ABCDEFGHIJKLMNOPQRSTUVWXYZAAABACADAEAF
1
2
3
4
BrandProduct codeDescriptionThermal LJMechanical LJNon-irr lap jointsDose Steps
Irradiated lap joints
Total lap jointsCuring time (hrs)Supplying instituteInstitute for assemblyLap-joints delivery est. dateInstitute for thermal testingInstitute for mechanical testingTime for assembly (hrs)(days)
Received/Labelled
5
--Composite resin - Type 100300-CERN00
6
--Composite resin - Type 200300-CERN00
7
3M5515Thermo-silicone000000None00
8
3MScotchweld DP 190 grey (structural glue)000000200
9
3MScotchweld DP 110 (quick setting glue)000000200
10
3MVHB 5909
thin foam tapes with pressure sensitive adhesive on both sides
0333912NoneCERN; MPP17.06.noneCERN41XX (VHB)
11
AdhereIRS2125000000200
12
All compK9carbon foam000300-CPPM15.07.00
13
AMEC Thermasol
MPC315Phase-change material, wax based200000None00
14
AMEC Thermasol
MPC25Phase-change material, wax based203369NoneCERN41
15
Andovernew Epolite:Polaris PF7006AEpoxy000000None00
16
Arctic SilverArctic Silver000000-00
17
Dow CorningSE4445Thermally conductive adhesive2333151812CPPMCPPM15.07.426
Curing time opt 0.75 hrs
18
Dow CorningTC 5022 replaced by TC5622000000None00
19
Dow CorningTC 5622
(thermal interface paste, planned use for OT cooling tube embedding)
000000None00
20
Dow Corning 186silicone elastomer0CERN
21
Dymax9001UV glue0BN
22
Dymax9-20801
Light and heat curable thermal adhesive
233315RALRAL21.07.2017RALRAL
23
ElectrolubeER2074000000100
24
ElectrolubeER2220Epoxy000000100
25
HexionEpon 828/Epikur 3055 100:40 (structural glue)000000200
26
HuntsmanAraldite 2011 Epoxy2333151824CERN; KEK17.06.noneCERN7810XX (2011)
27
HuntsmanAraldite 2013 (component mounting glue)0000000.100
28
HuntsmanTDR 1100 (silicon compatible glue)0000000.2500
29
HuntsmanAraldite AV/HV1580Epoxy233315180.08333333333RALRAL21.07.2017RALRAL6.251
30
HuntsmanAraldite 2020030399Liverpool/CERN41XX (Ilya)
31
HuntsmanAraldite 2022Epoxy0000000.3300
32
HuntsmanAraldite 2012Epoxy0000000.3300
33
IsoltronicGap-Pad 3000S30Thermal pad - Type 1201367NoneCERN41
34
IsoltronicGap-Pad V0 Ultra SoftThermal pad - Type 2201367NoneCERN41
35
KunzeKU-BGDXThermo-silicone201367NoneCERN41
36
LairdTPCM 583
(thermal interface film, planned use for OT module mounting)
000000None00
37
MelcorTCE-004Reworkable epoxy000000100
38
Parker Chomerics
T725Phase change material23331518NoneCERN61
39
Parker Chomerics
T557
Phase-change material, polymer based
000000NoneCERN00
40
Parker Chomerics
T777
Phase-change material, polymer based
000000None00
41
Parker Chomerics
Gel 30Pre-cured gel, silicone based203369NoneCERN41
42
PolytecTC418soft flexible thermal epoxy23331518RALRAL21.07.2017RALRAL61
43
PolytecTC423000000100
44
PPI7011 DS
POLYIMIDE FILM COATED ON BOTH SIDES WITH A POLYSILOXANE ADHESIVE
000300None00
45
PPIRD-577Fpolyimide film used in IBL modules03339120.5CERN17.06.noneCERN51
46
Prima-bondEG7655Reworkable epoxy233315182CPPMCPPM15.07.122
47
Prima-bondEG7658Reworkable epoxy233315182CPPMCPPM15.07.122
48
Stycast+Catalist 9
2850FTPOTTING COMPOUND03339122CPPMCPPM15.07.81
49
Tesatesafix 4962
double-sided tape consisting of a non-woven backing and a tackified acrylic adhesive
0333912NoneCERN; MPP17.06.noneCERN41XX (4962)
50
UHUUHU Endfest 300Epoxy033391240CERN17.06.noneCERN8411XX (UHU)
51
Total days44
52
53
234
54
Time for jig preparation (hrs)2204
55
Samples per jig6
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100