Adv.PECVD 300nm STD LSNitride2-2020

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2	Date	Film	Recipe	Subs. T	Coat.time	Dep.time	Thickness (Woollam)	Thickness (Wafer Mapping)	JAW EC-400 (Woolam S.E.)		Dep.rate	BHF e.r.	Stress	Avg Stress	Avg+30%	Avg-30%	LPD (Gain4) particle size 0.16-1.6um		Haze, for Gain 4	LPD (Gain2) particle size 2.8-28.0um		Photos	Photos	Comment/Brian Lingg maintenance
3				300°C	min	min	(nm)	(nm)	Index @ 632.8nm	Index @ 1550nm	(nm/min)	(nm/min)	(MPa)				before deposition	after deposition	%	before deposition	after deposition	Surfscan	Opt. Micr.	4"Si wafer, placed in the center of platen,~500um thick

4			LSNitride2			Dep.time	wafer center	25 points(avg.)	Index		Dep.rate		Stress	Avg Stress	Avg+30%	Avg-30%								182
5	12/02/19	Si3N4	STD LSNitride2	300	10	30	239.59	251.24	1.944	1.910	7.99	35.53	-1.14	-11.01	-14.31	-7.70	214	1364	2	26	56	Good	done, OK	Some showerhead pattern ( Not much)
6	01/09/20	Si3N4	STD LSNitride2	300	10	30	247.47	257.64	1.941	1.909	8.25	to do!	-3.67	-11.01	-14.31	-7.70	93	1085	1	76	215	Good	done, OK	Some showerhead pattern ( Not much)
7	02/18/20	Si3N4	STD LSNitride2	300	10	30	244.50	245.52	1.945	1.913	8.15	to do!	-28.21	-11.01	-14.31	-7.70	81	2203	1	35	182	Good	to inspect	Showerhead pattern
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18												Avg.Stress	-11.01
19												Avg+30%	-14.31
20						Avg.Thick.	243.85				8.13	Avg-30%	-7.70
21							Avg. Index		1.943	1.911	8.94
22							Avg+1%		1.963	1.930	7.32
23							Avg-1%		1.924	1.892
24											Av.BHF e.r.	35.53
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