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1 | Checklist for SMT Process | |||||||||||||||||||||||||
2 | Item | Y/N (Check or not) | Process | No. | Question | Criterion | Distribution | Comment (All items must be commented and Evidence) | Check | Note | ||||||||||||||||
3 | SMT Process | Y | Management of SMT material | 1 | Do you check the BGA/IC/PCB vacuum packaging status? | 1. BGA/IC/PCB should income in vacuum packaging (Use ESD prevention wrapping material and band) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Visual check of vacuum packaging status | ||||||||||||||||||
4 | SMT Process | Y | 2 | Does MSL component manage the time based on standards? | Incoming parts after vacuum packaging should check the moisture (store the indicator card and manage history - 24Hr storage) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the indicator card 2. Check at the site (MSL management sheet) | |||||||||||||||||||
5 | SMT Process | Y | 3 | Does it comply with BGA/IC/PCB management standards? | After the production quantity is released, the remaining quantity should be immediately vacuum-packed (material warehouse) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check compliance with standard | |||||||||||||||||||
6 | SMT Process | Y | 2. The unpacked IC shipped from the field should be used within 24 hours (time management by level) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check compliance with standard | |||||||||||||||||||||
7 | SMT Process | Y | 3. If not available within 24 hours - Vacuum packaging and storage within 30 minutes after baking (Refer standard of baking according to MSL level or requirements of maker) *Opened ICs waiting for use are stored in a designated place | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check compliance with standard | |||||||||||||||||||||
8 | SMT Process | Y | 4. The PCB should store on a flat surface | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check compliance with standard | |||||||||||||||||||||
9 | SMT Process | Y | 4 | Is Tray IC managed by Part No.? | Tray IC should use tag for identification Part No It should manage history when repacking the tray (packaging date, time, quantity) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check Identification mark | |||||||||||||||||||
10 | SMT Process | Y | 5 | Do you comply with the warehouse temperature/humidity standards? | 1. Temperature (25±3℃), humidity 30~60% | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check at the site | |||||||||||||||||||
11 | SMT Process | Y | . Check temperature/humidity check sheet (twice a day, day/night) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check at the site | |||||||||||||||||||||
12 | SMT Process | Y | 3. Temperature/humidity upper/lower limit should be managed | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check at the site | |||||||||||||||||||||
13 | SMT Process | Y | 6 | Do you comply with first-in/first-out management when using materials? | 1. It should be managed first-in/first-out | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the material incoming date (shipping company month label) 2. Place materials in a structure that allows first in / first out (recommended) | |||||||||||||||||||
14 | SMT Process | Y | 7 | Do you manage dry chamber temperature/humidity check sheet? | 1. Dry Chamber internal temperature/humidity - Temperature: 25±5℃. Humidity: less than 10% | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of temmometer and hygrometer 2. Check the temperature/humidity check sheet 3. Temperature/humidity can be checked without opening the chamber door 4. Close the door and check if it reaches 10% within an hour | |||||||||||||||||||
15 | SMT Process | Y | Temperature/humidity management by c/sheet : Twice a day (day/night) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of temmometer and hygrometer 2. Check the temperature/humidity check sheet 3. Temperature/humidity can be checked without opening the chamber door 4. Close the door and check if it reaches 10% within an hour | |||||||||||||||||||||
16 | SMT Process | Y | 3. Temperature/humidity upper/lower limit should be managed | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of temmometer and hygrometer 2. Check the temperature/humidity check sheet 3. Temperature/humidity can be checked without opening the chamber door 4. Close the door and check if it reaches 10% within an hour | |||||||||||||||||||||
17 | SMT Process | Y | 4. Temperature/humidity can be checked without opening the equipment door | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of temmometer and hygrometer 2. Check the temperature/humidity check sheet 3. Temperature/humidity can be checked without opening the chamber door 4. Close the door and check if it reaches 10% within an hour | |||||||||||||||||||||
18 | SMT Process | Y | 8 | Do you manage the incoming/outgoing of dry chamber equipment? | In/out and time of equipment internal parts should be managed | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the C/sheet | |||||||||||||||||||
19 | SMT Process | Y | IC Memory | 9 | (Common) Do you have work instructions for each IC? | It should have a Own work instructions based on IC model | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the own work instrucments | ||||||||||||||||||
20 | SMT Process | Y | 10 | (Common) Are you performing sampling inspection of the copied model? | One IC per tray should be inspected (manual inspection) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check at the site | |||||||||||||||||||
21 | SMT Process | Y | 11 | (Auto) Is the loading area of the copied model and the waiting model separated? | The copy-completed model and the waiting model loading area should be separated | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check at the site | |||||||||||||||||||
22 | SMT Process | Y | 12 | (Manual) Is the copy program the latest version? | The program should be the latest version | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the program version | |||||||||||||||||||
23 | SMT Process | Y | 13 | When creating Bin file→ Project, is it compared with the Option (Device Setting) value and the work instructionsl? | It should Match with the work instructions | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the work instructions | |||||||||||||||||||
24 | SMT Process | Y | Solder Paste | 14 | Is the solder paste in/out managed? | 1. Income date / inputed date to refrigerator / Outgoing date to refrigerator / Mixing time / Opened date | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the tag or system management check 1. Visual check, management by incoming date/lot 2. Check the validity period whichbe secured at least 2 months | ||||||||||||||||||
25 | SMT Process | Y | 2. It should be managed from storage to disposal | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the tag or system management check 1. Visual check, management by incoming date/lot 2. Check the validity period whichbe secured at least 2 months | |||||||||||||||||||||
26 | SMT Process | Y | 3. The validity period should be secured at least 2 months at the time of stock | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the tag or system management check 1. Visual check, management by incoming date/lot 2. Check the validity period whichbe secured at least 2 months | |||||||||||||||||||||
27 | SMT Process | Y | 15 | Does it comply with refrigerated storage standards? | 1. Refrigerator temperature: 1~10℃ (Recommended: 5±3℃ management) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of thermometer 2. Check Temperature C/Sheet 3. Check First in/first out 4. Check that High/low temperature solder classification management | |||||||||||||||||||
28 | SMT Process | Y | 2. Temperature Check Sheet twice a day (recorded day/night) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of thermometer 2. Check Temperature C/Sheet 3. Check First in/first out 4. Check that High/low temperature solder classification management | |||||||||||||||||||||
29 | SMT Process | Y | 3. Temperature upper/lower limit should be managed | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of thermometer 2. Check Temperature C/Sheet 3. Check First in/first out 4. Check that High/low temperature solder classification management | |||||||||||||||||||||
30 | SMT Process | Y | 4. It should be managed first-in/first-out | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of thermometer 2. Check Temperature C/Sheet 3. Check First in/first out 4. Check that High/low temperature solder classification management | |||||||||||||||||||||
31 | SMT Process | Y | 5. high/low temperature solders should Separate and be managed | ○ : Compliance, ▲ : Middle, X : Non-Compliance | 1. Check the calibration of thermometer 2. Check Temperature C/Sheet 3. Check First in/first out 4. Check that High/low temperature solder classification management | |||||||||||||||||||||
32 | SMT Process | Y | 16 | Does the Solder Paste mix in machine? | RPM management of mix machine ①400 RPM : 150 sec ②1,000 RPM : 45 sec | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check at the site (manual or system) | |||||||||||||||||||
33 | SMT Process | Y | 17 | Do you comply with the conditions of use of Solder Paste? | 1. Storage in room temperature : 2 ~ 12 hour (2Hour ↓ : Can't be used, 2~12Hour Not opened solder : Re-refrigerated, 12Hour ↑ : Disposal) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the standards | |||||||||||||||||||
34 | SMT Process | Y | 2. Remained solder after opening : Use within 12 hour (12Hour ↓ : Re-refrigerated after sealing, 12Hour ↑ : Disposal) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the standards | |||||||||||||||||||||
35 | SMT Process | Y | 3. Input to the screen printer : Use within 4 hour (4Hour ↑ : Disposal) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the standards | |||||||||||||||||||||
36 | SMT Process | Y | 4. Printed solder on PCB : Input SMT line within 2 hour (2Hour ↑ : Re-print after cleaning) | ○ : Compliance, ▲ : Middle, X : Non-Compliance | Check the standards | |||||||||||||||||||||
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