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DAYTIMEIN CLASSROOM (ELINGS 3001)TIMEIN CLEANROOM
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8/189:00 AM - 12:00 PMIndustry Introduction
Cleanroom & Gowning & PPE
Semiconductor Basics part 1: Substrates and Photolithography
Units
Art Wafer and Traveler
Outside Tour - facilities (11:20-noon)		1:00 PM - 5:00 PMGowning practice & Safety Review
Art Wafer Pt. 1: Litho
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8/199:00 AM - 10:00 AM Introduction to Vacuum Systems
Semiconductor Basics part 2: Deposition/Etching		10:00 AM - 12:00 PMArt Wafer Pt. 2: Etch + Strip
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1:00 PM - 2:00 PMPressure sensor explain and process flow2:00 PM - 5:00 PMMake Pressure Sensor Pt. 1
Metal Litho + Evap (+passdown)
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8/209:00 AM - 10:00 AMWafer Handling/Passdown/Automated Travelers/Recording
+Reporting Observations		10:00 AM - 12:00 PMMake Pressure Sensor Pt. 2
Liftoff + µScope Meas
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--1:00 PM - 5:00 PMMake Pressure Sensor Pt. 3
BS Litho: Spin+Exp+Dev
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8/219:00 AM - 10:00 AMMetrology
Pressure Sensor Process Update		10:00 AM - 12:30 PMMake Pressure Sensor Pt. 4
In Nanofab: RIE SiN Etch (2 batches)
In CNSI: PR Strip, KOH Insert
(Travellers needed in classroom after lunch)
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2:00 PM - 3:00 PMUnit Conversion and Rate Calculations / Statistical Process Control (SPC) (Travellers needed in classroom)3:00 PM - 5:00 PMMake Pressure Sensor Pt. 5
Metrology Training (Dektak, Filmetrics, µScope)
KOH (already inserted)
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8/229:00 AM - 10:00 AMElectrostatic Discharge (ESD) / Recap basic process steps: Litho/Dep/Etch10:00 AM - 11:00 AM
11:00 AM - 12:00 PM		Post-KOH Inspection/meas, Cleaving
Demos/Tours:
- 5x CNSI SEM
- 5x CNSI Microfluidics Lab
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2:00 PM - 4:00 PMIndustry Panel / Presentation
Program Evaluation (PaCE Survey)
IEEE Microcredential Quiz		--
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