5.16 Tystar16 - 16SUPLYA
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Tystar16 - 16SUPLYA
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Process Specification
Process Performance
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Tool Name:Tystar16
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Description: This monitor tracks undoped polysilicon thickness and uniformity.
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Recipe:16SUPLYA
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Layer Material: Undoped polysilicon
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Targeted Results:
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TargetDescription
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Thickness [A]:3000Measured using nanoduv
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Uniformity [%]:>90%Calculated using (MAX-MIN) / (MAX+MIN) method on thickness data.
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Process Conditions:
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Deposition:
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O2 [sccms]:135`
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SiH4 [sccms]:120
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PH3[sccms]25
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Temperature [degrees C]:
615
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Time [min]:30
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QM Process Procedure:
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StepToolDescription
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Stock WaferNew Wafer6-inch P-Type Test Wafer
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Oxide GrowthTystar21kA Oxide Growth
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Stress 1flexus
Initial stress test
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Polysilicon GrowthTystar1630 minute polysilicon growth
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Backside Etchtechnics-c5-point film thickness/RI
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Stress 2flexusFinal stress test
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FT1nanoduv5-point film thickness
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ellipsRI
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Backside etchtechnics-cClear backside
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FTIRftir
Molecular spectrum measurement
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Latest FTIR Measurement:11-15-2018
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