All Papertech Products - Indonesia
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Last Revised:11/8/2018
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Technical Specification
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GradeBasis Wt.ThicknessPly-BondRing CrushBursting
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Gr/m2MicronsFt.lb - J/m2KgfKpa
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Chip board230 - 525325 - 750120 - 25245 - 85400 - 650
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Super chip board230 - 525325 - 750170 - 35747 - 87450 - 700
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Core board B230 - 525325 - 750200 - 42050 - 100475 - 750
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Core board B+230 - 525325 - 750225 - 47352 - 102500 - 800
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Core board A30260 - 525340 - 700250 - 52565 - 120525 - 850
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Core board A31260 - 525340 - 700300 - 63070 - 125550 - 925
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Core board A32260 - 525340 - 700350 - 73580 - 135575 - 950
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Core board A42260 - 500340 - 650405 - 85085 - 140600 - 975
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Core board A51260 - 500340 - 650475 - 100090 - 145625 - 1000
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PTK - 1350 - 450470 - 630125 - 26375 - 115575 - 700
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PTK - 2350 - 450470 - 630150 - 31580 - 120625 - 800
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PTK - 3350 - 450470 - 630200 - 420100 - 130725 - 850
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PTK - 3350 - 450470 - 630225 - 473125 - 160775 - 900
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PTK - 4350 - 450470 - 630275 - 578130 - 170800 - 950
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PTK - 5350 - 450470 - 630325 - 683135 - 175850 - 1000
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Cobb 60 sec. to customer request
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SPECIFICATION AND PACKAGING
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Moisture7 +/- 1%
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Basis Wt.± 4 %Roll Diameter1000 - 1500 mm
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Thickness± 4 %Minimum Trim Accepted2200 mm
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Ply-bond± 10 %Ancho Mínimo Aceptado
Minimum Trim Accepted
90 mm
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Packaging wrappedPalletized, Strapped and FilmMin. Coil Width
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Packaging: Palletized, Strapped and film Wrapped
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