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Test Flow for Heterogeneous Integration of Chiplets
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Chiplet 1
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GDSII to Foundry
------>
Wafer Processing
------>
Probe Test Single/Double Insert
------>
PGD/KGD0
------>
Scrap Parts
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| Parts Pass
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|
Is it package tested on an ATE platform?
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|
What is included in it/covered?
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Assembly / Package
------>
Final Package Test(s)
------>
Retest
------>
Parametric Good Units
------>
No
Scrap Assembled Parts
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|| Yes
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||
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Chiplet 2
| Parts Pass
|
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GDSII to Foundry
------>
Wafer Processing
------>
Probe Test Single/Double Insert
------>
PGD/KGD0
------>
Scrap Parts
| >
- - - - - - - - - - - - - - - - - - - - - - - ->
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| |
|
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| |
|
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System Level Test (SLT)
------>
Burn-in test
------>
QA or Final Test------>Known Good Packaged Parts
------>
No
Scrap Packaged Parts
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| Yes
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|
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|
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Good Parts
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