ABCEFGHIJKLMNOPQRSTUVWXYZ
1
▣ Check sheet for SMT Process2TVEstabilished Date : 2007.02.18
Rev. Date : 2021.12.16
Version No. : 2.2
2
4
5
Vendor :OHMLine : AllAuditor : Irfan, YogiActual Score: 100.0 Audit Date : 2023/10/24
6
7
ItemY/N
(체크여부)		ProcessNo.QuestionCriterionDistributionComment
(모든 항목은 필히 Comment
및 Evidence 기입할 것)		Check비고
8
1SMT 공정YManagement of SMT material1Do you check the BGA/IC/PCB vacuum packaging status?1. BGA/IC/PCB should income in vacuum packaging
(Use ESD prevention wrapping material and band)		○ : Compliance, ▲ : Middle, X : Non-Compliance○1. Visual check of vacuum packaging status
9
1SMT 공정YManagement of SMT material2Does MSL component manage the time based on standards?Incoming parts after vacuum packaging should check the moisture
(store the indicator card and manage history - 24Hr storage)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the indicator card
2. Check at the site (MSL management sheet)
10
SMT 공정YManagement of SMT material3Does it comply with BGA/IC/PCB management standards?After the production quantity is released, the remaining quantity should be immediately vacuum-packed (material warehouse)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check compliance with standard
11
SMT 공정YManagement of SMT material3Does it comply with BGA/IC/PCB management standards?2. The unpacked IC shipped from the field should be used within 24 hours
(time management by level) 		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check compliance with standard
12
SMT 공정YManagement of SMT material3Does it comply with BGA/IC/PCB management standards?3. If not available within 24 hours
- Vacuum packaging and storage within 30 minutes after baking
(Refer standard of baking according to MSL level or requirements of maker)
*Opened ICs waiting for use are stored in a designated place		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check compliance with standard
13
SMT 공정YManagement of SMT material3Does it comply with BGA/IC/PCB management standards?4. The PCB should store on a flat surface○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check compliance with standard
14
SMT 공정YManagement of SMT material4Is Tray IC managed by Part No.?Tray IC should use tag for identification Part No
It should manage history when repacking the tray (packaging date, time, quantity)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check Identification mark
15
SMT 공정YManagement of SMT material5Do you comply with the warehouse temperature/humidity standards?1. Temperature (25±3℃), humidity 30~60%○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
16
SMT 공정YManagement of SMT material5Do you comply with the warehouse temperature/humidity standards?. Check temperature/humidity check sheet (twice a day, day/night)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
17
SMT 공정YManagement of SMT material5Do you comply with the warehouse temperature/humidity standards?3. Temperature/humidity upper/lower limit should be managed○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
18
SMT 공정YManagement of SMT material6Do you comply with first-in/first-out management when using materials?1. It should be managed first-in/first-out○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the material incoming date
(shipping company month label)
2. Place materials in a structure that allows
first in / first out (recommended)
19
SMT 공정YManagement of SMT material7Do you manage dry chamber temperature/humidity check sheet?1. Dry Chamber internal temperature/humidity
- Temperature: 25±5℃. Humidity: less than 10%		○ : Compliance, ▲ : Middle, X : Non-Compliance○1. Check the calibration of temmometer and hygrometer
2. Check the temperature/humidity check sheet
3. Temperature/humidity can be checked without opening the chamber door
4. Close the door and check if it reaches 10% within an hour
20
SMT 공정YManagement of SMT material7Do you manage dry chamber temperature/humidity check sheet?Temperature/humidity management by c/sheet : Twice a day (day/night)○ : Compliance, ▲ : Middle, X : Non-Compliance○1. Check the calibration of temmometer and hygrometer
2. Check the temperature/humidity check sheet
3. Temperature/humidity can be checked without opening the chamber door
4. Close the door and check if it reaches 10% within an hour
21
SMT 공정YManagement of SMT material7Do you manage dry chamber temperature/humidity check sheet?3. Temperature/humidity upper/lower limit should be managed○ : Compliance, ▲ : Middle, X : Non-Compliance○1. Check the calibration of temmometer and hygrometer
2. Check the temperature/humidity check sheet
3. Temperature/humidity can be checked without opening the chamber door
4. Close the door and check if it reaches 10% within an hour
22
SMT 공정YManagement of SMT material7Do you manage dry chamber temperature/humidity check sheet?4. Temperature/humidity can be checked without opening the equipment door○ : Compliance, ▲ : Middle, X : Non-Compliance○1. Check the calibration of temmometer and hygrometer
2. Check the temperature/humidity check sheet
3. Temperature/humidity can be checked without opening the chamber door
4. Close the door and check if it reaches 10% within an hour
23
SMT 공정YManagement of SMT material8Do you manage the incoming/outgoing of dry chamber equipment?In/out and time of equipment internal parts should be managed○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the C/sheet
24
SMT 공정YSolder Paste9Is the solder paste in/out managed?1. Income date / inputed date to refrigerator / Outgoing date to refrigerator / Mixing time / Opened date○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the tag or system management check
1. Visual check, management by incoming date/lot
2. Check the validity period whichbe secured at least 2 months
25
SMT 공정YSolder Paste9Is the solder paste in/out managed?2. It should be managed from storage to disposal○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the tag or system management check
1. Visual check, management by incoming date/lot
2. Check the validity period whichbe secured at least 2 months
26
SMT 공정YSolder Paste9Is the solder paste in/out managed?3. The validity period should be secured at least 2 months at the time of stock○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the tag or system management check
1. Visual check, management by incoming date/lot
2. Check the validity period whichbe secured at least 2 months
27
SMT 공정YSolder Paste10Does it comply with refrigerated storage standards?1. Refrigerator temperature: 1~10℃ (Recommended: 5±3℃ management)○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the calibration of thermometer
2. Check Temperature C/Sheet
3. Check First in/first out
4. Check that High/low temperature solder classification management
28
SMT 공정YSolder Paste10Does it comply with refrigerated storage standards?2. Temperature Check Sheet twice a day (recorded day/night)○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the calibration of thermometer
2. Check Temperature C/Sheet
3. Check First in/first out
4. Check that High/low temperature solder classification management
29
SMT 공정YSolder Paste10Does it comply with refrigerated storage standards?3. Temperature upper/lower limit should be managed○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the calibration of thermometer
2. Check Temperature C/Sheet
3. Check First in/first out
4. Check that High/low temperature solder classification management
30
SMT 공정YSolder Paste10Does it comply with refrigerated storage standards?4. It should be managed first-in/first-out○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the calibration of thermometer
2. Check Temperature C/Sheet
3. Check First in/first out
4. Check that High/low temperature solder classification management
31
SMT 공정YSolder Paste10Does it comply with refrigerated storage standards?5. high/low temperature solders should Separate and be managed○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the calibration of thermometer
2. Check Temperature C/Sheet
3. Check First in/first out
4. Check that High/low temperature solder classification management
32
SMT 공정YSolder Paste11Does the Solder Paste mix in machine?RPM management of mix machine
①400 RPM : 150 sec
②1,000 RPM : 45 sec		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site (manual or system)
33
SMT 공정YSolder Paste12Do you comply with the conditions of use of Solder Paste?1. Storage in room temperature : 2 ~ 12 hour
(2Hour ↓ : Can't be used, 2~12Hour Not opened solder : Re-refrigerated,
12Hour ↑ : Disposal)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the standards
34
SMT 공정YSolder Paste12Do you comply with the conditions of use of Solder Paste?2. Remained solder after opening : Use within 12 hour
(12Hour ↓ : Re-refrigerated after sealing, 12Hour ↑ : Disposal)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the standards
35
SMT 공정YSolder Paste12Do you comply with the conditions of use of Solder Paste?3. Input to the screen printer : Use within 4 hour (4Hour ↑ : Disposal)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the standards
36
SMT 공정YSolder Paste12Do you comply with the conditions of use of Solder Paste?4. Printed solder on PCB : Input SMT line within 2 hour
(2Hour ↑ : Re-print after cleaning)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the standards
37
SMT 공정YManagement of stencil13Do you have incoming inspection for stancil?1. 1:1 verification with Bare PCB and Stencil○ : Compliance, ▲ : Middle, X : Non-Compliance○
Same-day inspection according to the incoming inspection report when stencil is first received
- Check the differences by 1:1 matching the stencil film and stencil attached to the incoming inspection report
- Be sure to verify that the PCB Version of Stencil Film is in its final state
38
SMT 공정YManagement of stencil13Do you have incoming inspection for stancil?2. Sample ground measurement for representative openings
- Indicate representative parts (BGA, CHIP, CNT, etc.) on stencil report
- Sample 1 Point Measurement of Opening Marked on Stencil Report		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Same-day inspection according to the incoming inspection report when stencil is first received
- Check the differences by 1:1 matching the stencil film and stencil attached to the incoming inspection report
- Be sure to verify that the PCB Version of Stencil Film is in its final state
39
SMT 공정YManagement of stencil13Do you have incoming inspection for stancil?3. Stencil Tension should measure when incoming stancil
(Spec: 0.65mm or less)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Same-day inspection according to the incoming inspection report when stencil is first received
- Check the differences by 1:1 matching the stencil film and stencil attached to the incoming inspection report
- Be sure to verify that the PCB Version of Stencil Film is in its final state
40
SMT 공정YManagement of stencil14Do you manage stencil input/output history?1. It should write in/out documents (write up used items/waste items)
- System use recommended		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the in/out documents
41
SMT 공정YManagement of stencil15Is the storage condition of the stencil good?1. Storage location temperature management: 25±3℃○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check temperature and storage conditions
42
SMT 공정YManagement of stencil15Is the storage condition of the stencil good?2. When storing stencils, should make a corrective action to prevent dust
- Stored in a storage box with wrapping for preventing dust		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check temperature and storage conditions
43
SMT 공정YManagement of stencil15Is the storage condition of the stencil good?3. It should store that separated by partitions so that the stencils do not touch each other and Stored vertically○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check temperature and storage conditions
44
SMT 공정YManagement of stencil16Is the stored stencil clean? (Check hole clogging and residue)1. It should observe the inspection method after cleaning the stencil
(Cleaning → Air Gun → Magnifying glass_Minimum x 60)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check storage status of stencil
2. Check c/sheet of incoming inspection
45
SMT 공정YManagement of stencil16Is the stored stencil clean? (Check hole clogging and residue)2. After cleaning, the inspection results and manage history should record○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check storage status of stencil
2. Check c/sheet of incoming inspection
46
SMT 공정YManagement of stencil17Is the model for SVC classified?Stencil on MP and SVC model should be classified○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check storage status
47
SMT 공정YManagement of stencil18Isn't the tape attached to the bottom of the stencil?Do not use tape attached to the lower side of the stencil○ : Compliance, ▲ : Middle, X : Non-Compliance○Check that tape is attached by visual
48
SMT 공정YSMT
Program		19Is the programing work systemized?Check the SMT Worksheet output○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the SMT worksheet
49
SMT 공정YSMT
Program		20Do you program with the latest data (BOM, CAD drawings)?1. Check the program for each W/O○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check ECO applied
50
SMT 공정YSMT
Program		20Do you program with the latest data (BOM, CAD drawings)?2. Check the ECO application by W/O○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check ECO applied
51
SMT 공정YIC Memory21(Common) Do you have work instructions for each IC?It should have a Own work instructions based on IC model○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the own work instrucments
52
SMT 공정YIC Memory22(Common) Are you performing sampling inspection of the copied model?One IC per tray should be inspected (manual inspection)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
53
SMT 공정YIC Memory23(Auto) Is the loading area of the copied model and the waiting model separated?The copy-completed model and the waiting model loading area should be separated○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
54
SMT 공정YIC Memory24(Manual) Is the copy program the latest version?The program should be the latest version○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the program version
55
SMT 공정YIC Memory25When creating Bin file→ Project, is it compared with the Option (Device Setting) value and the work instructionsl?It should Match with the work instructions○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the work instructions
56
SMT 공정YScreen print26Do you manage the temperature inside the screen print M/C?1. Screen Print M/C internal temperature: 25±3℃○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the check sheet
Check the calibration of temmometer and hygrometer
57
SMT 공정YScreen print26Do you manage the temperature inside the screen print M/C?2. Check the temperature (twice a day, day/night)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the check sheet
Check the calibration of temmometer and hygrometer
58
SMT 공정YScreen print26Do you manage the temperature inside the screen print M/C?emperature/humidity upper/lower limit should be managed○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the check sheet
Check the calibration of temmometer and hygrometer
59
SMT 공정YScreen print27Is there a device for removing foreign material from the PCB pad?1. Role tape dust removal equipment or Air Blowing or Brush installation○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the equipment installed
60
SMT 공정YScreen print28Do you check the squeegee condition status?1. Matters should not be felt when touching edge of Squeegee with hands
(scratch, damage of edge, etc.)		○ : Compliance, ▲ : Middle, X : Non-Compliance○1. Check the squeegee replacement cycle
2. Use the surface plate[table] to test for light leakage
61
SMT 공정YScreen print28Do you check the squeegee condition status?2. Checking & Cleaning cycle : Least once a day○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the squeegee replacement cycle
62
SMT 공정YScreen print29Is the area around the screen print M/C clean?Check clamp bending, contamination of solder residue○ : Compliance, ▲ : Middle, X : Non-Compliance○Check the c/sheet
63
SMT 공정YScreen print30Is the PCB Back-up Pin & Block location correct?1. Back-up JIG and actual setting location should match○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the Back-up pin location
2. Check the back-up pin drawing for each PCB Part No
64
SMT 공정YScreen print30Is the PCB Back-up Pin & Block location correct?2. Back-up pin JIG should be stored by PCB Part No.○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check the Back-up pin location
2. Check the back-up pin drawing for each PCB Part No
65
SMT 공정YScreen print31Are the setting conditions good for printing?1. Have a condition table for each PCB P/N○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check whether equipment setting condition and condition table are the same
2. Check equipment setting conditions and condition table when changing models
66
SMT 공정YScreen print31Are the setting conditions good for printing?2. Equipment setting conditions and condition table should be the same○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check whether equipment setting condition and condition table are the same
2. Check equipment setting conditions and condition table when changing models
67
SMT 공정YScreen print32Does the screen print M/C automatically clean stencils?It shall have a conditional table or work guide for each model and be set up in the machine in the same way as specified conditions○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the program setting
68
SMT 공정YScreen print33Is the scoops only for solder in good condition?Check the scoops condition
- Do not put on stencil and do not put in alcohol		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the scoops condition
69
SMT 공정YSPI
(Screen Print
Inspection)		34Does the P/N of the program and the P/N of the PCB match?P/N of the program should match P/N of the PCB○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check matching
70
SMT 공정YSPI
(Screen Print
Inspection)		35When changing the model, do you check the printing status on the PCB?Check the printing status of the first 3 sheets
- Inspection standard: Printed volume 50 ~ 170%
(however, 0.4 Pitch↓, BGA IC: 30 ~ 170%)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
71
SMT 공정YSPI
(Screen Print
Inspection)		36Do you comply with the standards for handling defective printing?Clean the Bare PCB with an eco-friendly cleaning agent (IPA and ethanol acceptance) and blow out the solider particles remaining on the top and surface of the PCB by air in the cleaning room.○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the solder particles with a magnifying glass
72
SMT 공정YSystem for
preventing insert error		37Do you use a system to prevent insert error?Scan management using GPTS or own insert error prevention system○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check GPTS / own insert error prevention system
73
SMT 공정YSystem for
preventing insert error		38Do you comply with the scan cycle?1. Scan after feeder preparation work○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check GPTS / own insert error prevention system
74
SMT 공정YSystem for
preventing insert error		38Do you comply with the scan cycle?2. Scan when model change○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check GPTS / own insert error prevention system
75
SMT 공정YSystem for
preventing insert error		38Do you comply with the scan cycle?3. Scan when material connection work○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check GPTS / own insert error prevention system
76
SMT 공정YSystem for
preventing insert error		39Do you comply with the material connection process?1. Mount the parts to the feeder according to the SMT Worksheet standard○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
77
SMT 공정YSystem for
preventing insert error		39Do you comply with the material connection process?2. When exchanging materials, scan the material P/N on the feeder and scan the material P/N to be replaced (All Scan)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
78
SMT 공정YSystem for
preventing insert error		39Do you comply with the material connection process?3. Prohibition of connection outside the line
(Prohibition of connection in material warehouse and preparation work room)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
79
SMT 공정YSystem for
preventing insert error		40Do you comply with remainder material management?1. Transfer of remainder material (transfer of remainder between companies)
- Measure capacity with LCR Meter and manage history 		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check c/sheet at the site
80
SMT 공정YSystem for
preventing insert error		40Do you comply with remainder material management?2. Material division (one reel is divided into two or more)
- Measure capacity with LCR Meter and manage history 		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check c/sheet at the site
81
SMT 공정YSystem for
preventing insert error		40Do you comply with remainder material management?3. Prohibit combining remainder materials (make 2 or more into one)
- Combining is prohibited and used in the remaining amount
(Part Lot No. may be different or work error may occur)		○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check c/sheet at the site
82
SMT 공정YSystem for
preventing insert error		41Do you conduct a self/sequencial inspection?Set the scanning cycle during mass production
- Excluding small lot, at least once in the morning/afternoon		○ : Compliance, ▲ : Middle, X : Non-Compliance○Check the system
83
SMT 공정YSystem for
preventing insert error		42Are there any missing label scanning items?Items: Worker ID, Work sheet, Part P/N, Lot No○ : Compliance, ▲ : Middle, X : Non-Compliance○Check the system
84
SMT 공정YMounter43Does the production model match the work instruction?1. The Program should match work instruction○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check Program and List
2. Check ECO applied
85
SMT 공정YMounter43Does the production model match the work instruction?2. Check the ECO applied○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check Program and List
2. Check ECO applied
86
SMT 공정YMounter44Are there key management items and Is it provided?Key management items should manage in work instruction○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the work instrucments
87
SMT 공정YMounter45Do you manage part height by part maker?When changing the model, manage the height of each part maker○ : Compliance, ▲ : Middle, X : Non-Compliance○
1. Check that whether the Z value of the parts and equipment being used is the same
Check the c/sheet of history (manually)
88
SMT 공정YMounter46Do you clean the nozzle regulaly and manage vacuum pressure?1. Cycle: 1 time/week or more○ : Compliance, ▲ : Middle, X : Non-Compliance○Check at the site
89
SMT 공정YMounter46Do you clean the nozzle regulaly and manage vacuum pressure?2. Check vacuum pressure by each nozzle○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check at the site
90
SMT 공정YMounter47Do you manage the tags (history) of each feeder?1. Same trouble history management for each feeder○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
91
SMT 공정YMounter47Do you manage the tags (history) of each feeder?2. Calibrates if the same Trouble occurs more than 3 times (reviews disposal if the same problem occurs)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
92
SMT 공정YMounter47Do you manage the tags (history) of each feeder?3. In case of trouble, check inspection items and manage history○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
93
SMT 공정YMounter48Is the mounting rate managed?Mounting rate should manage and improve it (mounting rate : 99.90%↑)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
94
SMT 공정YMounter49Is the PCB Back-up Pin & Block location correct?PCB Back-up Pin & Block should be used○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check back-up pin location
95
SMT 공정YMounter50Do you use the BGA inspection function?BGA Ball inspection function should be used○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the operation status of the BGA Ball inspection function
96
SMT 공정YMounter51Are falling parts handled according to regulations?1. All dropped parts are discarded
However, parts that ICs and can check capacity can recycle
However, the recycled parts are marked for tracking management.		○ : Compliance, ▲ : Middle, X : Non-Compliance○Check the status of managament (marking, tag)
97
SMT 공정YMounter52Do you manage the tags (history) of each feeder?1. Same trouble history management for each feeder○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
98
SMT 공정YMounter52Do you manage the tags (history) of each feeder?2. Calibrates if the same Trouble occurs more than 3 times (reviews disposal if the same problem occurs)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
99
SMT 공정YMounter52Do you manage the tags (history) of each feeder?3. In case of trouble, check inspection items and manage history○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
100
SMT 공정YMounter53Is the mounting rate managed?Mounting rate should manage and improve it (mounting rate : 99.90%↑)○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check the c/sheet
101
SMT 공정YAOI
(Auto Optical
Inspection)		54Does the P/N of the program and the P/N of the PCB match?P/N of the program should match P/N of the PCB○ : Compliance, ▲ : Middle, X : Non-Compliance○
Check matching