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SERVER

OCP NIC Community Update�June 2026

��Sub-group Project Wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

NIC3.0

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Agenda

OCP Global Summit – Call for presentations
NIC Power Excursion Limits
DMTF FRU Format
Thermal Test Fixture update
Thermal workstream update

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OCP Global Summit

OCP Global Summit break-out session & OCP technologies symposium call for abstracts and papers

Call for presentations closes on June 15

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NIC Power Excursion Limits

SFF-TA-1002 v1.6a (Figure 6-1) includes a transient current specification.

Connectors support transients up to 3A for <=100 us (ratio of 2.7x, @ 1.1 A/pin)
The graph Y-axis is a static current. Graph logmithically delays down to 1x at 1.0 second

CEM6 (Figure 4-1) shows a ratio of 2.5x “relative to max sustained power” (@ 1.1 A/pin, same knee)
Platforms need to support 2.5x the current.

Can we align the OCP NIC 3.0 power excursion with Table 4-5 of the CEM 6 excursion specification?
Effectively cap the platform excursion limit to 2.5x. Leaves connector margin.

What is the expectation for a new card that is plugged into a legacy system?
How do we report max platform power excursions?

Do we need to indicating max characterized power excursion in the FRU?

Reference Material (membership required):

SFF-TA-1002: https://members.snia.org/document/dl/27231
PCI-SIG CEM 6: https://pcisig.com/PCIExpress/Spec/CEM/CardElectromechanical_6.0

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Board Info Area Format Mfg Date/Time Rollover

Option 5: Implement a DMTF FRU (DSP0220) format in “hybrid” mode. Enables a gradual transition to the DMTF FRU. This is a legacy / backwards compatible implementation.

High Level Changes:

Add a new DMTF OEM Record (0xC0, IANA 0xB41A00) containing a four-byte offset to the new DMTF General FRU Record File position.

BMCs that don’t understand the DMTF OEM Record will skip/ignore the new data.

The legacy IPMI FRU Mfg date/time field will be zeroed out
The new FRU would, at minimum, include a new structure with a 13-byte Manufacture Date Field.

Card vendors may populate additional field types (such as the Manufacturer, Part Number, Serial Number) as defined in DSP0257.
Field Types with IPMI equivalents shall have the same data replicated in the DMTF FRU section.

Pros:

Maintains backwards compatibility with existing FRU format.
Minimal effort for NIC vendors.

Existing OCP NIC 3.0 IPMI OEM Records continue to be used as-is
Can co-exist with the IPMI FRU format and I2C EEPROMs.

Baseboard vendors may already support DSP0220 FRU formats.

Work in progress:

DMTF needs tools/validators/minor specification clarifications.

Common Header

Board Info Area

Product Info Area

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OCP NIC TTF contribution

Dell is contributing the latest OCP TTF

Update: Posted on marketplace, in final approval

Supports all active form-factors: SFF, TSFF, DSFF, TDSFF
Up to PCIe Gen 6
Design files: < Google Drive Link >

NEW: Github for the MCU: https://github.com/opencomputeproject/ocp-svr-nic3-ttf-mcu

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Thermal Workstream Update - LC TSFF

Liquid cooling feasibility study complete

3 mechanical design concepts

Refined 2 concepts with actual NIC
Next steps

Prototyping and expect the samples to be back in 6-8 weeks

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Thank You

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