7.07 Primaxx Vapor Etch QM
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Primaxx
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Process Specification
Process Performance
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Tool Name:Primaxx
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Description: This monitor tracks the (1) etch rate of Thermal SiO2 and (2) uniformity.
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Etch Recipe:Monitor
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Etch Time [sec]:300
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Targeted Results:
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Etch Rate [A/min]:400
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Uniformity [%]:<5
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Process Conditions:
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Stabilize:Etch:Pump:
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N2 [sccm]:1250N2 [sccm]:1250N2 [sccm]:0
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EtOH [sccm]:350EtOH [sccm]:350EtOH [sccm]:0
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HF [sccm]:0HF [sccm]:310HF [sccm]:0
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Time [sec]: 120Time [sec]: 300Time [sec]: 120
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QM Process Procedure:
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StepToolDescription
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Stock WaferTystar2:10kA Wet Oxide
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FT1Nano Duv:Pre-etch 5 point film thickness
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Ellips1Ellips1 Point Refractive Index
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EtchMonitorSiO2 Vapor Etch
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FT2Nano Duv:Post-etch 5 point film thickness
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