ABCDEFGHIJKLMNOPQ
1
2
Thickness, AIndex @632.8nmThickn. Uniformity, %
3
MinMaxMinMaxComment/Mike SIlva
4
Datecenter of wafer1cm from edgecenter of wafer1cm from edge
Thickness Uniformity, %
5
12-02-193030.002958.611.4651.46598.81Thicker in the center
6
12-03-192994.882923.961.4641.46698.80Thicker in the center
7
01-21-203019.082956.651.4651.46598.96Thicker in the center
8
02-18-203052.082960.711.4661.46598.48Thicker in the center
9
10
11
12
13
14
15
16
17
18
Average:3024.012949.981.4651.46598.76
19
Avg.+2%3084.493008.981.4941.495
20
Avg.-2%2963.532890.981.4361.436
21
Max3052.082960.711.4661.46698.96
22
Min2994.882923.961.4641.46598.48
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58