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Chapter -3. Electrical Properties

1

ISSUES TO ADDRESS...

• How are electrical conductance and resistance

characterized?

• What are the physical phenomena that distinguish

conductors, semiconductors, and insulators?

• For metals, how is conductivity affected by

imperfections, temperature, and deformation?

• For semiconductors, how is conductivity affected

by impurities (doping) and temperature?

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View of an Integrated Circuit

2

• Scanning electron micrographs of an IC:

Fig. (d) from Fig. 12.27(a), Callister & Rethwisch 3e.

(Fig. 12.27 is courtesy Nick Gonzales, National Semiconductor Corp., West Jordan, UT.)

• A dot map showing location of Si (a semiconductor):

-- Si shows up as light regions.

(b)

0.5 mm

(a)

(d)

45 μm

Al

Si

(doped)

(d)

• A dot map showing location of Al (a conductor):

-- Al shows up as light regions.

(c)

Figs. (a), (b), (c) from Fig. 18.27, Callister & Rethwisch 8e.

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Electrical Conduction

3

Ohm's Law:

V = I R

voltage drop (volts = J/C)

C = Coulomb

resistance (Ohms)

current (amps = C/s)

Conductivity, σ

Resistivity, ρ: � -- a material property that is independent of sample size and � geometry

surface area

of current flow

current flow � path length

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Electrical Properties

  • Which will have the greater resistance?

  • Analogous to flow of water in a pipe
  • Resistance depends on sample geometry and size.

4

D

2D

2

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Definitions

Further definitions

J = σ ε <= another way to state Ohm’s law

Jcurrent density

εelectric field potential = V/

5

Electron flux conductivity voltage gradient

J = σ (V/ )

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Conductivity: Comparison

6

• Room temperature values (Ohm-m)-1 = (Ω - m)-1

Selected values from Tables 18.1, 18.3, and 18.4, Callister & Rethwisch 8e.

Silver

6.8 x 10

7

Copper

6.0 x 10

7

Iron

1.0 x 10

7

METALS

conductors

Silicon

4 x 10

-4

Germanium

2 x 10

0

GaAs

10

-6

SEMICONDUCTORS

semiconductors

Polystyrene <10

-14

Polyethylene 10

-15

-10

-17

Soda-lime glass 10

Concrete 10

-9

Aluminum oxide <10

-13

CERAMICS

POLYMERS

insulators

-10

-10

-11

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Example: Conductivity Problem

7

What is the minimum diameter (D) of the wire so that V < 1.5 V?

Cu wire

I = 2.5 A

-

+

V

Solve to get D > 1.87 mm

< 1.5 V

2.5 A

6.07 x 107 (Ohm-m)-1

100 m

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Electron Energy Band Structures

8

Adapted from Fig. 18.2, Callister & Rethwisch 8e.

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Band Structure Representation

9

Adapted from Fig. 18.3, Callister & Rethwisch 8e.

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Conduction & Electron Transport

10

• Metals (Conductors):

-- for metals empty energy states are adjacent to filled states.

-- two types of band � structures for metals

-- thermal energy � excites electrons � into empty higher � energy states.

- partially filled band

- empty band that � overlaps filled band

filled

band

Energy

partly

filled

band

empty

band

GAP

filled states

Partially filled band

Energy

filled

band

filled

band

empty

band

filled states

Overlapping bands

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Energy Band Structures: Insulators & Semiconductors

11

• Insulators:

-- wide band gap (> 2 eV)

-- few electrons excited � across band gap

Energy

filled

band

filled

valence

band

filled states

GAP

empty

band

conduction

• Semiconductors:

-- narrow band gap (< 2 eV)� -- more electrons excited � across band gap

Energy

filled

band

filled

valence

band

filled states

GAP

?

empty

band

conduction

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Metals: Influence of Temperature and Impurities on Resistivity

12

• Presence of imperfections increases resistivity

-- grain boundaries

-- dislocations

-- impurity atoms

-- vacancies

These act to scatter

electrons so that they

take a less direct path.

• Resistivity

increases with:

ρ =

deformed Cu + 1.12 at%Ni

Adapted from Fig. 18.8, Callister & Rethwisch 8e. (Fig. 18.8 adapted from J.O. Linde, Ann. Physik 5, p. 219 (1932); and C.A. Wert and R.M. Thomson, Physics of Solids, 2nd ed., McGraw-Hill Book Company, New York, 1970.)

T (ºC)

-200

-100

0

1

2

3

4

5

6

Resistivity,

ρ

(10

-8

Ohm-m)

0

Cu + 1.12 at%Ni

“Pure” Cu

ρd

-- %CW

+ ρdeformation

ρi

-- wt% impurity

+ ρimpurity

ρt

-- temperature

ρthermal

Cu + 3.32 at%Ni

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Estimating Conductivity

13

Adapted from Fig. 7.16(b), Callister & Rethwisch 8e.

• Question:

-- Estimate the electrical conductivity σ of a Cu-Ni alloy

that has a yield strength of 125 MPa.

Yield strength (MPa)

wt% Ni, (Concentration C)

0

10

20

30

40

50

60

80

100

120

140

160

180

21 wt% Ni

Adapted from Fig. 18.9, Callister & Rethwisch 8e.

wt% Ni, (Concentration C)

Resistivity,

ρ

(10

-8

Ohm-m)

10

20

30

40

50

0

10

20

30

40

50

0

125

CNi = 21 wt% Ni

From step 1:

30

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Charge Carriers in Insulators and Semiconductors

Two types of electronic charge carriers:

Free Electron

– negative charge

– in conduction band

Hole

– positive charge� – vacant electron state in � the valence band

14

Adapted from Fig. 18.6(b), Callister & Rethwisch 8e.

Move at different speeds - drift velocities

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Intrinsic Semiconductors

  • Pure material semiconductors: e.g., silicon & germanium
    • Group IVA materials

15

  • Compound semiconductors
    • III-V compounds
      • Ex: GaAs & InSb
    • II-VI compounds
      • Ex: CdS & ZnTe
    • The wider the electronegativity difference between � the elements the wider the energy gap.

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Intrinsic Semiconduction in Terms of Electron and Hole Migration

16

Adapted from Fig. 18.11, Callister & Rethwisch 8e.

electric field

electric field

electric field

• Electrical Conductivity given by:

# electrons/m3

electron mobility

# holes/m3

hole mobility

• Concept of electrons and holes:

+

-

electron

hole

pair creation

+

-

no applied

applied

valence

electron

Si atom

applied

electron

hole

pair migration

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Number of Charge Carriers

Intrinsic Conductivity

17

For GaAs ni = 4.8 x 1024 m-3

For Si ni = 1.3 x 1016 m-3

  • Ex: GaAs
  • for intrinsic semiconductor n = p = ni

σ = ni|e|(μe + μh)

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Intrinsic Semiconductors: �Conductivity vs T

18

• Data for Pure Silicon:

-- σ increases with T

-- opposite to metals

Adapted from Fig. 18.16, Callister & Rethwisch 8e.

material

Si

Ge

GaP

CdS

band gap (eV)

1.11

0.67

2.25

2.40

Selected values from Table 18.3, Callister & Rethwisch 8e.

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Intrinsic vs Extrinsic Conduction

19

Intrinsic:

-- case for pure Si

-- # electrons = # holes (n = p)

Extrinsic:

-- electrical behavior is determined by presence of impurities � that introduce excess electrons or holes

-- np

3

+

p-type Extrinsic: (p >> n)

no applied

electric field

Boron atom

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

hole

n-type Extrinsic: (n >> p)

no applied

electric field

5+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

4

+

Phosphorus atom

valence

electron

Si atom

conduction

electron

Adapted from Figs. 18.12(a) & 18.14(a), Callister & Rethwisch 8e.

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Extrinsic Semiconductors: Conductivity vs. Temperature

20

• Data for Doped Silicon:

-- σ increases doping

-- reason: imperfection sites

lower the activation energy to

produce mobile electrons.

• Comparison: intrinsic vs

extrinsic conduction...

-- extrinsic doping level:

1021/m3 of a n-type donor

impurity (such as P).

-- for T < 100 K: "freeze-out“,

thermal energy insufficient to

excite electrons.

-- for 150 K < T < 450 K: "extrinsic"

-- for T >> 450 K: "intrinsic"

Adapted from Fig. 18.17, Callister & Rethwisch 8e. (Fig. 18.17 from S.M. Sze, Semiconductor Devices, Physics, and Technology, Bell Telephone Laboratories, Inc., 1985.)

Conduction electron

concentration (1021/m3)

T

(K)

600

400

200

0

0

1

2

3

freeze-out

extrinsic

intrinsic

doped

undoped

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p-n Rectifying Junction

21

Allows flow of electrons in one direction only (e.g., useful

to convert alternating current to direct current).

• Processing: diffuse P into one side of a B-doped crystal.

-- No applied potential:

no net current flow.

-- Forward bias: carriers

flow through p-type and

n-type regions; holes and

electrons recombine at

p-n junction; current flows.

-- Reverse bias: carriers

flow away from p-n junction;

junction region depleted of � carriers; little current flow.

+

+

+

+

+

-

-

-

-

-

p-type

n-type

+

-

+

+

+

+

+

-

-

-

-

-

p-type

n-type

Adapted from Fig. 18.21 Callister & Rethwisch 8e.

+

+

+

+

+

-

-

-

-

-

p-type

n-type

-

+

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Properties of Rectifying Junction

22

Fig. 18.22, Callister & Rethwisch 8e.

Fig. 18.23, Callister & Rethwisch 8e.

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Junction Transistor

23

Fig. 18.24, Callister & Rethwisch 8e.

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MOSFET Transistor �Integrated Circuit Device

  • Integrated circuits - state of the art ca. 50 nm line width
    • ~ 1,000,000,000 components on chip
    • chips formed one layer at a time

24

Fig. 18.26, Callister & Rethwisch 8e.

  • MOSFET (metal oxide semiconductor field effect transistor)

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Ferroelectric Ceramics

  • Experience spontaneous polarization

25

Fig. 18.35, Callister & Rethwisch 8e.

BaTiO3 -- ferroelectric below its Curie temperature (120ºC)

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Piezoelectric Materials

26

stress-free

with applied stress

Adapted from Fig. 18.36, Callister & Rethwisch 8e. (Fig. 18.36 from Van Vlack, Lawrence H., Elements of Materials Science and Engineering, 1989, p.482, Adapted by permission of Pearson Education, Inc., Upper Saddle River, New Jersey.)

Piezoelectricity � – application of stress induces voltage

– application of voltage induces dimensional change

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Summary

27

• Electrical conductivity and resistivity are:

-- material parameters

-- geometry independent

• Conductors, semiconductors, and insulators...

-- differ in range of conductivity values

-- differ in availability of electron excitation states

• For metals, resistivity is increased by

-- increasing temperature

-- addition of imperfections

-- plastic deformation�• For pure semiconductors, conductivity is increased by

-- increasing temperature

-- doping [e.g., adding B to Si (p-type) or P to Si (n-type)]

• Other electrical characteristics

-- ferroelectricity

-- piezoelectricity