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FilmRecipeSubs.TThicknessDep.timeJAW EC-400 (Woolam Spec. Ell.)Dep.rateStressBHF etch rate waferLPD (Gain4) particle size (0.16-1.6)umLPD (Gain2) particle size (2.8-28.0)umPhotosPhotos Comments/Brian Lingg PM
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Maintenance
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1/1/2017SiO2SiO2_10250° C (Å)secIndex @ 632.8nmIndex @ 1550nm ( nm/min)(MPa) ( nm/min)Before DepositionAfter DepositionBefore DepositionAfter DepositionSurfscanOptical microscopeDeposition done on 4"Si wafer
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IndexDep.rateStressDropbox/Biljana/Photos/2017/Particles/PECVD#1Biljana/Gmail accountReplaced the Silane and Ammonia MFCs-Avg-2017
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08-07-17SiO2SiO2_302503156.11439.01.4601.44943.14-357.19678.244122no datano datano particlesno photosBHF=30sec
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08-22-17SiO2SiO2_302503161.86439.01.4601.44943.21-369.31681.56293014776no particlesDF-no big particlesa lot of small particles, BHF=30sec
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09-05-17SiO2SiO2_302503159.29439.01.4641.45343.18-420.00695.4925135695no particlesDF-no big particlessome small particles, BHF=20sec
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10-23-17SiO2SiO2_302503204.68439.01.4601.44943.80-363.14589.651213402094no particlesDF-no big particlesBHF=30sec, almost all etched in 30sec
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11-15-17SiO2SiO2_302503130.34439.01.4611.45042.78-374.39803.3023681828no particlesDF-no big particlesvery nice, uniform film, 15sec BHF
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12-01-17SiO2SiO2_302503197.95439.01.4711.46043.71-374.39911.421402642058no particlesDF-no big particles15sec BHF
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Avg.Thickness3168.37Avg Index1.4631.452
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Index+1%1.4771.466
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Index-1%1.4481.437
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Avg Dep.Rate
43.30
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Avg +10%47.63
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Avg - 10%38.97
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Avg. Stress-376.40
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Avg +30%-489.32
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Avg - 30%-263.48
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Avg. HF e.r.726.61
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