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MAYURBHANJ SCHOOL OF ENGINEERING � LAXMIPOSI ,BARIPADA,757107

Prepared by Mr. Shaswata Mohanta(HOD E & TC Engineering Department)

Subject – VLSI & EMBEDDED SYSTEM

Chapter – 1–Introduction to VLSI & MOS Transistor

Topic – MOS Transistor

Semester – 5th

Branch – Electronics & Telecommunication

AY-2021-2022, WINTER-2021

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Outline

  • Introduction
  • Silicon, pn-junctions and transistors
  • A Brief History
  • Operation of MOS Transistors
  • CMOS circuits
  • Fabrication steps for CMOS circuits

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Introduction

  • Integrated circuits: many transistors on one chip.
  • Very Large Scale Integration (VLSI)
  • Complementary Metal Oxide Semiconductor (CMOS)
    • Fast, cheap, “low-power” transistors circuits

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WHY VLSI DESIGN?

Money, technology, civilization

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Digression: Silicon Semiconductors

  • Modern electronic chips are built mostly on silicon substrates
  • Silicon is a Group IV semiconducting material
  • crystal lattice: covalent bonds hold each atom to four neighbors

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Dopants

  • Silicon is a semiconductor at room temperature
  • Pure silicon has few free carriers and conducts poorly
  • Adding dopants increases the conductivity drastically
  • Dopant from Group V (e.g. As, P): extra electron (n-type)
  • Dopant from Group III (e.g. B, Al): missing electron, called hole (p-type)

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p-n Junctions

  • First semiconductor (two terminal) devices
  • A junction between p-type and n-type semiconductor forms a diode.
  • Current flows only in one direction

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A Brief History �Invention of the Transistor

  • Vacuum tubes ruled in first half of 20th century Large, expensive, power-hungry, unreliable
  • 1947: first point contact transistor (3 terminal devices)
    • Shockley, Bardeen and Brattain at Bell Labs

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A Brief History, contd..

  • 1958: First integrated circuit
    • Flip-flop using two transistors
    • Built by Jack Kilby (Nobel Laureate) at Texas Instruments
    • Robert Noyce (Fairchild) is also considered as a co-inventor

Kilby’s IC

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A Brief History, contd.

  • First Planer IC built in 1961

  • 2003
    • Intel Pentium 4 μprocessor (55 million transistors)
    • 512 Mbit DRAM (> 0.5 billion transistors)
  • 53% compound annual growth rate over 45 years
    • No other technology has grown so fast so long
  • Driven by miniaturization of transistors
    • Smaller is cheaper, faster, lower in power!
    • Revolutionary effects on society

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  • 1970’s processes usually had only nMOS transistors

Inexpensive, but consume power while idle

  • 1980s-present: CMOS processes for low idle power

MOS Integrated Circuits

Intel 1101 256-bit SRAM

Intel 4004 4-bit μProc

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Transistor Types

  • Bipolar transistors
    • npn or pnp silicon structure
    • Small current into very thin base layer controls large currents between emitter and collector
    • Base currents limit integration density
  • Metal Oxide Semiconductor Field Effect Transistors
    • nMOS and pMOS MOSFETS
    • Voltage applied to insulated gate controls current between source and drain
    • Low power allows very high integration
    • First patent in the ’20s in USA and Germany
    • Not widely used until the ’60s or ’70s

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MOS Transistors

  • Four terminal device: gate, source, drain, body
  • Gate – oxide – body stack looks like a capacitor
    • Gate and body are conductors (body is also called the substrate)
    • SiO2 (oxide) is a “good” insulator (separates the gate from the body
    • Called metal–oxide–semiconductor (MOS) capacitor, even though gate is mostly made of poly-crystalline silicon (polysilicon)

NMOS

PMOS

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NMOS Operation

  • Body is commonly tied to ground (0 V)
  • Drain is at a higher voltage than Source
  • When the gate is at a low voltage:
    • P-type body is at low voltage
    • Source-body and drain-body “diodes” are OFF
    • No current flows, transistor is OFF

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NMOS Operation Cont.

  • When the gate is at a high voltage: Positive charge on gate of MOS capacitor
    • Negative charge is attracted to body under the gate
    • Inverts a channel under gate to “n-type” (N-channel, hence

called the NMOS) if the gate voltage is above a threshold voltage (VT)

    • Now current can flow through “n-type” silicon from source through channel to drain, transistor is ON

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PMOS Transistor

  • Similar, but doping and voltages reversed
    • Body tied to high voltage (VDD)
    • Drain is at a lower voltage than the Source
    • Gate low: transistor ON
    • Gate high: transistor OFF
    • Bubble indicates inverted behavior

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Power Supply Voltage

  • GND = 0 V
  • In 1980’s, VDD = 5V
  • VDD has decreased in modern processes
    • High VDD would damage modern tiny transistors
    • Lower VDD saves power
  • VDD = 3.3, 2.5, 1.8, 1.5, 1.2, 1.0,
  • Effective power supply voltage can be lower due

to IR drop across the power grid.

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Transistors as Switches

  • In Digital circuits, MOS transistors are electrically controlled switches
  • Voltage at gate controls path from source to drain

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THANK YOU