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Wangling Product Summary1
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Email:
kico@hfpcbpro.com
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Teflon glass fiber cloth copper clad laminate series F4B-1/2: This product is the first generation of Wangling Teflon glass fiber cloth substrate. It was developed in the early 1980s and meets the requirements of high-frequency substrate standards at that time. In order to improve the material performance and stability, our company recommends F4BM and F4BME series products.
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PTFE glass fiber cloth copper clad plate series F4BM, F4BME:
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Product FeaturesCompositionModelDk(εr) @10GDftgδ @10GTcDk (ppm/ºC)Density (g/cm³)Peel Strength
(1OZ)N/mm
Coefficient of thermal expansion ppm/ºCVolume resistivity Mohm.cmSurface resistance MohmWater absorption (%)Thermal conductivity W/m/°kPIMdBcLong-term service temperatureFlammability UL Rating
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Typical ValueXYZ
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DK2.17 3.0 optional, DF0.001 0.0018
F4BME with RTF copper foil has excellent PIM index
Rich thickness.
Diversified size and cost saving
Commercialization, mass production and high cost performance
PTFE/glass fiber cloth
ED copper foil
F4BM2172.17±0.040.0010 -1502.17 1.825 34 240 6×1061×1060.080.24 N/A-55260UL 94-V0
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F4BM2202.20±0.040.0010 -1422.18 1.825 34 240 6×1061×1060.080.24 N/A-55260UL 94-V0
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F4BM2332.33±0.040.0011 -1302.20 1.822 30 205 6×1061×1060.080.28 N/A-55260UL 94-V0
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F4BM2452.45±0.050.0012 -1202.22 1.820 25 187 6×1061×1060.080.30 N/A-55260UL 94-V0
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F4BM2552.55±0.050.0013 -1102.25 1.816 21 173 6×1061×1060.080.33 N/A-55260UL 94-V0
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F4BM2652.65±0.050.0014 -1002.25 1.814 17 142 6×1061×1060.080.36 N/A-55260UL 94-V0
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F4BM2752.75±0.050.0015 -922.28 1.814 16 112 6×1061×1060.080.38 N/A-55260UL 94-V0
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F4BM2942.94±0.060.0017 -852.29 1.812 15 98 6×1061×1060.080.41 N/A-55260UL 94-V0
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F4BM3003.00±0.060.0018 -802.29 1.812 15 95 6×1061×1060.080.42 N/A-55260UL 94-V0
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PTFE/glass fiber cloth RTF copper foilF4BME2172.17±0.040.0010 -1502.17 1.625 34 240 6×1061×1060.080.24 N/A-55260UL 94-V0
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F4BME2202.20±0.040.0010 -1422.18 1.625 34 240 6×1061×1060.080.24 N/A-55260UL 94-V0
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F4BME2332.33±0.040.0011 -1302.20 1.622 30 205 6×1061×1060.080.28 N/A-55260UL 94-V0
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F4BME2452.45±0.050.0012 -1202.22 1.620 25 187 6×1061×1060.080.30 -159-55260UL 94-V0
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F4BME2552.55±0.050.0013 -1102.25 1.616 21 173 6×1061×1060.080.33 -159-55260UL 94-V0
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F4BME2652.65±0.050.0015 -1002.25 1.614 17 142 6×1061×1060.080.36 -159-55260UL 94-V0
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F4BME2752.75±0.050.0015 -922.28 1.614 16 112 6×1061×1060.080.38 -159-55260UL 94-V0
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F4BME2942.94±0.060.0017 -852.29 1.612 15 98 6×1061×1060.080.41 -159-55260UL 94-V0
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F4BME3003.00±0.060.0018 -802.29 1.612 15 95 6×1061×1060.080.42 -159-55260UL 94-V0
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PTFE glass fiber cloth ceramic filled copper clad laminate series F4BTM, F4BTME:
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Product FeaturesCompositionModelDk(εr)@10GDftgδ @10GTcDk (ppm/ºC)Density (g/cm³)Peel Strength
(1OZ)N/mm
Coefficient of thermal expansion ppm/ºCVolume Resistivity Mohm.cmSurface Resistance MohmWater Absorption (%)Thermal Conductivity W/m/°kPIMdBcLong-term service temperatureFlammability UL Rating
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Typical ValueXYZ
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DK2.98 3.5 optional, DF0.0018 0.0025
F4BTME with RTF copper foil has excellent PIM index
Rich thickness
Diversified size, Cost saving
Commercialization, mass production and high cost performance
PTFE/glass fiber cloth
ED copper foil
F4BTM2982.98±0.060.0018 -782.25 1.615 16 78 1×1071×1060.050.42 N/A-55260UL 94-V0
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F4BTM3003.00±0.060.0018 -752.25 1.615 16 72 1×1071×1060.050.42 N/A-55260UL 94-V0
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F4BTM3203.20±0.060.0020 -752.20 1.613 15 58 1×1071×1060.050.50 N/A-55260UL 94-V0
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F4BTM3503.50±0.070.0025 -602.20 1.610 12 51 1×1071×1060.050.54 N/A-55260UL 94-V0
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PTFE/glass fiber cloth RTF copper foilF4BTME2982.98±0.060.0018 -782.25 1.415 16 78 1×1071×1060.050.42 -160-55260UL 94-V0
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F4BTME3003.00±0.060.0018 -752.25 1.415 16 72 1×1071×1060.050.42 -160-55260UL 94-V0
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F4BTME3203.20±0.060.0020 -752.20 1.413 15 58 1×1071×1060.050.50 -160-55260UL 94-V0
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F4BTME3503.50±0.070.0025 -602.20 1.410 12 51 1×1071×1060.050.54 -160-55260UL 94-V0
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Composite dielectric substrate series TP, TF:
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Product FeaturesCompositionModelDk(εr)@5GDftgδ @5GTcDk ppm/ºCDensity (g/cm³)Peel Strength
(1OZ)N/mm
Coefficient of thermal expansion ppm/ºCVolume resistivity Mohm.cm Surface resistance MohmWater absorption (%)Thermal Conductivity W/m/°kPIMdBcLong-term service temperatureFlammability UL Rating
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Typical ValueXYZ
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DK3.0 25 optional, DK customizable
Ultra-low loss
High reliability, low temperature resistance
Low temperature drift
Radiation resistance, low exhaust
relatively easy to process, Easy to form
Rich in thickness
Ideal material for Beidou, missile-borne, fuze and miniaturized antenna
Polyphenylene ether/ceramic
ED copper foil (molding process)
TP3003.00±0.060.0010 -501.69 0.660 60 70 1×1091×1070.010.40 N/A-100150N/A
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TP4404.40±0.090.0010 -461.89 0.660 60 70 1×1091×1070.010.44 N/A-100150N/A
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TP6006.00±0.120.0010 -412.10 0.650 50 60 1×1091×1070.010.55 N/A-100150N/A
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TP6156.15±0.120.0010 -412.12 0.650 50 60 1×1091×1070.010.55 N/A-100150N/A
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TP9609.60±0.200.0012 -432.26 0.640 40 55 1×1091×1070.010.65 N/A-100150N/A
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TP102010.2±0.200.0012 -442.33 0.640 40 55 1×1091×1070.010.67 N/A-100150N/A
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TP110011.0±0.220.0012 -442.40 0.640 40 55 1×1091×1070.010.70 N/A-100150N/A
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TP160016.0±0.320.0012 -432.76 0.635 35 45 1×1091×1070.010.80 N/A-100150N/A
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TP200020.0±0.400.0020 -552.73 0.630 30 40 1×1091×1070.010.85 N/A-100150N/A
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TP220022.0±0.440.0022 -552.77 0.630 30 40 1×1091×1070.010.90 N/A-100150N/A
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TP250025.0±0.500.0025 -552.94 0.630 30 40 1×1091×1070.011.00 N/A-100150N/A
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DK3.0 16 optional
Ultra-low loss value
High reliability and wide use temperature
PTFE/ceramic
ED copper foil (molding process)
TF3003.00±0.060.0010 -602.41 0.660 60 80 1×1071×1050.050.30 N/A-80260N/A
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TF4404.40±0.090.0010 -602.58 0.660 60 80 1×1071×1050.050.32 N/A-80260N/A
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TF6006.00±0.120.0010 -2102.78 0.660 60 80 1×1071×1050.050.45 N/A-80260N/A
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TF9609.60±0.200.0012 -2603.02 0.650 50 65 1×1071×1050.050.68 N/A-80260N/A
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TF102010.2±0.200.0012 -2553.07 0.650 50 65 1×1071×1050.050.70 N/A-80260N/A
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TF160016.0±0.320.0014 -2053.27 0.640 40 55 1×1071×1050.050.75 N/A-80260N/A
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