와이낫은 오랜 기간 반도체 업계 경험을 바탕으로

IT 기업들의 신뢰할 만한 반도체 공급 및 파트너 역할을 수행합니다.

INTRODUCTION

YNOT COMPANY

목차

INDEX

About 주식회사 와이낫

Y-NOT PRODUCT

적용사례

Vision AI

Turnkey Sourcing

About YNOT

   Office & RND 

Show Room 1

Show Room 2

Inhouse Ware House

H.Q location          

Business Registration #    

Established in                        

C E O                                       

Capital                                    

Revenue                                  

Manpower

​

Seoul , South Korea

322-87-00686

Nov, 2015

최 헌영 Jake Choi

300,000 USD 

15.50M USD

Sales & Marketing 4, QC 1, 

Engineers 3, SCM 2, CS 1

​

Entrance to YNOT

Edge IPC

Vision & Sensing

Display HMI(LCD, OLED)/ Android PAD

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Wi-Fi, BT , LTE , 5G

GNSS , LoRa, UWB

​

Memory storage

( SSD/SD Card/DRAM )

Battery & Charger adapter & Power Supply

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와이낫 설계지원

Hardware Eco-system 

​

APPLICATION

Edge AI 

UP Boards

& UP System

BOXER-8658AI

BOXER-8645AI

BOXER-8640AI

BOXER-8652AI

BOXER-8623AI

BOXER-8253AI

EC-AGXOrin

EC-OrinNX

AiBox Orin NX

AiBox Orin Nano

AI Accelerators

Hailo-10H M.2 AI Acceleration Module

DX-M1 M.2 LPDDR5x2

DX-M1M M.2 2242

Single Board Computer

UP XTREME 7100

UP Xtreme 7100 l UPX-ASLN

Developer Board with Intel

Processor N-series Processor

UP Squared Pro 7100 Edge

Industrial Computer

with Intel® Processor N-series SoC

UP Squared Pro 7000

Edge Series

Intel Atom x 7000E Series /

Processor N Series / N305 ; 12V DC-in

Idea3588

Rockchip RK3588 octa-core processor, 4x Cortex-A76 cores @ 2.4GHz + 4x Cortex-A55 cores @ 1.8GHz

MYC-JX8MPQ

NXP Quad Arm Cortex-A53 MPU

with Integrated 2.3TOPs NPU

for AI Applications

MYC-JX8MMA7

High-Speed Data Acquisition

and HD Display with

ARM+FPGA System-On-Module

de next-TGU8

86 x 55mm Single Board

with 11th Generation Intel® Core™

i7/i5/i3 Processor

de next-V2K8

86 x 55mm Single Board

with AMD Ryzen™ Embedded

V2000 Series Processor

PICO-RAP4

Pico-ITX Board

with 13th Gen Intel® Core™

i7/i5/i3 Processor

PICO-ADN4 REV.B

Pico-ITX Board with Intel Atom® x7000E Series, Intel® Processor N-series,

and Intel® Core™ i3 Processor N-series

SoM / SoC

System On Module 

 ( 1~25 TOPs support ) 

Embedded Board 

AI Accelerators

System On Module 

Formfactor 

- NXP i.MX 8M Plus Quad Application Processor based on 1.6 GHz 

   Arm Cortex-A53 and 800MHz Cortex-M7 Cores

- A Neural Processing Unit (NPU) Operating at up to 2.3 TOPS

- 2GB/3GB/4GB LPDDR4, 8GB eMMC Flash, 32MB QSPI Flash

- Power Management IC (PMIC)

- 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector

- Supports Working Temperature Ranging from -40°C to 85°C

- Supports Running Linux L5.10.9

Application

IPC - MYS-8MMX-V2 Box

Formfactor 

NXP i.MX 8M Mini Quad Application Processor based on Up to 1.8 GHz Arm Cortex-A53 and 400MHz Cortex-M4 Cores

2GB DDR4, 8GB eMMC Flash, 32MB QSPI Flash

2x USB Host, 1x USB Type-C, 1x Gigabit Ethernet, WiFi/Bluetooth, Micro SD Card Slot, HDMI

Supports Working Temperature Ranging from -40°C to 85°C

Supports Running Yocto Linux and Ubuntu Linux OS

High-quality Aluminum Enclosure with Elegant Appearance

NXP Approved Gold Partner

Applicaition

System On Module 

Formfactor 

* Processor: Rockchip RK3588. 4x Cortex-A76 cores @ 2.4GHz + 4x Cortex-A55 cores @ 1.8GHz

* NPU: 6 TOPS

* RAM: 8GB/16GB

* Storage: 32GB/64GB/128GB/256GB

* Pin out: 5x UART, USB3.0 HOST, 2x USB2.0 HOST, 2x Type-C, 2x MIPI CSI, MIPI DSI, MIPI DPHY, 2x HDMI TX, HDMI RX, DP, GbE, PCIe3.0/2.1, SATA, SDMMC, SDIO, PWM, SPI, CAN, SPDIF, ADC, I2C, I2S, PDM, GPIO, etc.

* Operating system: Android 14, Debian 12, Buildroot

* Dimensions: 67 x 53 mm

* Package: 230-pin, 1.0mm pitch QFN, and 39-pin FPC connector for Camera

Application

System On Module 

• Multi-camera and smart camera systems

• Autonomous mobile robots

• Industrial drones

• Industrial gateway

System On Module 

- High-performance MediaTek Genio 1200 Octa-Core SoC

- Powerful and efficient MediaTek Deep Learning Accelerators 2.0 and 

   Cadence® Tensilica® Vision P6 NPUs supporting up to 4.8 TOPS

- Dual-band Wi-Fi 6 and optional 4G LTE

- 4K hardware accelerated H.265/H.264 video processing

- Dual display and dual MIPI CSI-2 camera support

​

Support Android 13, Yocto 4.0, and Debian 12. Software customization services that speed up time to market and minimize development costs are also available.

Software Packages

Formfactor 

System On Module 

Application

Edge AI PC & Server

· Intel Atom® x7000 RE Series, Intel® Processor N Series, and Intel® Core™ i3-N305 Processors�· Onboard Hailo-8™ edge AI processor�· Onboard LPDDR5 Memory, up to 16GB�· Onboard eMMC Storage, up to 128GB�

Intel AI solution with Hailo module�

UP SQUARED PRO 710H EDGE�

· Powered by NVIDIA Jetson Orin Nano �(8GB) with a hexa-core ARM CPU �· 1024-core Ampere GPU, and 32 Tensor Cores�· Provides up to 67 TOPS for high-performance�· Includes a 128GB PCIe NVMe SSD�· supports Ubuntu 22.04, CUDA, TensorRT�

AIBOX-OrinNano�

· Equipped with NVIDIA Jetson module�· Private deployment of mainstream AI models�· Multiple deep learning frameworks�· AI software stack and ecosystem�· JetPack 7 with SBSA-Aligned Architecture�· Up to 92 channels of 1080P video decoding�

EC-Thor T5000�

· AI@Edge Fanless Embedded AI System with NVIDIA® Jetson AGX Orin™

BOXER-8642AI

· AI@Edge Fanless Embedded AI System with NVIDIA® Jetson AGX Orin™

BOXER-8645AI

· AI@Edge Compact Fanless Embedded AI System with NVIDIA® Jetson Orin™ NX

BOXER-8652AI

· AI@Edge Compact Fanless Embedded AI System with NVIDIA® Jetson Orin NX

BOXER-8651AI

· AI@Edge Compact Fanless Embedded AI System with NVIDIA® Jetson Orin Nano™ with Super Mode

BOXER-8622AI

Wireless Connectivity

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· WLAN Module

· WLAN+BT 

Combo Module

· LENS

· BMS supplier with

· design support

· WLAN Module

· BT Module

· WLAN+BT 

  Combo Module

· IoT / IoT 

  with Matter Module

· WLAN Module

· PCIe / M.2 / 

USB interface

· BT Module

· WLAN+BT 

Combo Module

· IoT Module

WiFi BT module

KC / FCC / CE / TELEC Certified

Automotive 

WLAN Module

AQC-100 Certified

WiFi BT Combo

IoT with Matter Module

KC / FCC / CE / TELEC Certified

Industrial WiFi module

KC / FCC / CE / TELEC Certified

Automotive WIFI/BT Module

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Display - AMOLED, LCD Module 

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Whatever Size & Spec you need ???? 

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·  TFT-LCD Display Module 

(1.22” ~ 21.5” , LVDS, eDP, SPI, MIPI, RGB I/F)

·  Touch Panel and AD Board Customizable.(CTP & RTP)

·  On/In Cell touch compatible

·  1.39” AMOLED MIPI SPI I/F

·  0.96” to 2.8”, PMOLED enable On/In cell touch

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​

​

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AMOLED / TFT Touch LCD

Flexible Display

Round Watch OLED

Transparent Display

Customized Display

- Customizing Service at Reasonable price 

- Best Quality

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·  Customizing service: I/F, Touch IC, Brightness, etc

·  Providing QC process info to Customers

·  Extra QC (Reliability Test) Available at manufacturer side

·  AD board Customizing

​

​

 Camera Module 1 

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Model : SG2-IMX390C-5200-G2A-Hxxx

Resolution : 1920H*1080V

Frame Rate : 1920*1080@30fps

Sensor : SONY 2.12MP IMX390 RGGB

Connector : Amphenol Fakra (ZCode）

Output data : YUV422@8bit

Serializer : MAXIM MAX9295A

Sensor Type : Rolling Shutter

Operating temp.range : -40°C～+85°C

Dimensions : 30mm*30mm*22.5mm

FOV : HFOV 30°/100°/118.4°/196°

Weight : <50g

 Camera Module 2

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GMSL / ToF / Depth / RGB 

Stereo / Vision 2D 3D LiDAR

Desc :

MODEL :

· ToF LiDAR – 12~40 meter, 32,000~60,000 

  scan/sec, 270~360 degree, operating at       

  80,000 lux, Indoor/Outdoor

· Depth (87° × 58°, Stereoscopic), RGB (69° × 

  42°, Rolling Shutter), .3 m to 3 m

· Depth (87° × 58°, Stereoscopic), RGB (90° × 

  65°, Global Shutter), .6 m to 6 m

Sensors2

9-Axis

Accelerator/Angular Velocity/ Magnetometer

Vibration Velocity, 

Displacement & Frequency

· High Precision Accelerator/ Angle Velocity / Magnetic Field detector

· Module & Case type Products for VR device, Robot, UAV, AGV, Platform Stability, Auto Safety System, etc.

​

· 3-axis vibration velocity, 3-axis vibration displacement, vibration frequency,

· Magnetic or Screw for firm and stable connection

· Module & Case type Products for Water pump, Electric Machinery, Engine Vibration Monitoring, Water Tower Monitoring, etc.

IMU Sensor

Vibration Sensor

Co2 / VOC / Gas(others)

Dust(PM 1.0/2.5/10) 

Temp / Humidity / Combined Dust and Gas Sensor

· CO Sensor – 500~1,000ppm

· CO2 Sensor - 400~10,000ppm, 

  +/-50ppm Temp. & Humidity Sensor

· VOC (Volatile organic compounds, Air-

  Quality) Sensor

· Combo Sensor Module

· Combined Dust and Gas Sensor

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 Power Block

MIL-STD-810F

MIL-HDBK-217F

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MTBF

 Charger Adapter

Efficiency: 92%

Memory Storage - SSD / SD card / DRAM / eMMC

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 ·  DRAM Module 

  ·  DDR 4

  ·  DDR 5

 ·  SSD - M.2 / SATA / 1.8” / 2.5”

 ·  SD Card - Micro SD / 

    Embedded Emmc

 ·  FLASH CARD

 ·  USB Disk

Battery Pack

UAV BATTERY

※ Optional Choice: Equipped with Mosfet Modular

3.5 SERIES Without MOSFET

4.0 SERIES With MOSFET

Anti-Spark Modular

No Need to Equip an Anti-Spark Modular

· Norminal Capacity: 30000mAh (30AH)

· Norminal Voltage: 53.2V

· Configuration: 14S1P

· Discharge Rate: 35C

· Weight: 11500±100g

· Dimensions: 333*237*92.5 (±5mm)

· Designed for MTOW 70-100kg heavy-lifting drones

· Agricultural spraying drones

· eVTOL aircraft

· Mapping & surveying drones

· Delivery drones

· Surveillance drones

· Firefighting drones

· Light show drones

· Photography drones

· Construction drones

· Energy industry drones

Applications

Charger

+29.4V

MIC & Audio out

OLED

TOUCH

AD Board

eDP/MIPI DSI

DEBUG

UART

Motor Driver(L)

Motor(L)

Motor(R)

Motor Driver(R)

+12V

+12V

+12V

+12V

12V –> 5V

5V

Battery Pack

Lithium-Ion

+25.2V, 5,000mAh

BATTERY (BMS)

DC-DC

12C

PWM

PWM

LiDAR / Camera

IMU

ToF

ToF

12C

12C

12C

12C

12C

PWM

PWM

SoM

MIPI CSI

uSDCard

USB type-C

UART

USB 3.0

USB 2.0

USB 2.0

USB OTG

GbE

SBC

SDIO

HDMI

Application – Mobility

Application – AMR

Display (LCD,OLED) Customizing

· LCD : 1.9” ~ 24”

· OLED : 1.9” ~ 13.3” QXGA

Mobility Control (AP, Edge AI) 

· Nvidia Jetson + Carrier board Edge box 

· AP (RK3588S)+ NPU Module (Rockchip+Hailo/DeepX)

· Qualcomm / Intel / Rockchip based AP

Camera Module

·  GMSL / Stereo Camera

·  USB3.0 (1080P 30FPS)

·  Depth Camera

·  열화상 (Thermal Imaging)

Charger & Battery

· DC/DC & AC/DC Converter (Wide Input & Output range)

·  AC/DC Adapter/ Barrey Charger Adapter

·  Lithium ion / Lithium polymer 

· Battery pack (BMS)

Sensors & MIC/Speakers 

·  LiDAR / ToF sensor

·  IMU / Vibration sensor

·  Flame detection

·  VOC / CO2 (Other GAS) / temp, humidity

· MIC/Speaker board

Memory & Storage

·  SSD / uSD card

·  DRAM module 

(S0-DIMM / U-DIMM)

​

Wireless (WiFi/BT/LTE/5G)

Robot Control 

· Intel CPU (Intel Atom® x7000RE Series, Intel® Processor N-series, and Intel®

Core™ i3-N305

Processors) +

Hailo NPU Edge

box (Hailo-8™

edge AI

processor)

· Processor: Rockchip RK3588S octa-core processor, 4x Cortex-A76 cores @ 2.4GHz + 4x Cortex-A55 cores @ 1.8GHz

· NPU: 6 TOPS

Camera Module

·  USB3.0 (1080P 30FPS)

·  Realsense D430 + HSF

·  열화상 (Thermal Vision)

Application – 반려로봇

· Jetson Orin NX / AGX Orin

Robot Control 

·  de next-RAP8 (Card size)

86mm x 55mm Single Board with 13th Generation Intel® Core™ i7/i5/i3 Processor

Memory & Storage

·  SSD / uSD card

·  DRAM module

(S0-DIMM / U-DIMM)

Charger & Battery

Wireless (WiFi/BT/LTE/5G)

· Lithium-ion battery 

·  AC/DC Adapter/ Barrey Charger Adapter

Application – Humanoid Robot

· Processor : Rockchip RK3588. 4x Cortex-A76 cores @ 2.4GHz + 4x Cortex-A55 cores @ 1.8GHz

· NPU :

6 TOPS

Camera Module

·  GMSL / Stereo / Depth Camera

Depth Algorithm Running on NVIDIA Platform

·  USB3.0 (1080P 30FPS)

·  Realsense D430 + HSF

·  열화상 (Thermal Vision)

Robot Control 

·  GENE-SKU6 3.5” SubCompact Board with Intel® Core™ i7/i5/i3/Celeron® Processor SoC

Charger & Battery

Sensors & MIC/Speakers 

·  LiDAR / ToF sensor

·  IMU / Vibration sensor

·  Flame detection

·  VOC / CO2 (Other GAS) / temp, humidity

· MIC/Speaker board

Memory & Storage

·  SSD / uSD card

·  DRAM module

(S0-DIMM / U-DIMM)

Wireless (WiFi/BT/LTE/5G)

· Lithium-ion battery 

·  AC/DC Adapter/ Barrey Charger Adapter

Camera Module

·  GMSL / Stereo / Depth Camera

Depth Algorithm Running

on NVIDIA Platform

·  USB3.0 (1080P 30FPS)

·  Realsense D430 + HSF

·  열화상 (Thermal Vision)

Application – Four legged robot

· Jetson Orin NX / AGX Orin

· Processor : Rockchip

RK3588. 4x Cortex-A76

cores @ 2.4GHz + 4x

Cortex-A55 cores @

1.8GHz · NPU : 6 TOPS

Camera Module

·  USB3.0 (1080P 30FPS)

·  Realsense D430 + HSF

·  열화상 (Thermal Vision)

Robot Control 

· Processor : Rockchip RK3588. 4x Cortex-A76 cores @ 2.4GHz + 4x Cortex-A55 cores @ 1.8GHz

· NPU : 6 TOPS

· de next-RAP8 (Card size)

86mm x 55mm Single Board with 13th Generation Intel® Core™ i7/i5/i3 Processor

Wireless (WiFi/BT/LTE/5G)

Application – Security robot

Charger & Battery

· Lithium-ion battery 

·  AC/DC Adapter/ Barrey Charger Adapter

Robot Motion Controller

HUMAN ROBOT HAND

Robot Control 

·  GENE-SKU6 3.5” SubCompact Board with Intel® Core™ i7/i5/i3/Celeron®

Processor SoC

Power Supply

· Power Supply & Adapter

Wireless (WiFi/BT/LTE/5G)

Application – Human robot hand

· Jetson Orin NX / AGX Orin

· Processor : Rockchip RK3588. 4x Cortex-A76 cores @ 2.4GHz + 4x Cortex-A55

cores @ 1.8GHz

· NPU : 6 TOPS

Vision AI

Edge AI 박스

저장장치

모니터링 장치

네트워크 CCTV

(최대 4대)

· 건설현장에서의 Vision AI

RTSP

단 납기 턴키 소싱 (Sourcing)

글로벌 소싱

데이터베이스

Warranty

기술지원

Inspection 

Test

· 필요한 만큼만

· 생산 스케쥴에

· 원하는 가격에

· 원하는 품질로

IC

CONNECTORS

CPU

MEMORY

Embedded H/W & S/W ODM Service

·  MPU/MCU based Hardware Design         (Renesas/Qualcomm/NXP/Rockchip/Nvidia)

·  Hardware Customizing Design Service

    (free)

·  PCB Drawing & Mechanical 

   Design service

·  Support Certification 

·  Process(KC/CE/FCC/TELEC)

​

1. Hardware Development Service

·  Development Environment Support

·  Device Driver Development Support

·  Application Development Support

·  Supported OS(Android/Linux/RTOS)

​

2. Software Development Service

·  HW, SW Development Outsourcing

·  Support Mass Production

·  Developer Management

·  Schedule Management

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3. Project Management Service

Customers

We are serving over 100+ customers including key players in the markets.

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AUTOMOTIVE & CHARGER

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ROBOTIC / MOBILITY / AI

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Customers

We are serving over 100+ key players in the markets.

​

NETWORK & INDUSTRIAL Automation

​

MEDICAL & HEALTH CARE

​

Broadband Entainment & Payment

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SMART HOME & AIoT

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Customers

We are serving over 100+ customers including key players in the markets.

Partners

Organization

Growth Trend

12

주식회사 와이낫

#617~621, 40, Yangcheon-ro 47-gil, Gangseo-gu, Seoul, Korea

서울특별시 강서구 양천로47길 40 놀라움마곡 617-621호 (07522)

Ynot Co., Ltd.

ADDRESS

+82 70 4130 7799

TEL

Sales : sales@y-not.kr   l   Technical support : tech@y-not.kr

E-MAIL

www.y-not.kr

WEBSITE