ABCDEFGHIJKLMNOPQ
1
2
Thickness, AIndex @632.8nmThickn. Uniformity, %
3
MinMaxMinMaxComment/Mike SIlva
4
Datecenter of wafer1cm from edgecenter of wafer1cm from edge
Thickness Uniformity, %
5
12-02-193030.002958.611.4651.45498.81Thicker in the center
6
12-03-192994.882923.961.4641.45498.80Thicker in the center
7
12-03-192994.882923.961.4641.45498.80Thicker in the center
8
9
10
11
12
13
14
15
16
17
18
Average:3006.592935.511.4641.45498.80
19
Avg.+2%3066.722994.221.4941.483
20
Avg.-2%2946.462876.801.4351.425
21
Max3030.002958.611.4651.454#REF!
22
Min2994.882923.961.4641.454#REF!
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58