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Thickness, AIndex @632.8nmThickn. Uniformity, %
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MinMaxMinMaxComment/Mike SIlva
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Datecenter of wafer1cm from edgecenter of wafer1cm from edge
Thickness Uniformity, %
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01-21-202984.702608.841.8521.85493.28Thicker in the center
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02-18-202963.012751.851.8381.83696.31Thicker in the center
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Thicker in the center
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Average:2973.862680.351.8451.84594.79
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Avg.+2%3033.332733.951.8821.882
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Avg.-2%2914.382626.741.8081.808
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Max2984.702751.851.8521.85496.31
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Min2963.012608.841.8381.83693.28
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