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Ionmill6 Etch Monitor
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Process Specification
Process Performance
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Tool Name:ionmill6
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Description: This monitor tracks the etch rate and uniformity of SiO2 etch in ionmill6
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Recipe:500V (BV) 200mA (BI), Spin 15 RPM, Angle 45°
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Layer Material: 10kA Thermal Oxide on Si
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Time:20 minutes
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Targeted Results:
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TargetDescription
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Thickness [A]:5 point avg using Nanospec
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Non-Uniformity [%]:<5%Calculated using (MAX-MIN) / (MAX+MIN) method on thickness data.
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Consistent Etch Profile5pt MAP on msp300 using 20mm Exclusion
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Forward / Reflected PowerConsistent
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QM Process Procedure:
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StepToolDescription
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Stock Wafer-10kA wet oxide wafer
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Oxide thickness Pre-mill measurementNanospec / Nanoduv
5 point thickness
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Etch OxideIonmill6
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Oxide thickness Post-mill measurementNanospec / Nanoduv
5 point thickness
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 Parameter VS. Etch Rate and Uniformity Investigation
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