | 5.906 | L2 = Min. Other layers larger |
20 | G5 | Other metal clearance, describe | NA | #VALUE! | 80.00 | 3.150 | 150.00 | 5.906 | L2 = Min. Other layers larger |
21 | G6 | Solder Ball Metal Land Diameter | TBD | #VALUE! | TBD | ||||
22 | G7 | Solder Ball Solder Mask Opening Diameter | TBD | #VALUE! | TBD | ||||
23 | G8 | Metal Land to Via, net member | 100.00 | 3.937 | 80.00 | 3.150 | Bigger is better. Via pad-Land tangency allowed | ||
24 | G9 | Metal Land to Via, different net | 100.00 | 3.937 | 80.00 | 3.150 | Bigger is better | ||
25 | G10 | Via, PTH, Hole Diameter | 150.00 | 5.906 | 150.00 | 5.906 | May be plated shut, Review with fab | ||
26 | G11 | Via, PTH, Pad Diameter | 300.00 | 11.811 | 300.00 | 11.811 | May be biased, Review with fab | ||
27 | G12 | Metal to Substrate Edge, Outer Layer | 350.00 | 13.780 | 350 | 13.78 | na | #VALUE! | Bigger is better |
28 | G13 | Metal to Substrate Edge, Inner Layer | 350.00 | 13.780 | 350 | 13.78 | na | #VALUE! | All planes 350um from edge |
29 | G14 | Metal to Solder Mask Clearance | 50 | 1.97 | 50 | 1.97 | Standard solder mask alignment, 2mil | ||
30 | G15 | Solder Mask Width, Min web | 150 | 5.91 | 120 | 4.72 | Smallest mask between openings, Bigger is better | ||
31 | |||||||||
32 | Rule# | Electrical Methodology | |||||||
33 | E1 | Connectivity per rules & best fit. Customer must approve final netlist. | |||||||
34 | E2 | Back of die is connected to signal\net VSS | |||||||
35 | E3 | Pairs: See <Diff Pairs> tab in this XLS | |||||||
36 | E4 | All pairs shall be 100-ohm differential +-10% | |||||||
37 | E5 | Length matching, Class: See <Class> tab in this XLS | |||||||
38 | E6 | All single terminate signal traces shall be 50-ohm +-10% | |||||||
39 | |||||||||
40 | |||||||||
41 | Rule # | Wire Bond Parameters | |||||||
42 | W1 | Die to ring distance | 520 | 20 | Die off substrate | ||||
43 | W2 | Ring width, Ground | 650 | 26 | |||||
44 | W3 | Ring to ring distance | 650 | 26 | |||||
45 | W4 | Ring to Substrate Bond Pad Distance | 590 | 23.23 | 400 | 15.75 | Vias between rows | ||
46 | W5 | Substrate bond Mask opening, Diameter | NA | #VALUE! | All top mask openings are bulk openings | ||||
47 | W6 | Substrate bond Pad, Width | 160 | 6.30 | 120 | 4.72 | 200 | 7.87 | |
48 | W7 | Substrate bond Pad, Length | 360 | 14.17 | 300 | 11.81 | 400 | 15.75 | |
49 | |||||||||
50 | Rule# | Misc Notes | |||||||
51 | N1 | Notes not covered elsewhere | |||||||
52 | N2 | ||||||||
53 | N3 | ||||||||
54 | |||||||||
55 |