1.9 Stocked Wafers.xlsx

	A	B	C	D	E	F	G	H	I	J	K	L	M	N	O	P
1	UC Berkeley Marvell NanoLab Wafer Specs
2	NL Sku	Size	Desc	Type	Orientation	Resistivity	Grade	Thickness	Finish:	Flats	surface roughness	contamination / particles	S/D "scratch dig"	Bow/Warp	TTV	Transmission

3	70255	4	P-Type Test, virgin Si	P	1-0-0	1-50 ohm cm	Test	475-575 µm	SSP	2 semi std flats
4	70252	4	P-Type Prime, virgin Si	P	1-0-0	10-30 ohm cm	Prime	500-550 µm	SSP	2 semi std flats
5	70251	4	N-Type Prime, virgin Si	N	1-0-0	1-20 ohm cm	Prime	500-550 µm	SSP	2 semi std flats
6	70250	4	P-Type, virgin Si	P	1-0-0	5-10 ohm-cm	Prime	525±25µm	DSP	2 semi flats
7	70384	6	P-Type, virgin Si	P	1-0-0	1-10 ohm-cm	Prime	675±25µm	DSP	1 semi std primary flat
8	70259	6	P-Type Test, virgin Si. Transitioning to NL Specific sequential scribing	P	1-0-0	1-50 ohm cm	Test	600-700 um	SSP	1 semi std primary flat	<5A	>0.3μm: <=20		≤40μm	TTV≤ 10μm
9	70257	6	P-Type Prime, virgin Si. Transitioning to NL Spesific sequential scribing	P/B	1-0-0	10-30 ohm cm	Prime	650-700 µm	SSP	1 semi std primary flat	<2A	>0.3μm: <=20		≤40μm	TTV≤ 10μm
10	70256	6	N-Type Prime, virgin Si	N	1-0-0	10-30 ohm cm	Prime	650-700 µm	SSP	1 semi std primary flat
11	70415	8	P-Type TEST, Virgin Si. Transitioning to SEMI M13 LASERMARK ON BACKSIDE	P/B	1-0-0	1-100 ohm-cm	TEST	725±25μm	SSP	One semi Notch	≤0.5nm	>0.3μm: <=10		≤40μm	TTV≤ 10μm
12	70416	8	P-Type PRIME, Virgin Si - Transitioning to Semi M13 - FRONT SIDE LASER MARK	P/B	1-0-0	10-30 ohm-cm	PRIME	725±25μm	SSP	One semi Notch	≤0.5nm	≤50@0.16μm		≤40μm	TTV≤ 5μm
13	70253	4	Fused Silica				Prime	500±25μm	DSP w/ Bevel	1 semi std primary flat 32.5± 2mm			40/20	≤20μm	≤5μm	JGS2
14	70360	6	Fused Silica				Prime	500±25μm	DSP w/ Bevel	1 semi std primary flat			40/20	≤40µm	≤10µm	JGS2
15	70261	4	BoroFloat				Prime	500±25μm	DSP, rounded edge	1 semi std primary flat, 32.5 ± 2 mm			40/20	≤15µm	≤5µm
16	70348	6	BoroFloat				Prime	500±25μm	DSP w/ Bevel	1 semi std primary flat, 57.5± 2mm			40/20	≤25µm	≤10µm
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18	Note: NanoLab offers wafers with one major flat (SEMI standard) due to the fact that the majority of our automated equipment are set up to accept wafers with single flat, only (no minor flat).
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