SERVER
OCP NIC Community Update�October 2022
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Mailing List: https://ocp-all.groups.io/g/OCP-NIC
NIC3.0
Agenda
OCP Global Summit 2022
ID | Title |
2841 | OCP NIC 3.0 Design Specification Update |
2788 | Leveraging Existing OCP NIC Interconnect for PCIe Gen 6 Architectures. |
2617 | OCP NIC 3.0: Present and The Future |
2683 | Advanced thermal testing and characterization for pluggable IO |
2705 | New TSFF test fixture airflow measurements and definitions |
2783 | SmartNIC & OCP NIC-3 in Modular Hardware Systems (DC-MHS) |
OCP Experience Lab in OCP Summit
PCIe® 5.0 SI Test Fixtures
CLB 5.0 32GT/s status:
CBB 5.0 32GT/s status:
OCP NIC 3.0 SFF CLB 5.0 prototype
Calibration
CLB board 1
Impedance Coupon
CLB board 2
Jason
OCP NIC 3.0 SFF CBB 5.0 block diagram
TTF was designed to support speeds up to PCIe® 5.0 32GT/s
Cable assembly must be updated for 32GT/s signaling transmission
PCIe® 5.0 Thermal Test Fixture (TTF)
OCP NIC 3.0 TTF in use
Example cable assembly from Samtec
Jason
PCIe CEM 6.0 rev0.5 addition
Get the spec in https://members.pcisig.com/wg/PCI-SIG/document
Get the spec in https://members.pcisig.com/wg/PCI-SIG/document
Out-of-band Interface Speed Comparison
No RMII
No I3C
No RMII
No USB2.0
No I3C
Mb/s
Heads-up
Gather feedback throughout the year
Provide your feedback at:�https://tinyurl.com/feedback2ocpnic