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1 | NNCI site | Title of the document | Short description of content | Link | Main Purpose | Second Purpose (optional) | Type of document: Intro/Background, Training, Misc | Playlist / series? | Make / Manufacturer, Model | Media type | How long is the video? (Approximate to total number of minutes) | Licensing/Copyright | ||||||
2 | nano@stanford | edX: Physical Vapor Deposition | Physical vapor deposition (PVD) represents a variety of vacuum deposition techniques that can deposit thin films onto substrates. The material used to form the thin film is often called source material in evaporation, or target in sputtering. The name, physical vapor deposition, indicates that no new chemical bonds are formed at the interface, and the film growth is driven by physisorption. The thickness of PVD films usually range from angstroms to microns. During the PVD process, the use of a high vacuum chamber is essential to achieve high film purity. PVD coatings are widely used in semiconductor devices, solar energy, optics and many other industries. Two main types of PVD, evaporation and sputtering, are introduced here. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/jump_to/block-v1:StanfordOnline+ENGRX0001+1T2020+type@sequential+block@e9ca7776032d4441815fb5f6f3b0e1f3 | Deposition (Metallization) | Intro/Background | yes | n/a | Online course (edX, Coursera, Canvas) | |||||||||
3 | nano@stanford | edX: Chemical Vapor Deposition Overview | Chemical vapor deposition is another important thin film deposition technique and it is prevalent throughout industries. CVD can be defined as a process in which the vapor phase gases chemically react on the substrate surface to form thin films. Reactant gases are also known as “precursors”. During a CVD process, precursors are pumped into a reaction chamber, and the chamber is heated to a desired temperature to allow precursor gases to bond with the substrate surfaces. The occurrence of the chemical reaction is essential during the CVD film growth. One of the products of the reaction will deposit onto the substrate as a thin film and the by-products are pumped out. Due to the chemical bonding, the adhesion between the film and the substrate is much stronger compared to typical PVD films. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/d3fccb4138f64d03a45ef4a77c97c3d1/3173e47dc49747d481f1e6f371f50753/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%403173e47dc49747d481f1e6f371f50753 | Deposition (Metallization) | Intro/Background | yes | n/a | Online course (edX, Coursera, Canvas) | |||||||||
4 | nano@stanford | edX: Atomic Layer Deposition | Atomic Layer Deposition (ALD) is a thin-film deposition technique based on self-limiting surface reactions. Most ALD reactions involve two gas phase chemicals, also known as “precursors”. The precursors react with the substrate surface in a sequential order in the form of non-overlapping pulses. Each cycle should last long enough until all the reactive sites on the surface are consumed. Due to the self-limiting nature of the reactions, ALD is able to grow pinhole-free and conformal thin films. The thickness of the thin films can be controlled by the number of processing cycles, and films at atomic level precision can be achieved. One of the main motivations for ALD is semiconductor devices fabrication. ALD has been used for applications such as high dielectric constant gate oxides in MOSFET, copper diffusion barriers in interconnects, and solid oxide fuel cells. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/bab7a355c5fd4988a072fedca82512ee/8c848ef943d04e0d84421f2f4bb16fe6/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%408c848ef943d04e0d84421f2f4bb16fe6 | Deposition (Metallization) | Intro/Background | yes | n/a | Online course (edX, Coursera, Canvas) | |||||||||
5 | nano@stanford | edX: Introduction to Lithography | This course covers the basic concepts of photolithography, with focus on general information helpful to orient the learner to understand lithography in a lab and/or cleanroom setting. It should be noted that this is not an exhaustive list of processing steps, and each process module is subject to change depending on the specific aims of the project. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/fcc7a069f4bd4294b48cba3e7c4429a3/ad9aa5d945fd4d15b4b784cf64817426/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%40ad9aa5d945fd4d15b4b784cf64817426 | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Intro/Background | yes | n/a | Online course (edX, Coursera, Canvas) | |||||||||
6 | nano@stanford | edX: Introduction of Transmission Electron Microscopy (TEM) | Introduction of Transmission Electron Microscopy (TEM) | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/060b0c34ca4e407eb7fb4d143ba2b90b/0ded6fa72d5146af8361f696f52908e5/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%400ded6fa72d5146af8361f696f52908e5 | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Intro/Background | yes | Titan TEM | Online course (edX, Coursera, Canvas) | |||||||||
7 | nano@stanford | edX: Introduction to Scanning Electron Microscopy | Scanning electron microscopy (SEM) is imaging technique in which an image can be produced by scanning a probe formed of electrons across the surface of a sample. Compared to conventional light microscopy, electrons have much shorter wavelength, enabling much higher resolution images with much larger depth of focus. In the light microscopy and SEM images below, compare the amount of detail and depth of focus (also known as depth of field). The purpose of this web module is to prepare new users to take the hands-on training to operate the FEI Sirion SEM at SNSF. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/060b0c34ca4e407eb7fb4d143ba2b90b/9d8dfed83a6a43eeaab4e0f4ad27d327/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%409d8dfed83a6a43eeaab4e0f4ad27d327 | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Training | yes | Magellan SEM | Online course (edX, Coursera, Canvas) | |||||||||
8 | nano@stanford | edX: Optical Microscopes Overview | General overview of microscopes | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/060b0c34ca4e407eb7fb4d143ba2b90b/e37e6c06de7345bfa7e5b1fb93fa3478/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%40e37e6c06de7345bfa7e5b1fb93fa3478 | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Intro/Background | yes | n/a | Online course (edX, Coursera, Canvas) | |||||||||
9 | nano@stanford | edX: Keyence VK-X Series 3D Laser Scanning Confocal Microscope | The Keyence VK-X Series 3D Laser Scanning Confocal Microscope provides non-contact, nanometer-level profile, roughness, and film thickness data on any material. The lateral resolution of the microscope is 120 nm using the 408 nm violet laser light. The microscope scans the surface using a 16-bit photomultiplier to receive the reflected laser light. The instrument is able to provide highly accurate 3D measurement data over any shape of materials and steep angles (up to 88 degree angle of detection). High-resolution optical images can be acquired with resolutions up to 21.6 million pixels through 3CCD pixel shifting technology. High dynamic range (16-bit resolution color gradation) function automatically recognizes bright and dark areas as well as low contrast areas. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/060b0c34ca4e407eb7fb4d143ba2b90b/6d1e30842d3849c6836a8481dab8e2bb/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%406d1e30842d3849c6836a8481dab8e2bb | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Training | yes | Keyence VK-X Series 3D Laser Scanning Confocal Microscope | Online course (edX, Coursera, Canvas) | |||||||||
10 | Midwest Nanotechnology Infrastructure Corridor (MINIC) | Lab Training | Lab Training | https://training.umn.edu/courses/19326 | Soft & Hybrid Materials (DSC, DLS, GPC, BET, TGA) | Training | n/a | Online course (edX, Coursera, Canvas) | Unlicensed | |||||||||
11 | nano@stanford | edX: Introduction to X-ray Photoelectron Spectroscopy | X-ray photoelectron spectroscopy (XPS) is a surface-sensitive spectroscopic technique that can give quantitative elemental composition information on a wide variety of samples. The purpose of this web module is to prepare new users to take the hands-on training to operate the PHI v1 XPS at SNSF. This is a high-level primer and not an exhaustive course on XPS; for those interested in diving deeper, many texts exist. | https://courses.edx.org/courses/course-v1:StanfordOnline+ENGRX0001+1T2020/courseware/ba13f23503f4456bbbe04f1c81f3b49d/1b5dc95320d1463d812d36af1a729f15/?activate_block_id=block-v1%3AStanfordOnline%2BENGRX0001%2B1T2020%2Btype%40sequential%2Bblock%401b5dc95320d1463d812d36af1a729f15 | X-Ray (XRD, XPS, XCT) | Training | yes | PHI VersaProbe III | Online course (edX, Coursera, Canvas) | |||||||||
12 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | INCA EDS Instructions: S3400, S4800, and QUANTA | http://www.nuance.northwestern.edu/docs/epic-pdf/INCA%20EDS%20Operation%20Instructions.pdf | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Surface Analysis | Training | Inca | PDF / Word Doc | ||||||||||
13 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | EDS With AZtec | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/eds_aztec_3_2020.pdf | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Surface Analysis | Training | AZtec | PDF / Word Doc | ||||||||||
14 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Electron Backscatter Difraction AZtec - Quanta 650F | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/ebsd_3_2020.pdf | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | AZtec | PDF / Word Doc | |||||||||||
15 | nano@stanford | Lesker2 Sputter TiN Initial Development | Our goal was to develop a process for sputtering of NVM-quality TiN using the new Lesker sputtering tool (Lesker-2) that resides inside the cleanroom. This tool can achieve the high-vacuum pressures necessary for TiN films with low levels of oxygen contamination. | https://snfexfab.stanford.edu/snf/nano-nugget/lesker2-sputter-tin-initial-development | Deposition (Metallization) | Training - more specific information focused on a tool and/or processing or recipes for that tool | Training | Lesker 2 | PDF / Word Doc | |||||||||
16 | nano@stanford | SOP for Thin, low temperature ALD of Al2O3 and HfO2 with seed layer | Tips for deposition of very thin, low temperature Al2O3 in the Savannah in the SNF. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-thin-low-temperature-ald-of-al2o3-and-hfo2-with-seed-layer | Deposition (Metallization) | Training - more specific information focused on a tool and/or processing or recipes for that tool | Training | Savannah | PDF / Word Doc | |||||||||
17 | nano@stanford | SOP for Seeded ALD deposition on MoS2 | Standard operating procedures for seed layer aided ALD on 2D materials. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-seeded-ald-deposition-on-mos2 | Deposition (Metallization) | Training | AJA evaporator | PDF / Word Doc | ||||||||||
18 | nano@stanford | SOP for Seeded ALD depositions on MOSCAPS and MIMS structures on Silicon | Process to create electrical test structures using metal-seeded ALD layers on silicon substrates. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-seeded-ald-depositions-on-moscaps-and-mims-structures-on-silicon | Deposition (Metallization) | Training | AJA evaporator | PDF / Word Doc | ||||||||||
19 | nano@stanford | Niobium Deposition and Patterning Runsheet | Processing sequence for deposition and patterning of Niobium in the SNF. | https://snfexfab.stanford.edu/snf/nano-nugget/niobium-deposition-and-patterning-runsheet | Deposition (Metallization) | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Lesker Sputter, Plasma Therm Versaline LL ICP Dielectric Etcher, Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL) | PDF / Word Doc | |||||||||
20 | nano@stanford | Standard Operating Procedure for MOCVD aix-ccs | This document describes things you need to check before operating the Stanford MOCVD aix-ccs tool for safety and correct operation. | https://snfexfab.stanford.edu/snf/nano-nugget/standard-operating-procedure-for-mocvd-aix-ccs | Deposition (Metallization) | Training | Aix-ccs | PDF / Word Doc | ||||||||||
21 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | E-beam Evaporator – AJA | AJA E-beam evaporator is for metal deposition on silicon wafers or other compatible substrates. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/E-beam_Evaporator_AJA-17wwc8c.pdf | Deposition (Metallization) | Training | AJA evaporator | PDF / Word Doc | ||||||||||
22 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Sputter I – AJA Orion Sputter | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Sputter-I-AJA-Orion-Sputter_2-20-19-u909bv.pdf | Deposition (Metallization) | Training | AJA Orion Sputter | PDF / Word Doc | |||||||||||
23 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Sputter II – AJA Orion Sputter | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/sputter-II-2-20-19-1aw7hnb.pdf | Deposition (Metallization) | Training | AJA Orion Sputter | PDF / Word Doc | |||||||||||
24 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Thermal Evaporator – Denton Vacuum Explorer 14 | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Thermal_Evaporator_Denton_Vacuum_Explorer14-rflz6g.pdf | Deposition (Metallization) | Training | Denton Vacuum Explorer 14 | PDF / Word Doc | |||||||||||
25 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | KJLC Nano38 Thermal Evaporator | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/leskermanual_9_2019.pdf | Deposition (Metallization) | Training | KJLC Nano38 | PDF / Word Doc | |||||||||||
26 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Atomic Layer Deposition – Arradiance GEMStar XT-P | The Arradiance ALD XT-P is full-featured ALD system capable of depositing a wide range of materials conformally over flat and patterned substrates and micro-particles (powders). Both metals and dielectrics can be deposited and multi-material coatings can be produced as well. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2018/06/ALD_GEMStar-06072018-21e1bql.pdf | Deposition (Metallization) | Training | Arradiance GEMStar XT-P | PDF / Word Doc | ||||||||||
27 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Parylene Deposition System – SCS PDS 2010 LABCOTER2 | It is a vacuum deposition system. Parylene is deposited at about 35 mT from the vapor phase and hence the coating is conformal. Samples of any shape or form get coated all around. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/SCS-PDS-2010-LABCOTER2-Parylene-Deposition-System-2-19-19-uhpd31.pdf | Deposition (Metallization) | Training | SCS PDS 2010 LABCOTER2 | PDF / Word Doc | ||||||||||
28 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Plasma Enhanced Chemical Vapor Deposition (PECVD) – STS LpX CVD | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/PECVD_STS_LpX_CVD_10212015-1ngr410.pdf | Deposition (Metallization) | Training | STS LpX CVD | PDF / Word Doc | |||||||||||
29 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Rapid Thermal Processor – AW-610 | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Thermal_Processor_AW-610_Rapid_Thermal-Processor_Allwin21Corp-18331j1.pdf | Deposition (Metallization) | Training | AW-610 | PDF / Word Doc | |||||||||||
30 | nano@stanford | SOP- Fabrication of an Etched Silicon Platform with Applications in Uniform Dissection of Biological Samples | This document contains standard operating procedures (SOPs) for the following processes: 1.Fabrication of oxide hard mask for deep silicon etching. 2.Tapered etch method for blade formation using PT-DSE 3.Through-hole etching using PT-DSE | https://snfexfab.stanford.edu/snf/nano-nugget/sop-fabrication-of-etched-silicon-platform-with-applications-in-uniform-dissection-of-biological | Etching (Wet & Dry) | Training - more specific information focused on a tool and/or processing or recipes for that tool | Training | PlasmaTherm CCP-DEP PECVD, Heidelberg, PT-DSE | PDF / Word Doc | |||||||||
31 | nano@stanford | SOP for Metal Assisted Chemical Etching (MACE) | Procedures for doing MACE etching to make tall pillars in silicon. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-metal-assisted-chemical-etching-mace | Etching (Wet & Dry) | Training | AJA evaporator | PDF / Word Doc | ||||||||||
32 | nano@stanford | SOP for Making Vertical Nanostructures with Various Shapes | A two stage etching procedure can be used to fabricate various vertical nanostructures for bio-relatedexperiments. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-making-vertical-nanostructures-with-various-shapes | Etching (Wet & Dry) | Training | Heidelberg MLA 150, Plasma Therm Versaline LL ICP Dielectric Etcher | PDF / Word Doc | ||||||||||
33 | nano@stanford | SOP- Silicon Oxide Hardmask for Si Etching in PT-DSE | Step-by-step procedures and processing tips for fabrication of an SiOx hardmask for deep silicon etch in the SNF. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-silicon-oxide-hardmask-for-si-etching-in-pt-dse | Etching (Wet & Dry) | Training | PlasmaTherm Shuttlelock PECVD System, Plasma Therm Versaline LL ICP Deep Silicon Etcher | PDF / Word Doc | ||||||||||
34 | nano@stanford | Standard Operating Procedures for TMD exfoliation, etching, and transfer | The standard operating procedures for 1. Optimal TMD exfoliation on SiO2 substrate, 2. Etching of TMD flakes, 3. Transfer from TMD flakes from SiO2 substrate to a metallic substrate are explained in details. | https://snfexfab.stanford.edu/snf/nano-nugget/standard-operating-procedures-for-tmd-exfoliation-etching-and-transfer | Etching (Wet & Dry) | Training | PDF / Word Doc | |||||||||||
35 | nano@stanford | Addressing Grassing and Overetch in SiO2 Hardmask | Troubleshooting tips for roughened surfaces after etch (also called grassing or line edge roughness). | https://snfexfab.stanford.edu/snf/nano-nugget/addressing-grassing-and-overetch-in-sio2-hardmask | Etching (Wet & Dry) | Training | Oxford III-V etcher, Oxford Dielectric Etcher | PDF / Word Doc | ||||||||||
36 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Plasma Cleaner – Samco PC-300 | Samco PC300 plasma cleaner has a parallel-plate configuration that can be used in both plasma etching (PE) mode as well as reactive ion etching (RIE) mode for isotropic and anisotropic etching respectively. It can be used for stripping photoresist, descumming, ashing, and surface cleaning or modification for substrate and wire bonding applications. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2018/11/Samco_Plasma_Cleaner_SOP-2of0sse.pdf | Etching (Wet & Dry) | Training | Samco PC-300 | PDF / Word Doc | ||||||||||
37 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Deep Reactive Ion Etcher (DRIE) – STS LpX Pegasus | STS LpX Pegasus is used for deep reactive ion etching of silicon | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/DRIE_STS_LpX_Pegasus-u6mdjg.pdf | Etching (Wet & Dry) | Training | Deep Reactive Ion Etcher (DRIE) – STS LpX Pegasus | PDF / Word Doc | ||||||||||
38 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Reactive Ion Etcher (RIE) – Samco RIE-10NR | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Reactive_Ion_EtcherRIE_SamcoRIE-10NR_0-oiq93i.pdf | Etching (Wet & Dry) | Training | Samco RIE-10NR | PDF / Word Doc | |||||||||||
39 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Xenon Difluoride Etcher – Xactix | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Xenon_Difluoride_Etcher_Xactix-1okys7e.pdf | Etching (Wet & Dry) | Training | Xactix | PDF / Word Doc | |||||||||||
40 | nano@stanford | Self-Assembly Schemes for the Fabrication of Inverse Opals | The nanoscribe can be used to create template structures for particle self assembly, and details about inverse opal BCC and FCC structures are described. | https://snfexfab.stanford.edu/snf/nano-nugget/self-assembly-schemes-for-fabrication-of-inverse-opals | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training - more specific information focused on a tool and/or processing or recipes for that tool | Training | Nanoscribe | PDF / Word Doc | |||||||||
41 | nano@stanford | Improving adhesion and preventing collapsing of Nanoscribe resist IP-Dip | An improved substrate pretreatment protocol is therefore developed that results in better adhesion. | https://snfexfab.stanford.edu/snf/nano-nugget/improving-adhesion-and-preventing-collapsing-of-nanoscribe-resist-ip-dip | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training - more specific information focused on a tool and/or processing or recipes for that tool | Training | PDF / Word Doc | ||||||||||
42 | nano@stanford | SOP for Bioprinting on Nanostructures | A guide to using a new PLPP gel protocol developed by Alveole | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-bioprinting-on-nanostructures | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training - more specific information focused on a tool and/or processing or recipes for that tool | Training | Primo Alveole | PDF / Word Doc | ||||||||
43 | nano@stanford | SOP for patterning Si wafers on heidelberg2 | Some processing details for printing patterns for silicon nanowire fabrication. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-patterning-si-wafers-on-heidelberg2 | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Heidelberg | PDF / Word Doc | ||||||||||
44 | nano@stanford | SOP for Nano Imprint Lithography | Procedures for doing NIL in preparation for MACE etching. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-nano-imprint-lithography | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | PDF / Word Doc | |||||||||||
45 | nano@stanford | SOP for positive photoresist on Nanoscribe | SOP for using SPR-220 and AZ4620 positive photoresists on Nanoscribe using the oil immersion mode. | https://snfexfab.stanford.edu/snf/nano-nugget/sop-for-positive-photoresist-on-nanoscribe | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Nanoscribe | PDF / Word Doc | ||||||||||
46 | nano@stanford | Patterning SPR220 on Reflective Materials with Nanoscribe | Patterning SPR220 on Reflective Materials with Nanoscribe | https://snfexfab.stanford.edu/snf/nano-nugget/patterning-spr220-on-reflective-materials-with-nanoscribe | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Nanoscribe | PDF / Word Doc | ||||||||||
47 | nano@stanford | Waveguide fabrication with the Heidelberg MLA150 Maskless Aligner Run Sheet | In order to make the lowest loss waveguides, we need to find a combination of dose/defocus and reflow time/temperature that gives us the best resolution and the lowest line edge roughness and line width roughness. | https://snfexfab.stanford.edu/snf/nano-nugget/waveguide-fabrication-with-heidelberg-mla150-maskless-aligner-run-sheet | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | PDF / Word Doc | |||||||||||
48 | nano@stanford | Block Copolymer Directed Self-Assembly Standard Operating Procedure | In this standard operating procedure (SOP), we propose a recipe for DSA with 70:30 PS-b-PMMA. | https://snfexfab.stanford.edu/snf/nano-nugget/block-copolymer-directed-self-assembly-standard-operating-procedure | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Plasma Therm Versaline LL ICP Metal Etcher | PDF / Word Doc | ||||||||||
49 | nano@stanford | Silicon Nitride Nanoscale Stencils for Non-destructive Metal Grating Patterning | A process flow is presented to create periodic metallic gratings on the order of 150 nm using a stencil lithography technique. | https://snfexfab.stanford.edu/snf/nano-nugget/silicon-nitride-nanoscale-stencils-for-non-destructive-metal-grating-patterning | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | PDF / Word Doc | |||||||||||
50 | nano@stanford | Waveguide fabrication with the Heidelberg MLA150 Maskless Aligner | Process flow for optical waveguide creation using Heidelberg. | https://snfexfab.stanford.edu/snf/nano-nugget/waveguide-fabrication-with-heidelberg-mla150-maskless-aligner | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Heidelberg MLA 150 | PDF / Word Doc | ||||||||||
51 | nano@stanford | Basics of Block Copolymer Directed Self Assembly | Block copolymer Directed Self Assembly (DSA) is a technique used to create high resolution structures without advanced lithography techniques. | https://snfexfab.stanford.edu/snf/nano-nugget/basics-of-block-copolymer-directed-self-assembly | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | PDF / Word Doc | |||||||||||
52 | nano@stanford | Getting Started with Custom Inks on the Voltera | Watch E241 students load and print custom ink with the Voltera. | https://snfexfab.stanford.edu/snf/nano-nugget/getting-started-with-custom-inks-on-voltera | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Voltera | PDF / Word Doc | ||||||||||
53 | nano@stanford | Stanford Nanoscribe Operating Procedure | This is the operating procedue written by our researchers for use of our Nanoscribe. | https://snfexfab.stanford.edu/snf/nano-nugget/stanford-nanoscribe-operating-procedure | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Nanoscribe | PDF / Word Doc | ||||||||||
54 | nano@stanford | Basics of Block Copolymer Directed Self Assembly | Block copolymer Directed Self Assembly (DSA) is a technique used to create high resolution structures without advanced lithography techniques. | https://snfexfab.stanford.edu/snf/nano-nugget/basics-of-block-copolymer-directed-self-assembly | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | PDF / Word Doc | |||||||||||
55 | nano@stanford | Helpful hints for grayscale lithography on the Heidelberg MLA 150 | When using grayscale lithography on the Heidelberg, there are a few quirks that may slow down your progress. This document provides some warnings and helpful tricks to overcome the common roadblocks. | https://snfexfab.stanford.edu/snf/nano-nugget/helpful-hints-for-grayscale-lithography-on-heidelberg-mla-150 | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Heidelberg MLA 150 | PDF / Word Doc | ||||||||||
56 | nano@stanford | A Study of Analytical and Empirical Resist Reflow in the Literature | A summary of the main findings in the literature regarding resist reflow. | https://snfexfab.stanford.edu/snf/nano-nugget/study-of-analytical-and-empirical-resist-reflow-in-literature | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | PDF / Word Doc | |||||||||||
57 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Mask Aligner – Karl Suss MABA6 | Contact photolithography | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Aligner_SussMABA6_Mask_Aligner-1nf9frw.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Karl Suss MABA6 | PDF / Word Doc | ||||||||||
58 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Mask Aligner – Karl Suss MJB4 | Contact photolithography | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Suss-MJB4-Mask-Aligner-1to5thm.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Karl Suss MJB4 | PDF / Word Doc | ||||||||||
59 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Maskless Aligner – Heidelberg MLA150 | Heidelberg MLA150 Maskless Aligner is a full-scale production level laser writer which can be used toperform lithography directly on wafers as well as to create photomasks. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2018/07/MLA150-7-17-18-2ka85rb.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Heidelberg MLA150 | PDF / Word Doc | ||||||||||
60 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Maskless Aligner – Heidelberg uPG501 | The µPG 501 is a tabletop maskless aligner system (Figure 1). It can be used for direct-writing as well as for making photomasks | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/maskless_aligner_10222015-23ndtn9.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Heidelberg uPG501 | PDF / Word Doc | ||||||||||
61 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Ultraviolet Flood Exposure System – Inpro Technologies F300S | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Ultraviolet_Flood_Exposure_System_Inpro_Technologies_F300S-1flclno.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Inpro Technologies F300S | PDF / Word Doc | |||||||||||
62 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Vacuum Oven – YES | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Yes5_Manual-12xsf84.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | YES 5 | PDF / Word Doc | |||||||||||
63 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Convection Ovens – Blue M DCC-146-C-ST350 | Blue-M ovens are for baking photoresist on silicon or quartz/glass wafers only | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/ConvectionOvensBlueMDCC_146_C-ST350-1svrt58.pdf | Lithography/Photolithography (Resist, Exposure, Develop, Oven/Hotplate) | Training | Blue M DCC-146-C-ST350 | PDF / Word Doc | ||||||||||
64 | nano@stanford | How to characterize thin ALD films | Both electrical and physical characterization techniques are explained for characterizing thin ALD films. | https://snfexfab.stanford.edu/snf/nano-nugget/how-to-characterize-thin-ald-films | Metrology (Ellipsometry, Profilometry, film characterization) | Surface Analysis | Training - more specific information focused on a tool and/or processing or recipes for that tool | Intro/Background | PDF / Word Doc | |||||||||
65 | San Diego Nanotechnology Infrastructure (SDNI) | Veeco SPM | Standard Operating Procedure (SOP) and learning materials for Veeco Scanning Probe Microscope / Atomic Force Microscope (SPM/AFM) | - | Metrology (Ellipsometry, Profilometry, film characterization) | Training | Veeco SPM | PDF / Word Doc | ||||||||||
66 | San Diego Nanotechnology Infrastructure (SDNI) | Filmetrics Profilm3D SOP | Standard Operating Procedure (SOP) and learning materials for Filmetrics Profilm3D intermetric profiler system | - | Metrology (Ellipsometry, Profilometry, film characterization) | Training | Filmetrics Profilm3D | PDF / Word Doc | ||||||||||
67 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Zygo 3D Optical Profiler | Nexview 3D optical surface profiler excels at measuring all surfaces – from supersmooth to very rough, with sub-nanometer precision, independent of field of view. Measurement types include flatness, roughness, large steps and segments, thin films, and steep slopes, with feature heights ranging from < 1 nm up to 20000 µm. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/3D_Optical_ProfilerZygo-1bcm1fu.pdf | Metrology (Ellipsometry, Profilometry, film characterization) | Training | Zygo 3D Optical Profiler | PDF / Word Doc | ||||||||||
68 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Contact Angle Measurement – VCA Optima XE | The VCA Optima Contact Angle Measurement system (Figure 1) incorporates lightweight design, easy assembly, and the latest Windows standards and user‐friendly software to create a contact angle instrument that is accurate and easy to use. VCA‐optima is suitable for research or quality control in R&D and process engineering. The system integrates contact angle and surface energy evaluation with computer imaging technology to create an easy to use tool that provides accurate, objective results. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Contact_Angle_Measurement_VCAOptima_XE-2fpdf32.pdf | Metrology (Ellipsometry, Profilometry, film characterization) | Training | VCA Optima XE | PDF / Word Doc | ||||||||||
69 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Reflectometer – Filmetrics F20 | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Reflectometer_Filmetrics_F20-1yihl3t.pdf | Metrology (Ellipsometry, Profilometry, film characterization) | Training | Filmetrics F20 | PDF / Word Doc | |||||||||||
70 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Spectroscopic Ellipsometer – J.A. Woollam alpha-SE | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2018/05/Ellipsometer_sop-V2_0405-nb-1966x6j.pdf | Metrology (Ellipsometry, Profilometry, film characterization) | Training | J.A. Woollam alpha-SE | PDF / Word Doc | |||||||||||
71 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Stylus Profilometer – Veeco Dektak-8 | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Stylus_Profilometer_Veeco_Dektak-8-1sfjb5o.pdf | Metrology (Ellipsometry, Profilometry, film characterization) | Training | Veeco Dektak-8 | PDF / Word Doc | |||||||||||
72 | nano@stanford | Tips- Using Keyence for X-sectional Imaging | Tips for using the Keyence to image cross sections of wafer pieces. This can be used as a quick check before X-SEM. | https://snfexfab.stanford.edu/snf/nano-nugget/tips-using-keyence-for-x-sectional-imaging | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Training | Keyence Digital Microscope VHX-6000 | PDF / Word Doc | ||||||||||
73 | nano@stanford | Cross-sectional Characterization of Transferred DSA Holes using Focus Ion Beam | Here, we describe our strategy for inspecting the cross-section of features transferred from the BCP into an underlying hard material (e.g. SiO2, Si). | https://snfexfab.stanford.edu/snf/nano-nugget/cross-sectional-characterization-of-transferred-dsa-holes-using-focus-ion-beam | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Training | Heidelberg MLA 150 | PDF / Word Doc | ||||||||||
74 | San Diego Nanotechnology Infrastructure (SDNI) | FEI Apreo SEM SOP | Standard Operating Procedure (SOP) and learning materials for FEI Apreo Scanning Electron Micrscope (SEM) | - | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Metrology (Ellipsometry, Profilometry, film characterization) | Training | FEI Apreo | PDF / Word Doc | |||||||||
75 | San Diego Nanotechnology Infrastructure (SDNI) | FEI Quanta SEM SOP | Standard Operating Procedure (SOP) and learning materials for FEI Quanta Scanning Electron Micrscope (SEM) | - | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Metrology (Ellipsometry, Profilometry, film characterization) | Training | FEI Quanta FEG 250 | PDF / Word Doc | |||||||||
76 | San Diego Nanotechnology Infrastructure (SDNI) | Zeiss Sigma SEM SOP | Standard Operating Procedure (SOP) and learning materials for Zeiss Sigma Scanning Electron Micrscope (SEM) | - | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Metrology (Ellipsometry, Profilometry, film characterization) | Training | Zeiss Sigma 500 | PDF / Word Doc | |||||||||
77 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Atomic Force Microscope – Bruker Edge | The Dimension Edge Scanning Probe Microscope (SPM) produces high-resolution, three dimensional images by scanning a sharp tip over the sample surface. The tip is part of a flexible cantilever, which extends from a solid substrate. The tip-cantilever-substrate component is driven by piezo tube and controlled by closed loop driving system, to produce atomic level precision images. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2019/07/SOP-AFM.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Surface Analysis | Training | Bruker Edge | PDF / Word Doc | |||||||||
78 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Microscope – Nikon LV150 | This upright optical microscope is designed for investigating up to 150 mm (6 inch) semiconductor wafers but can also be used for fragments and many other types of samples. It can capture colored images and record high-speed videos. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Microscope_characterization-03072018-nb-2mes07c.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Training | Nikon LV150 | PDF / Word Doc | ||||||||||
79 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | JEOL ARM300F GrandARM TEM | http://www.nuance.northwestern.edu/docs/epic-pdf/JEOL_ARM300F_manual.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | JEOL ARM300F GrandARM TEM | PDF / Word Doc | ||||||||||
80 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | ESEM - Wet SEM Quanta 650F | SEM training SOP | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/esem_3_2020.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | FEI Quanta 650F | PDF / Word Doc | |||||||||
81 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | FEI Quanta 650 ESEM | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/quanta_3_2020.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | FEI Quanta 650 ESM | PDF / Word Doc | ||||||||||
82 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Hitachi S4800-II cFEG | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/hitachi_4800_3_2020.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | Hitachi S4800-II cFEG | PDF / Word Doc | ||||||||||
83 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Hitachi S-3400N-II SEM | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/3400n_3_2020.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | Hitachi S-3400N-II | PDF / Word Doc | ||||||||||
84 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Hitachi SU-8030 FEG SEM | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/hitachi_8030_3_2020.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | Hitachi SU-8030 | PDF / Word Doc | ||||||||||
85 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | JEOL 7900FLV SEM | http://www.nuance.northwestern.edu/docs/epic-pdf/2020_user-manuals/7900_3_2020.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | JEOL 7900FLV | PDF / Word Doc | ||||||||||
86 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Hitachi HD-2300A STEM | http://www.nuance.northwestern.edu/docs/epic-pdf/HD2300_Daily_Operation_Guide_v6.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | Hitachi HD-2300A | PDF / Word Doc | ||||||||||
87 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | JEOL JEM-2100F TEM | http://www.nuance.northwestern.edu/docs/epic-pdf/JEOL_2100F_manual_2017.pdf | Microscopy / Imaging (SEM, TEM, FIB, optical, AFM) | Chemical / Composition Analysis (Raman, FTIR, UV/Vis, EDS, EBSD) | Training | JEOL JEM-2100F | PDF / Word Doc | ||||||||||
88 | nano@stanford | Characterization of TMDs and Contact schemes for Photovoltaic Applications- Standard Operating Procedure | The standard operating procedures for 1. Optimal TMD exfoliation on SiO2 substrate, 2. Etching of TMD flakes, 3. Transfer from TMD flakes from SiO2 substrate to a metallic substrate are explained in details. | https://snfexfab.stanford.edu/snf/nano-nugget/characterization-of-tmds-and-contact-schemes-for-photovoltaic-applications-standard-operating | Miscellaneous | Training | PDF / Word Doc | |||||||||||
89 | nano@stanford | Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications using Flip Chip Bonder: Suggestions and Tips | Here are some getting started tips for use of Pyrex wafers in the SNF lithography and Flip Chip Bonding equipment. | https://snfexfab.stanford.edu/snf/nano-nugget/au-sn-eutectic-chip-bonding-for-high-heat-flux-vapor-chamber-applications-using-flip-chip-bonder | Miscellaneous | Training | Finetech Lambda | PDF / Word Doc | ||||||||||
90 | nano@stanford | White Paper: Introduction to the Green Gap Project: InGaN-GaN Multiple Quantum Wells for Green LEDs on Si | This phenomenon is known as ‘green gap’. This document provides a brief background into the technical challenges that inspired the Green Gap E241 project. | https://snfexfab.stanford.edu/snf/nano-nugget/white-paper-introduction-to-green-gap-project-ingan-gan-multiple-quantum-wells-for-green-leds-on-si | Miscellaneous | Training | Aix-ccs | PDF / Word Doc | ||||||||||
91 | nano@stanford | Finetech Lambda Flipchip Bonder and Process Integration New User Tips | “Tips” or “tricks” on use of the Lambda Flipchip Bonder and the integration with lithography and metallization steps that are used in preparation for bonding. | https://snfexfab.stanford.edu/snf/nano-nugget/finetech-lambda-flipchip-bonder-and-process-integration-new-user-tips | Miscellaneous | Intro/Background | Finetech Lambda | PDF / Word Doc | ||||||||||
92 | San Diego Nanotechnology Infrastructure (SDNI) | UCSD Nano3 Facility Online Manager (FOM) | SOPs for most instrumentation; accessible to users via their user accounts; the SOPs are very instrument specific. | https://nano3fom.eng.ucsd.edu/fom/ | Miscellaneous | Training | PDF / Word Doc | Unlicensed | ||||||||||
93 | San Diego Nanotechnology Infrastructure (SDNI) | Minitech Micromill CNC | Standard Operating Procedure (SOP) and learning materials (fusion 360 software quick start) for Minitech micromill CNC | - | Miscellaneous | Software | Training | Minitech Micromill CNC | PDF / Word Doc | |||||||||
94 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Vacuum Atmospheres Company OMNI-LAB Glovebox System | http://www.vac-atm.com/pdf/tb1965v2-5.pdf | Miscellaneous | Training | Vacuum Atmospheres Company OMNI-LAB | PDF / Word Doc | |||||||||||
95 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Ball Wire Bonder – iBond5000 | The iBond 5000 is a ball bonder for making electrical interconnections between a chip and the package. Ball bonding processes use a combination of heat, pressure, and ultrasonic energy to make a weld at each end of the wire. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2016/02/Wire-bonder-16bjnmx.pdf | Miscellaneous | Training | iBond5000 | PDF / Word Doc | ||||||||||
96 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Laser Cutter – LPKF ProtoLaser R | LPKF Protolaser R is a full-scale production level CNC laser cutter which can be used to cut or ablate materials such as PCBs, Si wafers, glass, metals and polymers such as PDMS and Polyimide. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/ProtoLaser-R_SOP_v2-rh7ic3.pdf | Miscellaneous | Training | LPKF ProtoLaser R | PDF / Word Doc | ||||||||||
97 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Wedge Bonder – West Bond 747677E | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2018/05/Wedge-bonder-training-manual_03132018-1qm7owc.pdf | Miscellaneous | Training | West Bond 747677E | PDF / Word Doc | |||||||||||
98 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Electrical Test Station | The electrical test probe station is for semiconductor device characterization and analysis at ambient environment. The Agilent 4155C semiconductor parameter analyzer (SPA) has standard test routines for p-n junctions, CMOS, MOSFET, diodes etc. The Agilent 4285A LCR meter is for CV measurements of dielectric materials and capacitors. | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Electrical-Test-Station-126ni13.pdf | Miscellaneous | Training | Agilent 4155C semiconductor parameter analyzer (SPA), Agilent 4285A LCR meter | PDF / Word Doc | ||||||||||
99 | Texas Nanofabrication Facility (TNF) | Graduate Portfolio Program in Nanomanufacturing | Nanomanufacturing Portfolio Program | https://utexas.app.box.com/s/yi7i4q2ovsq2w9qco3ij5jomghmv1i11 | Miscellaneous | Misc | Course description | PDF / Word Doc | 0 | Copyrighted | ||||||||
100 | Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource | Furnaces – Tystar | Tystar #1 Wet/Dry Oxidation Furnace, Tystar #2 Atmospheric Anneal Furnace Tystar #6 LPCVD, Low- stress Nitride Furnace | https://cpb-us-e1.wpmucdn.com/sites.northwestern.edu/dist/f/666/files/2015/10/Furnace_Tystar-1hj2q7h.pdf | Oxidation and Annealing | Training | Tystar multiple | PDF / Word Doc |