SiO2 film

	A	B	C	D	E	F	G	H	I	J	K	L	M	N	O	P	Q	R	S	T	U	V	W	X	Y	Z
1	Date	User	Film	Recipe	Ar flow, sccm	O2 flow, sccm	Substrate T	Dep.time	Thickness	JAW EC-400 (Woolam S.E.)		Avg Index	Index+1%	Index -1%	Dep.rate	Avg.dep. rate	Avg+10%	Avg-10%	HF e.r.	Stress	Avg Stress	Avg+30%	Avg-30%	LPD ( light point defects)		Comment/Tony Bosch
2							°C	sec	(Å)	Index @632.8nm	Index @1550nm	Index @632.8nm			(nm/min)	(nm/min)	(nm/min)	(nm/min)	(nm/min)	MPa				before dep.	after dep.	Done sputtering on 4"Si wafer

3				Oxide						Index		Avg.Index	Index+1%	Index-1%	Dep.rate	Avg.dep.rate	Avg+10%	Avg-10%		Stress	Avg.Stress	Avg+30%	Avg-30%			Maintenance
4	03/08/17	Biljana	SiO2	Staff SiO2-SW2	45	6	20	3600.00	1392.53	1.487	1.479	1.487	1.502	1.472	2.32	2.32	2.55	2.09						27	1515
5	05/25/17	Biljana	SiO2	Staff SiO2-SW2	45	6	20	3600.00
6	05/26/17	Biljana	SiO2	Staff SiO2-SW2	45	6	20	3600.00
7
8
9
10
11
12
13
14
15
16
17								Avg Thickness	1392.53									Avg HF e.r.	#DIV/0!
18									Avg Index	1.487	1.479			Avg.dep.rate	2.32				Avg Stress	#DIV/0!
19									Index+1%	1.502	1.494			Avg+10%	2.55				Avg+30%	#DIV/0!
20									Index-1%	1.472	1.464			Avg-10%	2.09				Avg-30%	#DIV/0!
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100