| A | B | C | D | E | F | G | H | I | J | K | L | M | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1 | SiO2 LDR 250C | |||||||||||||
2 | Category name | SiO2 LDR - Std. | ||||||||||||
3 | Sequence name | SiO2 LDR250C | ||||||||||||
4 | Purpose | Argon Surface Prep | Deposition | Post Deposition | ||||||||||
5 | Sub Sequence name | Pre dep 250C-SEQUENCE | Post Dep PD-Purge-SEQUENCE | |||||||||||
6 | Process step name | Pre Dep 250C Pumpdown | Pre Dep 250C O2Ar Gas Stab | Pre Dep 250C O2Ar Ignition | Pre Dep 250C O2Ar Plasma | Pre Dep 250C Pumpdown | SiO2 LDR 250C Gas Stab | SiO2 LDR 250C Ignition | SiO2 LDR 250C Dep | Post Process Flush | Post Process Pumpdown | |||
7 | Parameters | |||||||||||||
8 | Process time (sec) | 30 | 15 | 3 | 90 | 30 | 30 | 3 | As required | 30 | 30 | |||
9 | Pressure (mTorr) | 0 | 5 | 5 | 5 | 0 | 5 | 5 | 5 | 10 | 0 | |||
10 | Temperature2 (deg C) | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | |||
11 | HeliumCoolerPressureSetpoint(mTorr) | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 | |||
12 | RF1 Forward Power (W) | 0 | 0 | 130 | 0 | 0 | 0 | 150 | 15 | 0 | 0 | |||
13 | RF2 Forward Power (W) | 0 | 0 | 600 | 600 | 0 | 0 | 800 | 800 | 0 | 0 | |||
14 | SiH4 100% (sccm) | 0 | 0 | 0 | 0 | 0 | 5 | 5 | 5 | 0 | 0 | |||
15 | N2 500 (sccm) | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 100 | 0 | |||
16 | AR 100 (sccm) | 0 | 50 | 50 | 50 | 0 | 0 | 0 | 0 | 0 | 0 | |||
17 | O2 100 (sccm) | 0 | 0 | 0 | 0 | 0 | 15 | 15 | 15 | 0 | 0 | |||
18 | N2 20 (sccm) | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |||
19 | ↑ This is the Ar preclean step. Apparently some users changed this to O2 or Ar/O2? Would prefer for this to be an O2 step, not Ar. | ↑ This is the main Dep step, set the TIME appropriately, do not change any other parameters. | ||||||||||||
20 | ||||||||||||||
21 | ||||||||||||||