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DATE CommentsDeviation
(%)
FILM
THICKNESS
(kÅ)
STRESS
(MPa)
Sheet
Resistance
(Res/sq)
Resistivity
(Ω⋅m)
Exclude from SPC?Exclude from plot?
2
AVERAGE:-8.690.94100.4216.491.52E-06
3
11/22/2025MT= 165%
Rise2=6%
-13.9420.866660.8814.7001.27E-06
4
10/25/2025MT= 165%
-17.9940.825853.3017.6001.45E-06
5
09/22/2025Thickness was low-22.97910.775673.8818.3001.42E-06
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05/21/2025Thickness went up a little, but not by a lot5.8791.066257.2014.9891.60E-06
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04/18/2025Stress and Bow are varied2.4101.0384117.6015.0391.56E-06
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01/28/2025Someone changed Sweep Amp(20%→ 18%) and Freq(1Hz→ 2Hz) for Ti.

Changed master tooling 183% → 165% as well as soak 2 power from 11% → 7%. Also changed soak1 time to 5min and pressure went down to 1.8E-6 torr
-0.34811.007598.0814.6011.47E-06
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01/07/2025Looks Good-14.29240.893919.0815.511.39E-06
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01/05/2025Power in Rise 2 Varied by 7 mA9.14991.129764.5716.671.88E-06
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01/03/2025Higher than average sheet resistance -15.03410.8828161.9718.031.59E-06
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12/18/2024When DekTak-ing I doubled the length which made thickness closer to Ebeam4 measurements-1.66641.018736.4216.53151.68E-06
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12/17/2024Again measured thickness lower than what Ebeam4 says and stress/bow also very low. Also uniformity shield is loose as when I open chamber after process finished shield is very off and not at all aligned as I had left it beforehand-14.34140.890066.2317.37531.55E-06
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12/14/2024Measured thickness much lower than what Ebeam4 measured. Tool would not pump down for second run.-20.28470.8259372.1717.29041.43E-06
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11/25/2024measured thickness was way lower than expected-19.28410.8403124.0517.70911.49E-06
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11/14/2024Used reclaimed wafers from Biljana and left some sort of pattern on wafer that is clearly visible 1.04151.0478n/an/an/a
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