6.1 Sputter Equipment Overview Table
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Marvell Nanolab Sputter Equipment
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Staff Target ChangesAdvanced Target ChangeQualified Member Target Change
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Toolgartekmrc944aln2 - PM1aln2 - PM2aln2 - PM3sem-coateroxfordpvd1oxfordpvd2randexedwardstopgunAST-Sputter (In Development)Tool
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Manual Chapter6.86.46.56.56.56.x6.x6.x6.36.76.9Manual Chapter
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Location582584584584584386586586582582584582?Location
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Make/ModelGartekMRC/944Tegal/EndeavorATTegal/EndeavorATTegal/EndeavorATDenton Desk IIOxford/ Plasmalab 100Oxford/ Plasmalab 100RandexEdwards/Auto306customNanolabMake/Model
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Load LockYYYYYYY---YLoad Lock
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Gun Configuration1 DC Magnetron Rotating Magnet4x DC MagnetronDC Dual MagnetronRF Dual MagnetronDC Dual Magnetron1xDC Magnetron1x DC Magnetron1x DC Magnetron3 Diode Guns1 DC Magnetron 1 RF Magnetron3x DC Magnetron3x Angstrom DC/RF gun confocal arrayGun Configuration
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Target size8" disc14-7/8"x4.75"7" & 11" dual s-gun7" & 11" dual s-gun7" & 11" dual s-gun2.375" disc10" disc10" disc5" disc3" disc5.25" S-gun3" discTarget size
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TargetsNb, AlAl/Mn, Al/Si, Ti, WMoAlAl (Ti available)Au/PdAlITOManual has up to date inventoryManual has up to date inventoryManual has up to date inventorySame as Edwards inventoryTargets
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Target ChangeStaffStaffStaffStaffStaffStaffStaffStaffSuperuser/StaffMemberStaffMemberTarget Change
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Control InterfacemanualGUIGUIGUIGUIManualGUIGUImanualmanualmanualManualControl Interface
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Base Pressure2E-7 Torr1E-7 Torr5E-8 Torr5E-8 Torr5E-8 Torr50mtorr2.00E-072.00E-072E-6 Torr1E-5 Torr5E-7 Torr2E-7 TorrBase Pressure
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Max DC power5kW10kW10kW-10kW60Watt5kW5kW-300W5kW1.5kWMax DC power
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Pulse Freq-5 kHz----5 - 350 kHz5 - 350 kHz---TBDPulse Freq
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Max RF power---10kW----1kW300W--Max RF power
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Frequency?---40kHz--13.56 MHz13.56 MHz-VariableFrequency?
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RF Sputter Etch<300W300W300W300W300WNo, DC Sputter Etch, 18W300W300W---Capable but no P/SRF Sputter Etch
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HiVac Pumpcryocryoturbo & water pumpturbo & water pumpturbo & water pump-TurboTurbocryoturboturboTurbo w/ WaterHiVac Pump
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Emission Spectroscopy------Available with rolling cartAvailable with rolling cart---In DevelopmentEmission Spectroscopy
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Temp Control--Heat lampsHeat lampsHeat lamps-Resistive platenResistive platenCooled J arm--Heated PlatenTemp Control
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Pressure ControlGas FlowGas FlowGas FlowGas FlowGas FlowGas FlowAPCAPCGas FlowGas FlowGas FlowGas FlowPressure Control
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Substrate4", 6"up to 8" wafer (chips ok)6", 4" adapter6", 4" adapter6", 4" adapter2"6"6"6"4", 6"4"Up to 6"Substrate
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Wafer Handlersingle waferPallet up to 4x 6" wafer13 wafers per cassette13 wafers per cassette13 wafers per cassetteSingleCassetteCassette3 wafersingle wafer6 waferSingle waferWafer Handler
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Gas 1ArArArArArArArArArArArArGas 1
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Gas 2O2N2N2--Upgrade ReadyO2N2 or O2N2 or O2O2N2Gas 2
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Gas 3---Upgrade Ready--Upgrade ReadyUpgrade Ready--N2O2Gas 3
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Gas 4------Upgrade ReadyUpgrade Ready---H2Gas 4
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