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DateUserFilmRecipeSubstrate TCoat timeDep.timeThicknessJAW EC-400 (Woolam S. E.)Dep.rate HF e.r.StressLPD (Gain4) particle size 0.16-1.6umLPD (Gain2) particle size 2.8-28.0umComment/Mike Silva maintenance
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300°Cminsec(Å)Index @ 632.8nmIndex @ 1550nm(nm/min)(nm/min)(MPa)before depositionafter depositionbefore depositionafter deposition4"Si wafer, placed in the center of platen,~500um thick
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Nitride 2Dep.timeIndexDep.rate StressMaintenance
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02/07/17BiljanaSi3N4Nitride 230010min1800.002488.121.9761.9378.2941.00466.97no datano datano datano data
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02/27/17BiljanaSi3N4Nitride 230010min1800.002366.542.0071.9697.8944.40382.89no datano datano datano dataTest done on 800um test Si wafer
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04/18/17BiljanaSi3N4Nitride 230010min1800.002341.521.9851.9457.8145.76487.52132825no datano data
showerhead pattern, but less then in oxide
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05/22/17BiljanaSi3N4Nitride 230010min1800.002380.011.9881.9477.9347.56498.3173530no datano data
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06/16/17BiljanaSi3N4Nitride 230010min1800.002349.541.9971.9557.8347.00482.4522273no datano data
showerhead pattern, but less then in oxide
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08/07/17BiljanaSi3N4Nitride 230010min1800.002547.001.9821.9408.4932.70460.8712537no datano data
showerhead pattern, but less then in oxide
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08/22/17BiljanaSi3N4Nitride 230010min1800.002544.121.9921.9478.4835.71455.5019680954showerhead pattern
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09/05/17BiljanaSi3N4Nitride 230010min1800.002492.461.9841.9438.3137.45457.1721287226No showerhead pattern
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10/25/17BiljanaSi3N4Nitride 230010min1800.002441.901.9951.9518.1437.83475.2020997762264
A lot small particles, no shower head pattern
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41.05
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Avg Stress462.99
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Avg+30%601.88
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Avg. Thickness2439.028.13Avg-30%324.09
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Avg. Index1.9901.9488.94
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Avg+1%2.0091.9687.32
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Avg-1%1.9701.929
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