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Thickness, AIndex @632.8nmThickn. Uniformity, %
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MinMaxMinMaxComment/Brian Lingg
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Datecenter of wafer1cm from edgecenter of wafer1cm from edge
Thickness Uniformity, %
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12-02-193115.793084.271.4751.47599.49Thicker in the center
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11-03-203001.502948.401.4751.47799.11Thicker in the center
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01-04-212902.802893.991.4761.47699.85Thicker in the center
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02-23-212803.002771.121.4761.47699.43Thicker in the center
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04-19-212826.502810.701.4781.47899.72Thicker in the center
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05-19-212729.602738.191.4751.475Thinner in the center
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06-15-212757.952738.491.4741.47499.65Thicker in the center
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Average:2876.732855.021.4761.47699.54Silane gets lower- film thinner in center
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Avg.+2%2934.272912.121.5051.505
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Avg.-2%2819.202797.921.4461.446
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Max3115.793084.271.4781.47899.85
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Min2729.602738.191.4741.47499.11
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