Angstrom e-beam and thermal evaporator
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IMRI Instrumentation Training Sign-Up Sheet
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Instructions: 1. If you do not yet have a user account, see the "Training/Access" page of the IMRI Website:http://www.imri.uci.edu/
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2. See the list below for the full range of instruments and techniques on which you may be trained. Click on links to take you to the training sign-up sheets for other instruments and facilities.
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3. To sign up for any individual training(s), go to the appropriate tab (the different tabs are located along the bottom of this spreadsheet) and fill out all relevant fields. More detailed descriptions are available on the tabs.
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4. See the "Billing & Rates" section of the IMRI website for details on training and usage costs:http://www.imri.uci.edu/
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5. Once signed up, you will be contacted within several days to schedule your specific training sessions; users will be trained on a first-come, first-serve basis.
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6. If you have any more specific questions, please contact the facility director of operations, Dr. Jian-Guo Zheng (jzheng@calit2.uci.edu).
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InstrumentAvailable Training (tab label or external link)Brief Description
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Angstrom e-beam and thermal evaporatorBasic operation and film depositionSystem overview; basic system operation: venting/pumping, loading/unloading, film deposition, process recipe creation, etc.
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Advanced operation and glacing angle depositionGLAD stage tilt/rotation angle manipulation, deposition ratio files, stage recipe design, motion simulation; substrate heating, etc.
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Glove box and air/moisture-sensitive film preparationGlove box operation, making/loading air/moisture sensitive samples, sample transfer between deposition chamber and glove box.
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FEI Magellan 400 XHR-SEM (1302 Calit2)https://docs.google.com/spreadsheets/d/1yaTkubzxO6O3m_gmKI0lfGGOWWhruTSNB84D8IbEy1E/edit#gid=6High Resolution SEM, EDS, STEM, Backscatter Imaging, E-Beam Lithography
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FEI Quanta3D SEM/FIB (1302 Calit2) https://docs.google.com/spreadsheets/d/1OWwtJEm78sUP-xtjfbJt7AVIa9IAZSxFqK7Bim10SaY/edit?pli=1#gid=11SEM, Focused Ion Beam (FIB), EDS, Electron Backscatter Diffraction (EBSD), Backscatter imaging, TEM-prep w/Omniprobe
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Rigaku SmartLab/Ultima XRD (1302 Calit2)https://docs.google.com/spreadsheets/d/1BAXDo-x5jvFswgW9oVE9-AzPKs65Ppmo7f1TdG3k-4g/edit#gid=11Powder XRD with BB/PB optics, phase searchand m atch, thin Film out-of plane and inplane XRD, XRR, SAXS, HTXRD, microdiffraction and 2D area mapping
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Sample Preparation Tools in Calit2 building (1302 Calit2)https://docs.google.com/spreadsheet/ccc?key=0Aj1bYMa9tk5idFRCenpnX08tc25NMkdJU2kwMWI0MlESputter Coating, Ion Polishing and Etching, Plasma Cleaning, Polishing, Cutting, Dimpling
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Kratos Supra XPS/UPS/SAM (1322 Calit2)https://docs.google.com/spreadsheet/ccc?key=0AjWoBCPmQm4SdDhMbmpGWmp1alRfSGlldmxqc3dOeGc#gid=11XPS, UPS, SAM, ISS, glove box, surface processing
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Nano-CT (1301 Calit2)https://docs.google.com/spreadsheets/d/1Ugxw93KuvnjDI3hYTZwN0GrVBB9kIHZYsfWP0eukh2E/edit?hl=en_US#gid=29X-ray Nano-Computed Tomography (Nano-CT): Non-destructively produce 3D images of objects with a resolution up to 850nm
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AFM Nano-R (1301 Calit2)https://docs.google.com/spreadsheets/d/1Ugxw93KuvnjDI3hYTZwN0GrVBB9kIHZYsfWP0eukh2E/edit?hl=en_US#gid=19Atomic Force Microscopy (AFM): Quantitatively analyze the topography of your sample surface with resolution up to 2nmFischione nanomill, LEICA sputter coaters, cryo-plunger, PIPS II
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Vibrometer (1301 Calit2)https://docs.google.com/spreadsheets/d/1Ugxw93KuvnjDI3hYTZwN0GrVBB9kIHZYsfWP0eukh2E/edit?hl=en_US#gid=20Micro System Analyzer (Vibrometer): Measure in-plane and out-of-plane vibrations and surface topography of micro structures with sub-micrometer resolution
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Angstrom e-beam and thermal evaporator (1301 Calit2) https://docs.google.com/spreadsheets/d/11G2Iyxgn8iGt6ys0JWqQ3PWdN0Q-hWbGSJCDw_eGToM/edit?pli=1#gid=11Planar/GLAD film deposition and air/moisture sensitive film preparation and process
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MC2 Instruments Home (140 Engineering Tower)https://docs.google.com/spreadsheets/d/1NMYR4ccz7I7doboWKJ_D1urEYvMoyMAQgh-D4_H_P0A/editTEM, SEM, XRD, Sputter Coating, Electro- and Mechanical Polishing, Ion Milling, Core Drilling, Ion Milling, Optical Microscopy
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Tescan GAIA3 SEM/FIB (1150 Engineering Hall) https://docs.google.com/spreadsheets/d/1CoAMrzJsbUJUYZd3rBW4eeBPqYccGCwMKbY_spR9ikU/edit#gid=0SEM, Focused Ion Beam (FIB), EDS, Electron Backscatter Diffraction (EBSD), Backscatter electron dectector (BSED), TEM-prep w/Omniprobe, 3D-EDS, 3D-EBSD, EBIC
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JEOL JEM-2800 TEM (1131D-1131E Engineering Hall)https://docs.google.com/spreadsheets/d/1N0V3Z8GJJ3STEOpGDfXhCmhQR671NN-dvWJeaUxteEU/edit#gid=0 TEM, STEM, HRTEM, EDS, BF-DF-WB imaging
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JEOL JEM-2100 CryoTEM (1131A-1131C Engineering Hall) https://docs.google.com/spreadsheets/d/1qRagF2TlD3HbgbSDYyAS1i7tvUoLyF55e3YmKw936zs/edit#gid=0TEM, CryoTEM, 3D Tomography, HRTEM, DF-WB imaging
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JEOL Grand ARM S/TEM (1141A-1141C Engineering Hall) https://docs.google.com/spreadsheets/d/1aIxIUF2JdMlpRBFjv339ASXOtsrxqV3BZ_TbuFrOoYs/edit#gid=1680549919 TEM, STEM, EDS etc
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NION UltraSTEM (1151A-1141C Engineering Hall) TEM, STEM, EDS etc
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Sample preparation in CTEM https://docs.google.com/spreadsheets/d/18uHcRyymB8cHLfWwLvw8L2BjqyGV0QC5TCaasBLqjho/edit#gid=1898796615Fischione nanomill, LEICA sputter coaters, cryo-plunger, PIPS II
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Request a Test for After Hours Accesshttps://docs.google.com/spreadsheet/ccc?key=0Aj1bYMa9tk5idExzYzR6d2FIRnJEdHkyRjlkakQyR3cUse instruments after hours (5pm - 9am) to gain access to a less crowded calendar and lower usage rates (8pm - 8am)
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***CLICK ON THE TABS BELOW, AT THE BOTTOM OF THE WINDOW, TO SIGN UP***
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https://docs.google.com/spreadsheets/d/1CoAMrzJsbUJUYZd3rBW4eeBPqYccGCwMKbY_spR9ikU/https://docs.google.com/spreadsheets/d/1-7XHsYOrzB4qgRmC1MVyXcCdtOsQ-ZUrKKyLwTJOaMM#gid=0
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Angstrom Evaporator Home
Basic operation and film deposition
Trained User Listing
Advanced operation and GLAD
Glove box and air/moisture-sensitive films
 
 
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