UCSD BGA DesignInfo_2014_03_15
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Rule#General Material Notes
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F1Stackup is 4-layer, Laminate
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F2BGA352: 1.0MM Pitch, 24MM square
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F3Core thickness, prepreg thickness & cu foil thicknesses: See <Thickness Stack-up> tab
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F450-ohm signal traces only on layer 1
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F5Plane layers only on layers 2, 3
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F6Solder mask P/N & thickness: PSR4000 AUS303 @ 29um
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F7Finish, Top: ###uIn XXX Gold over ###uIn Nickel & ### Paladium
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F8Finish, Bottom: ###uIn XXX Gold over ###uIn Nickel
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F9Solder ball Sn/PB composition TBD
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F10Solder ball height after substrate attach = 0.#MM
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F11Solder ball diameter = 0.#MM
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Rule#Geometry DimensionsNOMINALMinimumMaximum
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ummilsummilsummilsNotes:
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G1Signal Trace Width, 50-ohm, Top100.003.93780.003.150-#VALUE!50-ohm width TBD
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G2Signal Trace Width, 100-ohm differential, Top80.003.15080.003.150-#VALUE!100-ohm differential pairs
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G3Trace Spacing, 100-ohm differential, Top80.003.15080.003.150-Most traces 100-ohm differential pairs
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G4Plane clearance, internal80.003.15080.003.150150.005.906L2 = Min. Other layers larger
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G5Other metal clearance, describeNA#VALUE!80.003.150150.005.906L2 = Min. Other layers larger
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G6Solder Ball Metal Land DiameterTBD#VALUE!TBD
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G7Solder Ball Solder Mask Opening DiameterTBD#VALUE!TBD
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G8Metal Land to Via, net member100.003.93780.003.150Bigger is better. Via pad-Land tangency allowed
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G9Metal Land to Via, different net100.003.93780.003.150Bigger is better
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G10Via, PTH, Hole Diameter150.005.906150.005.906May be plated shut, Review with fab
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G11Via, PTH, Pad Diameter300.0011.811300.0011.811May be biased, Review with fab
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G12Metal to Substrate Edge, Outer Layer350.0013.78035013.78na#VALUE!Bigger is better
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G13Metal to Substrate Edge, Inner Layer350.0013.78035013.78na#VALUE!All planes 350um from edge
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G14Metal to Solder Mask Clearance501.97501.97Standard solder mask alignment, 2mil
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G15Solder Mask Width, Min web1505.911204.72Smallest mask between openings, Bigger is better
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Rule#Electrical Methodology
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E1Connectivity per rules & best fit. Customer must approve final netlist.
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E2Back of die is connected to signal\net VSS
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E3Pairs: See <Diff Pairs> tab in this XLS
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E4All pairs shall be 100-ohm differential +-10%
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E5Length matching, Class: See <Class> tab in this XLS
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E6All single terminate signal traces shall be 50-ohm +-10%
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Rule #Wire Bond Parameters
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W1Die to ring distance52020Die off substrate
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W2Ring width, Ground65026
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W3Ring to ring distance65026
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W4Ring to Substrate Bond Pad Distance59023.2340015.75Vias between rows
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W5Substrate bond Mask opening, DiameterNA#VALUE!All top mask openings are bulk openings
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W6Substrate bond Pad, Width1606.301204.722007.87
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W7Substrate bond Pad, Length36014.1730011.8140015.75
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Rule#Misc Notes
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N1Notes not covered elsewhere
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N2
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N3
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