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FINCH

External Design Review

Summer 2024

UNIVERSITY OF TORONTO AEROSPACE TEAM - SPACE SYSTEMS

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redefining limits

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Schedule

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Science 🧪

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Meet the Science Team!

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Field Imaging Nanosatellite for Crop-residue Hyperspectral mapping (FINCH)

FINCH

Hyperspectral remote sensing for

agricultural applications

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Why Crop Residue (NPV)?

Crop residue is the left over plant material after harvesting.

Leaving crop residue on fields provides a living mulch, sequesters carbon, and prevents soil erosion.

Too much crop residue can harbor pests and diseases.

How can a farmer acquire crop residue metrics? Remote sensing!

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Some Remote Sensing Requirements

FINCH-Spacecraft- Spectral Range

FINCH-Spacecraft-Spatial Resolution

FINCH-Spacecraft-SNR

FINCH SHALL be capable of conducting hyperspectral imaging across the 900-1700nm spectral range

FINCH SHALL Obtain images with a ground sample distance ≤ 90m. Lower is better.

FINCH SHALL Achieve a signal-to-noise ratio of at least 30:1. Higher is better.

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Levels of Scientific Mission Success

Objective 1

Objective 3

Objective 5

Succeed in taking and downlinking an image of the target site

Succeed in taking and downlinking an image

Succeed in processing downlinked image so that sensor and geometric errors are rectified

Succeed in fitting a linear spectral mixing model to the image data - extraction of crop residue (NPV) abundances

  1. Select image endmembers
  2. Determine crop residue abundance

Objective 4

Success of levels 1-4 on multiple image passes

Objective 2

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Phase C Completion Criteria

SHALL - Fit a linear mixing model (LMM) to both noisy and noiseless synthetic data generated at FINCH’s spectral range and SNR specifications

SHALL - Complete requirements model that captures all scientific requirements

Rationale:

Does an SNR of 30:1 within the spectral ranges of 900-1700 yield spectrally differentiable crop residue abundance estimations from a pixel in an image?

Concerns:

Current hyperspectral satellites - including cubesat satellites- typically are achieving higher SNR than 30:1.

Key spectral feature of crop residue which is used for abundance estimations is situated at 2100 nm.

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Building the Simple LMM

  1. Acquire Test Spectral Library

  • Re-sample library reflectance values to FINCH bandwidths and spectral range

  • Data to model inversion on noiseless library

  • At sensor simulation of reflectance values with atmospheric absorption and atmospheric scattering residuals

  • Create SNR constrained noise function

  • Add atmospheric residuals and SNR noise: Data to model inversion on noisy library

  • Compare to noiseless model

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Science Artifacts: Spectral Library

Samples from University of Utah dataset of 1723 spectra from six field experiments that measured reflectance and fractional cover of green vegetation, non-photosynthetic vegetation (NPV), and/or soil.

Spectra were processed to simulate spectra from a satellite VSWIR imaging spectrometer with 10nm bandpass.

Is soil and NPV differentiable within FINCH wavelength range?

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Science Artifacts: Endmember Definition

Spectrally:

An endmember is the pure spectral response of a specific feature

These are 1nm resampled NPV, Vegetation (GV), and Soil endmembers at FINCH wavelength range

These graphs are ≥ 90% pure endmembers

Geometric Visualization in an Image:

If an image only contains 3 endmembers:

  • Any non-endmember measurement = linear combination of 3 endmembers

If you plot the spectral vectors of all the measurements in the image:

  • The endmembers are the vertices of the convex hull

NPV

GV

Soil

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Science Artifacts: Principal Component Analysis

�1st PC Loadings: 1320 nm, 1200 nm, 1210 nm

2nd PC Loadings: 900 nm, 910 nm, 920 nm

3rd PC Loadings: 1380 nm, 1370 nm, 1390nm

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Science Artifacts: Noiseless Inversion

  • Linear Inversion with two constraints
  • Used all of the wavelengths within FINCHs range
  • Searched for three endmember combination that fit the mixed pixel with the lowest RMSE

  • Abundance estimates accurate within 10% of the true values

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Risk Management

FINCH-Science-Selected Components Not Optimal For Scientific Objectives 4+

FINCH-Science-Ground Truth Failure

FINCH-Science-Non Viable SNR

Ensure Science knowledge is preserved and to maintain a presence in decisions made during phase C

Continue to plan ground truth missions and collect site specific data. Don’t destroy relations with AAFC and EMILI….

1. Build SNR increasing algorithms into Data Processing pipeline

2. Change the image capturing procedure to boost SNR.

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Next Steps:

Ground Truth Operations

Increase Complexity of Model

Finish High Level Requirements

Ground truth informed optimization of endmembers.

Fit LMM to hyperspectral drone data.

Validated using AAFC cover estimation app.

Our simple LMM will revolve around a known and deterministic set of EMs with static SNR.

The model must be more rigorous.

It is possible that a linear model is ill-posed.

Temporal resolution requirement

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Audience Q&A

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Systems

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Systems Team

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Agenda

  • Systems Engineering Framework
  • Requirements Model
  • FINCH System Architecture
  • Systems Artifacts
  • Phase C Next Steps
  • Q&A

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FINCH

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Systems Engineering Framework

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Systems Engineering Framework

  • Design reviews close the loop of our Space Systems engineering framework
  • The feedback gained feeds directly back into improving the requirements model, and hence the design

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System Artifacts

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Project Management Framework

Three levels of granularity:

  • Epics: large mission-spanning initiatives. May run over one or more years. Typically NASA mission phases. Composed of stories
  • Stories: projects whose duration is on the order of a semester. May require collaboration between teams. Composed of chapters
  • Chapters: Week-to-week projects and events that make up stories. Assignable to individuals or groups of individuals. Composed of tasks

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Requirements Model

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Spacecraft-Level Requirements

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Spacecraft-Level Requirements

BUDGETS

COMMAND & CONTROL

IMAGE ACQUISITION & DATA HANDLING

TELEMETRY

LAUNCH PROVIDER

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FINCH Budgets

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Other Noteworthy Requirements

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FINCH System Architecture

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FINCH System Hierarchy

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Systems Artifacts

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Where We Are

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Phase C

Completion Criteria

  • Revival of Science
  • Lower fidelity requirement verification
  • “Complete” requirements model
  • Testing of MCU-level code on hardware
  • RF / Ground Station considerations

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FINCH Phase C Progress

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Systems Phase C Completion Criteria

  • SHALL
  • SHALL
  • SHALL
  • SHALL
  • SHALL
  • SHALL

Complete requirements model that captures all spacecraft-level requirements

Up-to-date budgets to the fidelity suggested by Space Mission Analysis and Design

High-level system integration build roadmap for Phase D

At least one iteration of structural, thermal, optical performance (STOP) analysis on flight payload

Functional test harness architecture at the fidelity of high-level design and high-level test plans

Orbital debris assessment of at least first iteration

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Command Sequence Diagrams

  • Idle mode
  • Imaging mode
  • On-orbit processing mode
  • Downlinking mode
  • Safety mode

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Risk Management

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Notable Risks

Risk

Likelihood

Severity

Management Strategy

Severe orbital injection failure

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4

Nothing can be done as launch is out of our hands.

Payload breaks during Vibration Testing

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2

Use mass dummy for spacecraft-level vibration test. Conduct lower intensity vibration test with payload.

Satellite transceiver data rate not enough to downlink complete datacube(s) in one pass

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3

Ground Station located to allow for large passes.

Downlinking of datacube split into chunks (tradeoff)

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Next Steps

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Remainder of Phase C Timeline

Fall 2024 Onboarding

Building satellites & scientists and engineers of tomorrow

Sep 2024

FDIR/FMEA Review

Operations x Firmware

Oct 2024

Firmware testing

Start testing MCU-level code on hardware

Nov 2024

Fall 2024 IDR Preparation

Semesterly Internal Design Reviews

Dec 2024

STOP Analysis #1

First complete iteration of STOP Analysis on payload

Jan 2025

Testing Campaign Review

Phase D setup (Field Testing & Operations Testing)

Feb 2025

FINCH Eye Design Review

Final Payload Design Review

Mar 2025

Internal CDR Preparation

Team-level CDR presentations in advance of the Phase C -> Phase D transition period

Apr 2025

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Next Steps for Systems

Phase C Nodes

Ongoing

Phase D Setup

  • FINCH Eye design
  • STOP analysis
  • Operations plan and requirements
  • FDIR and FMEA
  • Risk management
  • Timeline tracking
  • Systems hub
  • Testing campaign
  • Documentation of AIT plans

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Audience Q&AAudience Q&A

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Summer 2024 EDR: Optics

FINCH EYE Hyperspectral Imaging Payload

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FINCH Optics: Long-term Objectives

Design, build, and launch a novel (!) GRISM-based Short-Wave InfraRed �(SWIR) Hyperspectral Imager for a 3U CubeSat platform.

Learning

Design & Sourcing

Simulation

Testing

Develop a proof-of- concept lab-bench hyperspectral imager operating in the visible range (Build I).

Design a hyperspectral imager in the SWIR range, intended for satellite launch (FINCH EYE), using a combination of custom and commercially- available components.

Validate the design in ZEMAX, SigFit, and with lab bench testing (Build II).

Co-develop the optomechanical assembly and alignment procedures with Pay-Mech. Prepare a suite of characterization tests for the hyperspectral imager.

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Contributing Members (S2024)

Shokoofa Deghnani

Calculations and Design

Marcus Hong

Calculations and Design

Priyansh Parakh

Spectral Calibration Test Plan

Kenya He

Spatial Alignment Test Plan

Samuel Ho

Component Selection

Diba Alam

Component Selection

Iliya Shofman

Optics Lead

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Key Requirements

Basic Performance Specifications

Ground Sampling Distance

<90m

Ground Swath Width

8km

Spectral Resolution

<10nm

Spectral Range

900nm-1700nm

Signal to Noise Ratio

>30

Physical Footprint Constraints

Volume

Ø60mm × 160mm

Mass

≤350g

Operating Environment Conditions

Temperature:

withstand -40°C – +70°C

operate 0°C – 40°C

Vibration

withstand launch vibrations

Radiation

withstand 10 krad/year

Optics delivers this to Science… while adhering to the following:

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Interfaces with Other Subsystems

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Phase C: Completion Strategy

Builds Plan

Modelling Plan

Design Calculations

Component Sourcing

  • Build I: lab-bench visible- range hyperspectral imager with readily- available commercial components.
  • Build II: lab-bench demonstration of SWIR hyperspectral imager using space-ready objective lens, GRISM, and camera.
  • Build III: space-ready SWIR hyperspectral imager integrated into custom optomechanical housing.
  • Build IV: payload that passes shake & bake tests. Ready to integrate into satellite.
  • Learning ZEMAX by modelling Build I, starting with each individual “component”.
  • Sequential mode ZEMAX model with appropriate substitutes for proprietary and custom components, Build II.
  • Preliminary spot-size, distortion, tolerance, MTF analyses in ZEMAX.
  • Preliminary STOP analysis in SigFit, considering simplified yet realistic models for the optics and optomechanics.

  • Basic (Geometric) Design
  • Signal-to-Noise Ratio�→ Spectral Radiance�→ Camera Noise Comparison�→ Image Quality Analysis
  • Parametric Opto- mechanical Model
  • Mission Lifespan and Radiation Resistance

Please note: the scope of these calculations is easily commensurate to a Master's Thesis project!

  • Purchase laboratory materials needed for evaluation of Build I and II.
  • Create a shortlist of two or three objective lens options. Justify the selection of one.
  • Finalize specifications for GRISM, in collaboration with Wasatch Photonics.
  • Finalize specifications of sapphire window with Resolve Optics.
  • Understand specifications and requirements for relay lenses, seek commercial or custom alternatives.

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Recent Work

Build I: Bill of materials, spatial alignment test plan. Clean bench and lab supplies.

ZEMAX: basic model for further modifications (replace paraxial lenses).

Radiation Risk Assessment: assess impact of radiation exposure to long-term performance degradation.

STOP Analysis: practice using SigFit on a simplified optical system with quasi-realistic satellite model

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Questions for Optics

If we run out of time, please send me a message on Slack or by email with your questions and/or feedback. We are very eager to hear back from you!

Iliya Shofman | iliya.shofman@mail.utoronto.ca

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Audience Q&A

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10-Minute Break

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Payload-Mechanical

The Beholder of the Eye

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Meet the Team!

Theaswanth Ganesh

Naveen Black

Gabriel Caribé

Sara Yousaf

Ksenya Narkevich

Mario Ghio Neto

Noa Prosser

Ceci Krauss-McClurg

Luke Taylor

General Member

General Member

General Member

General Member

Pay-Mech Lead

General Member

Advisor

General Member

General Member

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What does Pay-Mech do?

Optics gives us their floating components, and we make them stay! (opto-mechanical)

Then we connect it all to the rails of the satellite. (structural)

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We ❤️ SolidWorks

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Rail Brackets (2-3 Sets)

Camera Mount

Foreoptic Mount

Lens Barrel

Grism Housing(?)

Camera

Foreoptic

Slit

Collimator

Focuser

Grism

Nut

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🏗️System Architecture

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Requirements

Mech

Optics

Thermal

Launch

Related to…

Satellite integration

Mass/Volume

Components

Mass/Volume

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Phase C Completion Criteria

Mechanical architecture at the fidelity of bill of materials (BOM), mass budget, spatial model, assembly plans

High-fidelity prototype of the Payload Mechanical spatial model to acquire assembly practice for unit-level assemblies

At least one iteration of structural, thermal, optical performance (STOP) analysis on flight payload

At least one iteration of each quasi-static, random vibration, and natural frequency FEA simulations

Assembly and integration plans

🟩SHALL

🟦SHOULD

🟩SHALL

🟦SHOULD

🟦SHOULD

🟩SHALL

🛑

🔧

🔧

📊

🔭

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📜Engineering Artifacts

1

3

2

Overview: Our Optomechanical Design!

Verification: Prototyping, STOP Analysis & NX Nastran

Details: Outgassing, Venting, & Stray Light

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Optomechanics - Parametric Model

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Structures - Camera Mount

Improvements: Thermal dissipation, high surface area, solved over-constraining.

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Optomechanics - Camera to Lens Barrel

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Optomechanics - Focuser

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Optomechanics - Grism

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Optomechanics - Collimator

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Optomechanics - Slit

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Optomechanics - Slit Rotation

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Optomechanics - Foreoptic

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Optomechanics - Section View

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⚠️Risk Management - Outgassing & Stray Light

Both risks mitigated through the correct use of venting holes

  • One hole given to every enclosed volume between optical components.
  • Volume/Areahole ≤ 5080cm, but even simple “labyrinth” slows down change in pressure differential. Worth modelling?

Relevant Requirements:

  • Stray light “on the order of a few percent”
    • Met with T-shaped design
  • Material Total Mass Loss (TML) 1.0 %
  • Collected Volatile Condensable Material (CVCM) ≤ 0.1%

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🦾Design Verification Methods Before Testing

Prototyping

  • Completed 3D printed prototype on previous design
    • Revealed necessary fillet locations and tight interfaces
  • Protolabs manufacturability test
  • Received manufacturing quote (sanity check)
  • Upcoming plans:
    • 3D print low-fidelity for assembly plan & early issue discovery
    • Metal for high-fidelity

Simulations (FEA) - NX Nastran

  • Quasi-Static - IPR
  • Random Vibrations - IPR
    • Confirm adequate performance before Phase D vibration testing
  • Natural Frequency - To Start

Structural, Thermal, Optical Performance (STOP) Analysis

  • Responsible for intermediate step of translating thermal model results to physical displacements of optical surfaces

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🚶Next Steps

🔨Phase C Completion�

  • Brainstorm, evaluate, and finalize grism mounting
    • Constraints? Preload?
  • Adjusting design based on:
    • Optics’ component selection
    • Simulation results
    • Prototyping
    • Collaboration with Thermal, addition of insulating/conducting materials
    • Tolerance analysis
    • External Design Review feedback :)
  • STOP Analysis
    • Successful iteration on single lens, then complete on some payload, then actual payload
  • Assembly Plan

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Audience Q&A

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🚶Next Steps

🚀Phase D�

  • Purchasing OTS components
  • Manufacturing custom components
  • Assembly on clean table with Optics, using developed assembly plan
  • Testing
    • TVAC w/ Thermal
      • Outgassing!
    • Vibration w/ Mechanical
  • Iteration!
    • Allow time for things to go wrong during AIT!

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Mechanical

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Meet the Mechanical Team!

Sakeena Q.

Mechanical Lead

Riaab Z.

Mechanical Engineer

Farzin R.

Mechanical Engineer

Ethan J.

Mechanical Engineer

Tomi W.

Mechanical Engineer

Yume Y.

Mechanical Engineer

Chris Z.

Advisor

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Mechanical Overview

  • Develop the structure of the satellite�
  • Design within mass and volume constraints�
  • Make sure we can withstand vibrations

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Mechanical Overview

CAD Models

Prototyping

Drawings

Testing

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Requirements

Wires: Avoid obstructing wires connecting to PCBs and RF components

Vibration Testing: Perform vibration testing to launch provider levels

Volume: Fit components within 3U+ cubesat volume

Mass: Adhere to mass allocation outlined by mass budget

Many of our other requirements involve the placement of different components of the satellite.

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Phase C Completion Criteria

SHALL - Final Spatial Model and BOM

SHOULD - Iteration of Vibration Testing Simulations

SHALL - Assembly and Integration Plan

SHOULD - Acquire Assembly Practice for Unit-Level Assemblies

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FINCH Assembly

FINCH can be split into two main subassemblies in the Z direction.

  • Top Sub-Assembly: This sub assembly includes the electrical stackup and uses the +Z panel as the foundation to build on

  • Bottom Sub-Assembly: This subassembly holds the rest of the components and uses the -Z panel and rails as the foundation to build on

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Top Subassembly

  • All components mounted with M3 threaded rods, separated by standoffs and brackets

  • Two brackets connected to the rails for structure

  • Stack order from top to bottom

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Bottom Sub-assembly

  • All components are mounted through the rails
    • Movement of the star tracker and the payload can be expected to be similar since force travels through the rails

  • Missing the deploy switch which will be added to the bottom of the sub-assembly

  • Moving the RF splitter/combiner to this subassembly to optimize volume

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Splitter/Combiner Placement

  • We are looking into how we can place the splitter/combiner in the bottom subassembly to give the payload a greater allowable height

  • Placed next to one of the sides of the Star Tracker

  • Payload + board get ~20 mm more space

  • Mounting: Most likely directly onto rails

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Panels and Rails

-Z panel

+Z panel

Rails (x4)

  • Panels and rails are anodized
  • Helicoils are used as connections to take more force
    • e.g. +Z panel supports stackup rods
  • -Z panel has 70 venting holes 1mm in diameter
    • Meets venting requirement
    • Farther away from electrical components

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Side Panels

Radiator Panel

8-cell Panel

2X Antenna Panel

  • Panels on the remaining faces of the satellite
    • +X : Radiator Panel
    • -X : 8-cell Panel
    • +Y & -Y : Antenna Panel

  • Cutouts on the radiator panel for star tracker and splitter/combiner testing (positions not yet finalized)

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Battery Pack

  • Holds four 21700 batteries
  • Mounting interface with the stackup and rails
  • Solder conducting strip directly onto the battery
  • Simple assembly minimizing mass and volume
  • 24.8mm tall

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Star Tracker & Mounting

Design Considerations:

  • Centering the lens circle for optimal field of view
    • Must be 25.4°

Design Overview:

  • Simple rail-mounted bracket
  • Cutouts for wiring
  • Bottom-mounted panel, connector facing top

Current Integration Challenges:

  • Creating room for the Micro D connector

Future Steps:

  • Redesign the mount to fit splitter/combiner
  • Conduct simulations and tests to validate solutions

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Assembly Fixtures

Bottom Fixture:

  • -Z Panel mold to hold the base
  • Rubber pads to prevent slipping
  • 2 fixed rail supports
  • 2 detachable rail supports
  • Cutouts for fasteners
  • Will have rail holders to prevent rails falling inward

Top Fixture:

  • +Z Panel mold to hold the base
  • Rubber pads to prevent slipping
  • Cutouts for easy removability of parts
  • Will be used to assemble the top half upside down
  • Contains support at bottom of the hole

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Prototyping

  • Validating designs and testing
  • 3D printing 1:1 scale PLA filament models
  • Assembly by using soldering tools
  • Advance to CNC machining

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Vibration Testing - Key Information

  • Verify compliance and establish confidence that:
    • Hardware can withstand and function after exposure to the highest load during the mission (strength verification + verification that alignment of critical parts is maintained)
    • Electronic connectors remain seated during the launch environment
    • Satellite will maintain general integrity
    • Sine vibe, random vibe, sine sweep
  • Vibe test the payload separately
  • Use a mass model in place of the payload

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Vibration Testing - Future Research Goals

  • Further research into testing the payload and defining the tests the payload will go under
  • Simulate vibe testing of FINCH with the NX simulations
  • Create a pass/fail criteria to compare when vibe testing
  • Create a final procedure to vibe test FINCH

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Risk Management

Exceeding Mass

Likelihood: 3

Severity: 3

Monitor the top-level assembly CAD of finch to ensure all components fit within the allowable volume. At the end of phase C, create a 1-to-1 full prototype.

Mass Imbalance

Likelihood: 3

Severity: 4

Continuously monitor the mass properties throughout the design process in SOLIDWORKS. Work with ADCS to ensure mass properties are acceptable.

Exceeding Volume

Likelihood: 3

Severity: 3

Monitor the top-level assembly CAD of finch to ensure all components fit within the allowable volume. At the end of phase C, create a 1-to-1 full prototype.

Testing Fatigue

Likelihood: 2

Severity: 4

Conduct further research. We could also plan to incorporate fatigue analysis into development testing to identify areas of concern early on.

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Next Steps - Phase C

Final Spatial Model and BOM

  • Placement and mounting for splitter/combiner
  • Deploy switch
  • Finalize rest of assembly

Vibration Testing

Simulations

  • Build experience with vibe testing simulations on NX
  • Run simulations with final CAD model

Assembly and Integration Plan

  • Continue fixture design
  • Start making assembly instructions

Assembly Practice for Unit-Level Assemblies

  • Finish full prototype during fall semester

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Audience Q&A

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Thermal

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Thermal’s Mission

To design the thermal control of the satellite, ensuring all components are maintained within the allowable temperature limits for all operating modes of the vehicle, in all of the thermal environments they may be exposed to.

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How we do what we do

Requirements

Electronic Design

Surface Design

Update Model

Temperature Results

NX Model

(based on CAD)

Celebrate 🥳

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Meet the Thermal Team!

Not photographed:

Kevin Dai

Kotaro Murakami

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Thermal’s Requirements: what are we designing for?

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Thermal System Architecture

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Thermal’s Phase C Completion Criteria

  • SHALL: Complete requirements model that captures all thermal requirements
  • SHALL: Thermal control architecture at the fidelity of
    • bill of materials (BOM)
    • thermal model
    • test plans (TVAC Cycling and TVAC Bakeout)
  • SHALL: At least one iteration of structural, thermal, optical performance (STOP) analysis on flight payload

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Thermal’s Phase C Completion Criteria:

Where are we now?

  • SHALL: Complete requirements model that captures all thermal requirements
  • SHALL: Thermal control architecture at the fidelity of
    • bill of materials (BOM)
    • thermal model
    • test plans (TVAC Cycling and TVAC Bakeout)
  • SHALL: At least one iteration of structural, thermal, optical performance (STOP) analysis on flight payload

IN PROGRESS

IN PROGRESS

*

*

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Thermal Engineering Artifacts

NX Model

Surface Design Project

Bakeout Trade

Goal: create a model of FINCH on Siemens NX to conduct thermal analysis of the satellite through finite element analysis.

Goal: determine a combination of thermo-optical tape to maintain the outer panels of the satellite within a reasonable temperature range.

Goal: research into standards and methodology to decide how the team will conduct Bakeout for FINCH.

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Siemens NX Model

Current Progress:

  • Complete NX Model with power budget heat loads and conductances for an old model of FINCH�
  • Calculated heat paths to obtain contact conductance values

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Siemens NX Model

Next Steps:�

  • Update model based on newer models of FINCH, including the calculation of new or modified heat paths�
  • Find a better way to work iteratively and quickly on NX�
  • Model temperatures of internal components in the satellite (e.g. payload, batteries, boards)

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Bakeout Trade

What went down:

  • Decision to conduct bakeout with FINCH in sub-assemblies

Next Steps:

  • Creating a contingency plan in case of failure
  • Encoding potential risks in the Risk Register and researching into mitigation strategies
  • Collaborating with Mechanical on Assembly plan and bakeout sub-assemblies

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Surface Design Project: Introduction

Temperature dependent on absorptivity and emissivity.

Absorbed Heat

Sun

Earth

Satellite

Internal Heat

Emitted Heat

We use tape to maximize emissivity.

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Surface Design Project: Process

calculate absorptivity, emissivity

MATLAB Nodal Simulation

record data

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Surface Design Project: Current Progress

The Radiator Panel SHALL have the highest emissivity (therefore lowest temperature)

The solar panels should be maintained as close to 25°C as possible

No tape on the solar panels or antennas

Requirements

1

2

3

Final Taping Scheme

+X Panel

-X Panel

±Y Panel

±Z Panel

100%

0%

0%

0%

(Taped)

Hot Avg.

13.9°C

Cold Avg.

11.3°C

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Surface Design Project: Current Progress

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Surface Design Project: Next Steps

2

Create assembly documentation

1

Verify taping scheme on NX

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Thermal Risks

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Thermal Risk: Bakeout Reassembly Contamination

Following the decision to do bakeout in sub-assemblies, there are risks of reintroducing contaminants during the assembly process. This would negate the effect of doing bakeout.

Mitigation strategy: Develop strict cleanroom guidelines and handling procedures, especially for after Bakeout

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Thermal Risk: Bakeout Reassembly Contamination

Next steps to mitigate the risk

What’s been done to mitigate the risk?

  • Research into handling standards for after bakeout
  • Research into necessary precautions to avoid recontamination
  • Develop and formalize post-bakeout handling and assembly procedures with Mechanical

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Thermal Risk: Discharge Overheating

Unexpected heavy demands on FINCH’s batteries may cause them to rapidly discharge, generating heat in the process. This increased heat may temporarily warm the batteries beyond their operating temperature, decreasing their lifespan and increasing the chance of unexpected failure.

Mitigation strategy: Designing the heaters to respond to high levels of discharge by turning off/decreasing heat from batteries

  • Taking into account a thermal margin when designing the control loop to decrease chances of overheating

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Thermal Risk: Discharge Overheating

Next steps to mitigate the risk

What’s been done to mitigate the risk?

  • Thermal Budget already accounts for thermal margins in operating temperatures of components
  • Firmware to develop control loop for heater based on Thermal Budget

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Thermal Risk: Thermo-optical Tape Effectiveness

The effectiveness of the thermo-optical tape that will be applied to the outer panels of FINCH may decrease without proper handling practices.

Mitigation strategy: Documenting proper handling practices for the tape in the Handling & Care database and adhering to his protocol.

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Thermal Risk: Thermo-optical Tape Effectiveness

What’s been done to mitigate the risk?

  • Research into handling procedures and documentation on Handling & Care database
  • Risk managed!

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What’s next for Thermal?: Wrapping up Phase C

As the design of FINCH changes, so could its thermal design.

Key pieces to meeting completion criteria:

  • Continue to update our Thermal Model on NX as the design of the satellite changes
  • Simulate heater and passive control on NX to verify our design decision
  • Simulate internal components on NX and obtain temperature trends to determine if additional thermal control is needed
  • Testing of components prior to integration with other systems
  • At least one iteration of STOP Analysis on the flight payload

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What’s next for Thermal?: Looking into Phase D

  • Preparing mass tracking procedures for Bakeout�
  • Finalizing Bakeout handling procedures and contingency plan�
  • Finalizing TVAC and Bakeout testing locations during the Winter (assuming they will be conducted by next summer)

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Audience Q&A

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Attitude Determination and Control Subsystem (ADCS)

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Team Introduction

Ben Bornstein

ADCS Lead

Connor Wilson

Attitude Planning Head

Dheekshitha Palanikumar

ADCS Firmware Engineer

Emma Drapeau

AIT Engineer

Harry Wang

AIT Engineer

Khang Nguyen

ADCS Advisor

Christine Marian

ADCS Advisor

Vishwanath wimalasena

AIT Engineer

Vanessa Lu

ADCS Electrical Engineer

Thardchi Ganesalingam

Electrical AIT Head

Aniketh Salil

AIT Engineer

Shrivardhan Mishra

Mathematical Modeling Head

Oliver Petrovic

AIT Engineer

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What does ADCS do?

Our goals are as follows:

  1. To ensure our selected components meet FINCH ADCS requirements.

  • To provide FINCH with the capabilities required to perform comprehensive Modes of Operation.

  • Verify our integration of the ADCS module + Star Tracker through environmental testing.

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ADCS Completion Criteria

  • SHALL: Complete requirements model that captures all ADCS requirements

  • SHALL: ADCS architecture at the fidelity of bill of materials

  • SHALL: ADCS test bench architecture at the fidelity of bill of materials, spatial model

All Completed

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Requirements Model

33 Requirements

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ADCS Requirements

Requirement

Value

Control

<0.6 deg (2160 arcsec)

Jitter

<0.002 deg (7.2 arcsec)

Knowledge

< 0.002 deg (7.2 arcsec)

Power

<< 20 W

Mass

< 800 g

ADCS-10m

Sagitta Star Tracker

Performance:

  • Control: 0.46 deg (1800 arcsec)
  • 10ms Jitter is <1 arcsec
  • Knowledge: Cross-boresight accuracy 2 arcsec (1-sigma), Around boresight accuracy 20 arcsec (1-sigma)

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ADCS System Architecture

  • Register Map: the interface where the user exchanges data, such as status flag, reference quaternion, sensor output, etc. ADCS-10m provides UART and I2C to read/write the register map.
  • FSM: performs the attitude determine and control algorithm according to the settings inside the register map.
  • Hardware Peripheral: offload the FSM computation effort by buffering the sensors’ data and modulating the control signal.

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Components Selected

  • 10ms Jitter is <1 arcsec ✅
  • Control is 200 arcsec ✅

  • Knowledge is 10 arcsec* ✅

*Knowledge depends heavily on slew rate (unless we use fine pointing instead)

  • < 600 g ✅
  • < 2.4 W ✅

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ADCS Components

Other sensors: GNSS, IMU, Magnetometer

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Control Moment Gyro -10M

Specification

Values

Angular Momentum Storage

< 10 mNms

Torque

< 1mNm

Inner rotor speed

< 5 rpm

Power consumption

@ 5V bus: <1 W�@ 3.3V bus: < 1 W

Mechanical

Tuna-can (<250 g)

Interface

I2C or UART

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Fine Sun Sensor - 15

Specification

Value

Field of view (FOV)

± 60 deg (± 45 is optimal )

Accuracy

± 0.1 @ 45 deg (1-sigma)�± 0.5 @ 60 deg (1-sigma)

Sampling rate

Max 16 Hz (adjustable)

Current consumption @ sampling

< 2 mA

Current require @ IDLE

< 0.5 mA

Mechanical

22 x 15 x 5.26 mm (< 4g)

Radiation tolerance

> 10 krad

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Magnetorquer (ADCS -MTQ)

Specification

Values

Power consumption

@ 5V bus < 1W�@ 3.3V bus < 1 W

Magnetic dipole moment

< 0.2 Am^2 for Y and X direction�< 0.1 Am^2 for 1 axis

Mechanical

0.2 U (< 140 g)

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Star Tracker (ArcSec Sagitta)

Specification

Values

Cross-boresight accuracy

2’’ (1-sigma)

Around boresight accuracy

10’’ (1-sigma)

Update rate

10 Hz

Power Consumption @ Nominal

1500 mW

Mass

270g

Features:

  • Star tracking and attitude determination
  • Full image download capability
  • Image histograms
  • Prevent lost-in-space algorithm

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ADCS Control Modes

Condition 1: Soft Error or tumbling rate > 360 deg/second or soft error occurs (over-temperature, over-current, under-voltage, hardware reset)

Condition 2: Tumbling rate = 5 deg/second ~360deg/second and rotor speed > 1000 rpm. (Using B-dot)

Condition 3: Tumbling rate > 5 deg/second.

Condition 4: Target lost

Condition 5: Sun vector invalid

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Safe Mode

Safe Mode was the initial state of ADCS-10m when the EPS powered it up. No actuator ON but keep monitoring and updating the system status.

NO Attitude Control or Determination will be done. Lowest Power Consumption

Trigger: Cond 1 occurs or manually triggered

Task: ADCS-10m measures all sensor and actuator states, e.g. magnetometer, FSS and IMU measurements; VSCMG wheel rate; temperatures, and power consumption, etc.

Output:

The measured results are stored inside the register map, including

1) Actuators, sensors, and CSS status.

2) Attitude and attitude rate determination (tumbling rate).

3)Satellite position in the geodetic coordinates.

4) the temperature of all devices (ADCS,CMG,FSS)

5) Magnetometer measurement.

6) The instantaneous power consumption of 3.3V and 5V bus

Termination:

Tumbling rate = 5 deg/second~360deg/second and rotor speed > 1000 rpm. ADCS-10m switches to De-tumbling Mode and gradually dumps the angular momentum.

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Detumbling Mode

Satellite tumbling rate is larger than 360 deg/sec. This mode uses the 3-axis magnetorquer.

Use B-dot control law for detumbling. Take less than 12 hours

Trigger: ADCS-10m automatically enters De-tumbling Mode when tumbling is detected, except for Safe Mode momentum dumping or manual triggering.

Task: ADCS-10m monitors system status and updates. Actuators exert torque to slow down the satellite's tumbling rate.

Input: OBC can feed in TLE or GNSS information; the ADCS-10m will then perform attitude determination. (optional)

Output: The system status registers, power, and temperature included in Safe Mode are updated. If OBC provides TLE or GNSS information, we can get an estimate attitude

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Sun-pointing Mode

During Sun-pointing Mode, the satellite will spin to stabilize this sun-pointing axis.

Result generated using Tensor Tech

Trigger: User manually Set.

Task: When the sun appears

in the field of view and the satellite is not in eclipse, ADCS-10m keeps the configured vector pointing to the sun.

Input: OBC feed in GNSS signal (Optional).

Output: Update the register map, sun vector, estimate attitude

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Fine Pointing

We define the attitude quaternion and the ADCS-10m will rotate the satellite accordingly.

Note: The bandwidth of the ADCS-10m is only ~0.5Hz. commands should be controlled within 5 deg/second.

Trigger: User manually Set.

Task: Given the desired attitude quaternion and specify its reference frame, ADCS-10m set that quaternion as a reference in the control loop.

Input: TLE + current time or GNSS information is required. When sending the commands, the reference frame and the attitude quaternion should be given by the OBC.

Output: The system status, tumbling rate, sun vector, and estimated attitude registers are updated

every control cycle.

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LVLH Mode

Perform Nadir pointing

Trigger: When the satellite cannot see the target in Target Tracking Mode, ADCS-10m automatically switches to LVLH Mode or manual input by user.

Task: Performs automatic earth pointing, and aligns the satellite to the orbit velocity vector.

Input: GNSS information is required for ADCS-10m to determine the reference frame. A reference quaternion is necessary.

Output: The system status, tumbling rate, sun vector, and estimated attitude registers are updated every control cycle.

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Target Tracking Mode

FINCH mission requires the satellite to do Earth observation at certain location on the earth the Target Tracking Mode is use. The satellite will be controlled to stare at a target.

Trigger: User manually Set.��Task: ADCS-10m monitor system status and update register map while pointing to the target on the earth.

Input: OBC specifies the target’s latitude, longitude, and altitude. TLE or GNSS information is required for ADCS-10m to determine the reference frame. reference quaternion is necessary.

Output: The system status, tumbling rate, sun vector, and estimated attitude registers are updated every control cycle.

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ADCS Test Bench (Operations Testing)

Goal: To verify our integration of the ADCS module through environmental testing.

Test Bench:

  • 3 Axis Helmholtz Cage
    • Variable field strength (2 Gauss Max)
    • T-Slotted Aluminum Frame
    • 6061 Aluminum U-Channel
    • 3D printed Connectors

  • Air bearing platform ( A-652.045)
    • +/- 45° Tip/Tilt
    • 25kg max payload
    • 75mm diameter
    • Non Ferrous
    • @ 80 PSI filtered air supply.

  • Secondary Equipment (GNSS Simulator, Sun Simulator)

All tests will occur within a cleanroom environment. A functional “Test Stack” will be developed with a harness to minimize risk to non essential FINCH components.

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ADCS Test Bench (Operations Testing)

Test Bench Electrical Setup:

  • 16 Gauge AWG wire

  • Siglent SPD3303X-E - Programmable Linear DC Power Supply (3 Channels, 220W, 3.2A)

  • Cytron 20A 6V-30V Dual DC Motor Drivers

  • DAOKI 3V-5V GY-273 QMC5883L Triple Axis Compass Magnetometer Sensor Module

Goal: To verify our integration of the ADCS module through environmental testing.

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ADCS Test Bench Prototype

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ADCS Test Bench Prototype

What have we done since then:

  • Reconstructed the capstone prototype and began testing.

  • Redesigned corner U-Channel Harness

  • Began a GUI overhaul for GNSS accessibility and live mapping for the magnetic field strength.

  • Testing with external magnetometer and repeat testing in other sample circuits.

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ADCS Testing Procedures

Environment: Static Magnetic field, Sun source, GNSS signal

  1. Rough Pointing Test (We have received reference data for this and are processing)
    1. Ensures that the FINCH’s pointing system is accurately aligned and capable of performing its intended functions.

  • Torque Test
    • Verify that the ADCS module can produce a suitable range of torque in a pointing maneuver.

  • Detumbling Test
    • Verify that satellite can stabilize after being imparted with random spin during deployment.

Further tests (including a dynamically changing environment test) are still in development.

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ADCS Test Bench Timeline (What we wanted to happen)

Sept 7 : Power Supply and Wiring Setup

  • Set up the power supply and wiring for the Helmholtz coils.
  • Develop code for controlling power supply with safety features/error checks
  • Initial power-up and basic functionality testing
  • Write scripts to monitor power levels in GUI

Sept 30 : Coil Pair Construction

  • Machining of 8 U-Channels
  • Construction of Corners
  • Wiring the coils with 16 gauge AWG wire

Sept 21: Sensor Integration

  • Mount and connect current sensors and magnetometers to the system
  • Implement code to read data from the current sensors and magnetometers. Write calibration routines and ensure accurate data capture.

Oct 5: Control System Integration

  • Develop and integrate the PID algorithm with the power supply to regulate current in the coils.
  • Unit test the control system's response to various inputs.

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ADCS Test Bench Timeline

Oct 19: GUI and Software Integration

  • Refine the GUI to display real-time data and add controls for user interaction.

Nov 2: System Testing and Validation

  • Create test plan and perform system testing.
  • Make final adjustments to hardware, control code and GUI.

Nov 30: Final Review

  • Review and finalize all code, ensuring everything is well-documented.

Oct 29: All Coils Constructed + Slotted Structure Constructed

  • Machining of T-slotted aluminum
  • Structural integrity tests.
  • Uniformity and field strength tests.

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Attitude Planning

  1. Predict ADCS impact on image quality

  • Develop general tools to use for analysis

  • Expand tools for use in mission planning

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Visualization + Analysis

Standardized data for simulations leads to flexible tools

Ex 1: Line-of-sight visualization

Ex 2: Rotation error from simulation

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Imaging Method: LVLH (Nadir w/ Offset)

Ground track velocity: ~7000 m/s

Scanline rate: 60 Hz

Distance between scanlines: ~120 m

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Risks

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Next Steps

Assembly and Integration (Remains the same):

  1. Arrival of ADCS module
  2. Integration in softstack
  3. Configuration (registering settings for sun pointing, fine pointing, mechanical properties and more)
  4. Integration into “test stack” for systems testing

Test Procedures:

  • Formalization of existing and new ADCS tests.
  • Development of Test stack
  • Conducting Tests, analysis and configuration.
  • Confirming rotations within STK.

Attitude Planning:

  1. More visualizers and plots
  2. Derive more useful quantities from simulations
  3. Create API and integration with openMCT

Development of Test Bench:

  • Machining of Coils
  • Assembly of air bearing (Waiting to arrive).
  • Assembly of frame.
  • Furthering the development of the GUI (Mostly done)
  • Electrical Integration (Partially done)

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Audience Q&A

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Lunch 🥪

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Audience Q&A

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Electrical

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Order

  • System Overview
  • On Board Computer (OBC)
  • Payload Electrical (PAY)
  • Electrical Power System (EPS)
  • Radio Frequency (RF)

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Requirements

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System Overview

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Timeline

Jan 2024

DevKitSat Complete

May 2024

FlatSat Start

Jul 2024

OBC Complete

Sep 2024

PAY, EPS Complete

Nov 2024

Integration, Testing

We are here!

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What Is “Done”?

  • Individual boards designed, assembled, tested
    • Boards are form-factor accurate
    • Boards are functional, but may require a minor respin
  • Interconnects planned
  • ICD finalized

“Electrical/hardware architecture at the fidelity of bill of materials (BOM), spatial models, wiring schematics, test plans.”

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Integration Risks

  • Coming together is hard
    • Mitigation: common bus spec

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OBC

🧠

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The Team

Reid Sox-Harris

ECE2T4+PEY

Eun Gu Kang

ECE2T6

Coby Silayan

Physics III

Karthik Purushotham

ECE2T6

Aliya Bayer

ECE2T6

Andy Gong

ECE2T6

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Umbilical

  • Allows for debug, test, charging on the ground
  • OBC breaks out to other systems
    • SWD, UART per MCU

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Where We’ve Been

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Where We’re At

  • Boards arrived!
  • Next steps: bringup

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PAY

📷

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Tau Backpack

  • Problem: Hirose DF12 connectors hard to solder
    • Limited mating cycles

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Tau Backpack

  • Solution: Connector saver/backpack/adapter/whatchamacallit
    • Data over FFC (Flexible Flat Cable), power over Molex PicoBlade
    • Adds 1.6mm of thickness to camera

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Where We’ve Been

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Where We’re At

PAY is carrying high levels of risk.

  • Many untested interfaces (electrically and firmwareilly)
    • Inc. camera interface, SD cards
    • Building a “dummy camera” to help alleviate this
  • v1 board in progress, will likely require respin

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Audience Q&A

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Power

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Team Introduction

💡 Responsibility: To generate, store, and distribute electrical energy to FINCH’s subsystems.

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Requirements Model Overview

💡 Responsibility: To generate, store, and distribute electrical energy to FINCH’s subsystems.

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System Architecture Overview

💡 Responsibility: To generate, store, and distribute electrical energy to FINCH’s subsystems.

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Generate

  • 1W PV cells covering 3 sides of FINCH
    • 3 panels
    • 5, 5, and 8 cells
  • Solar charge controller for each panel

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Generate: Load Sharing

  • 2-input current charing controller

High-level schematic of generation:

Load share theory:

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Store

  • 21700, 4900 mAh, Lithium Nickel Manganese Cobalt Oxide cells in 2S2P
  • Reports state of charge

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Distribute

  • Three voltage levels
  • Load switches turn subsystems on/off by mode

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Distribute: Load Switches

  • Switch components on/off based on:
    • Operating mode
    • Telemetry (e.g. thermistors, battery state of charge)
    • Faults

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Distribute: Load Switches

  • I2C expander to simplify control & addressing
  • OBC and the SRS-4 always on
  • Too many components! Can improve?

Load Switch:

Load Switch:

I2C Expander:

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Monitor & Protect

  • Already covered:
    • load monitors
    • rev. current diodes
    • buck voltage control
  • Focused on battery & solar panel output

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Monitor & Protect: Power Mux

  • Made of two e-fuses (common implementation)
  • GSE power can be plugged in “at” the solar panels or batteries

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Phase C Completion Criterium

“Electrical/hardware architecture at the fidelity of bill of materials (BOM), spatial models, wiring schematics, test plans.”

⭐ BOM & schematic

⭐ Spatial models

80%

⭐ Test plans

80%

25%

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Engineering Artifacts

5V2 Buck Converter

Solar Power STK Sims

Power Point Control

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(efficiently)

What is a Buck Converter?

High Voltage

Low Voltage

  • FINCH’s solar panels provide high voltage (~19V, ~12V)
  • Subsystems run on lower voltages (5.2V, 3.3V)

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5V2 Buck Prototypes for FINCH

  • Output voltage below expectation
  • Ripple too large

Prototype #1

Prototype #2

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  • Solar panels provide maximum power at a specific voltage level

  • MPPC devices ensure that this voltage level is consistently drawn

What is Maximum Power Point Control (MPPC)?

almost vertical line

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Maximum Power Point Control (MPPC) for FINCH

Solar Array 2

MPPC 2

Solar Array 3

Solar Array 1

MPPC 1

MPPC 3

  • Each solar array gets its own MPPC

  • The maximum power voltage level varies with the number of solar cells in series

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Solar Panel Energy

Goal: How much power and energy do our solar panels bring in?

Method: Ansys Systems Toolkit (STK)

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The Problem

  • STK’s default 3D models don’t reflect FINCH well at all

  • We need a custom model

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Custom Model

  • New model of the cubesat satellite

  • 8 solar panels on both sides and 5 solar panels on the front face.

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The Simulation

  • 48 Hours From 0:00:00 August, 1, 2026 To August, 3, 2026

  • Two Modes:
    • Nadir-pointing
    • Sun-pointing

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Red

= Solar Cells

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Solar Panel Power

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Solar Panel Power - Zoomed In

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Risk Management - Examples

Description

Management Strategy

Risk Score (L x S)

PV cell damage

  • Short lead time
  • Purchased 16 testing cells
  • Assembly on clean table

4

Board damaged from testing and assembly

  • Buy part backups ahead of time
  • Test in teams

2

Unexpectedly low efficiency & high IR in distribution

  • Chip wars
  • 20% distribution loss
  • 20% power margin

6

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Risk Management - Overview

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“Electrical/hardware architecture at the fidelity of bill of materials (BOM), spatial models, wiring schematics, test plans.”

Next Steps

  • Distribution system rev2
  • Battery monitor trade
  • Battery charger
  • Load sharing
  • Flight solar panels

Spatial Models

  • Solar panel & battery tester board

Test Plans

BOM & Schematic

*EPS should also test itself and make an ICD before entering phase D

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Audience Q&A

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RF & Ground Station

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GNSS

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GNSS

Receiver Module: SkyTraq Orion B16

GNSS Antenna: Taglos ANT

L1 Band: 1561-1601 MHz

Component and System Level Testing by TensorTech

Expected Arrival: October 2024

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When October comes…

Utilizing the GNSS Simulator from the ADCS Test Bench

[Spirient GSS7000]

Supported Constellations:

GPS, GLONASS, GALILEO, BEIDOU, QZSS

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On-Board RF

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System Overview

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This time last year…

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Requirements

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Our Antenna Designs

Liam:

Coby:

Swarnava:

Jessica:

PLACEHOLDER

PLACEHOLDER

PLACEHOLDER

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System Overview

GNSS: On the +Z tunacan

Antenna Panel on the +Y, -Y for the Dual S-band Patches

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Transceiver

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Splitter/Combiner

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System Overview

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Ground Station

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System Overview

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THE DISH

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THE FEED

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AZEL Rotator

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LNA

30 dB

43 dB

Power Amplifier

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BladeRF xA4

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Bill of Materials

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Field Trip to Burton Tower

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Next

Steps:

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Audience Q&A

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Mission Operations

Houston, we don’t have a problem!

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Meet The Team!

Max Michet Team Lead

Hetvi Soni

Operations Engineer

Nojan Ahmadi

Operations Engineer

Riaab Zahid

Operations Engineer

Cristhian Quinonez

Operations Engineer

Belle Lu

Operations Engineer

Atharva Desphande

Operations Engineer

Mohammed Budhwani

Operations Engineer

Sami Kdhair

Operations Engineer

Zack Wilson

Previous Lead

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System Architecture

Mission Ops

We define how FINCH operates when its in space!

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Phase C Completion Criteria

Pay-Mech

30%

  • First Draft of Mission Control Center
  • Operations Requirements
  • Command List
  • MOOs Sequence Diagrams
  • Clean-Bench

95%

75%

70%

95%

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Engineering Artifacts

Mission Ops

2. Ground Ops Mission Control

1. Modes of Operations Development

3. Clean-bench Trade

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1. Modes of Operations

On-Board Processing

Mission Ops

Passive Modes: Modes that can be interrupted at any time

Follow-Through Modes:

Must execute to completion prior to returning to Idle mode, unless there is an emergency

Imaging

Downlinking

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1. Modes of Operations

Mission Ops

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What Happens If There’s a Failure?

Downlinking

On-orbit Processing

Imaging

Idle

Non-Nominal Mission Cycle

LEOP

Safety

Ex: Failure during on-orbit processing

Mission Ops

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1. Modes of Operations - Requirements

Mission Ops

  • Each mode is illustrated with a sequence diagram that outlines the necessary actions upon entering that mode.

Mode of Operation Requirements

Action Sequences

Mode Transition Requirements

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1. Modes of Operations - Requirements

Mission Ops

Mode Transition Requirement

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1. Modes of Operations - Requirements

Mission Ops

Mode of Operation Requirement

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1. Modes of Operations - Idle

Mission Ops

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1. Modes of Operations- Imaging

Mission Ops

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1. Modes of Operations - On-Board Processing

Mission Ops

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1. Modes of Operations - Downlinking

Mission Ops

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1. Modes of Operations- Safety

Mission Ops

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2. Ground Ops - Mission Control

  • System architecture diagram for ground segment
  • The RF team in charge of building the ground station
  • Missions Operations to develop a user friendly UI to send/receive information and commands to/from FINCH

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2. Ground Ops - Mission Control

Mission Ops

  • Serve as the front-end for the ground station
  • Facilitate data reception to and from FINCH
  • Develop using OpenMCT, an open-sourced NASA web-application framework

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2. Ground Ops - Mission Control

Subsystem Status Details

Telemetry Data Feeds

Historical Data Plots

Mission Status Summary

Alerts and Notifications

Mission Ops

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2. Ground Ops - Mission Control

What’s next?

  • Come back to OpenMCT at a later date for FINCH or future satellites

  • Phase D: Develop user friendly mission command centre to send and receive commands to/from FINCH
  • Planning of commands/mission cycle

  • Phase E: use user friendly software/mcc to operate finch
  • When FINCH is launched monitor and send commands to the satellite
  • Work closely with RF team to operate the satellite

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3. Clean-Bench

Mission Ops

  • We need a clean/controlled environment going into to phase D of ISO level 7 or lower
  • Solutions explored:
    • Using another lab: restrained access
    • Renting lab space: too expensive
    • Buying a portable cleanroom: not approved by Myhal
    • Making a cleanroom: not approved by Myhal
    • Making a clean-bench: too risky
    • Buying a clean-bench: 💪

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3. Clean-Bench Trade

Mission Ops

1219 x 610 x 889 mm

  • Cheapest & Safest option: Laminar Flow Hood (Clean-Bench) Purair® FLOW Series laminar flow cabinets
  • Air cleanliness meets and exceeds ISO Class 5.
  • Energy saving LED lighting, EC blower motor
  • Vertical laminar flow with Multiplex™ HEPA Filtration
  • User-Friendly Design: Large front opening for unrestricted access
  • ~4000 CAD

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3. Clean-Bench Set up

Mission Ops

  • Purair® FLOW Series laminar flow cabinets
  • Expected to arrive by September latest
  • Main tool of integration and testing

of FINCH and future projects

  • Next steps: procedure for working in the clean-bench during AIT

Rendering of the clean-bench in our lab!

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Mission Ops Risks

Mission Ops

  • Main Risks are Operations & Mission Fulfilment Risks!
    • Failures onboard
      • Especially related to MOOs & transitions!
    • Mission cycles & timeline!

  • Error Tickets
    • Collection of possible failures for each subsystem during operation
    • Associated actions/procedures to take

🎟️

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Next Steps

Mission Ops

Phase C 💻

  • Mission planning/simulations/analysis - STK
  • Detailed sequence actions for onboard operations
  • Complete command list

Phase D 📡

  • Continue MCC development
  • Integrate MCC with ground station
  • Error tickets!
  • Plan ground operations/schedules

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Audience Q&A

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10-Minute Break

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Firmware

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Agenda

The Team

The Requirements

The Architecture

The Work

The Future

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Firmware? Who’s That?

Alex Apostolu

Kevin Caldwell

Eesa Aamer

Mirai Shinjo

Dheekshitha Palanikumar

Ryan Spagnolo

Ethan Jeng

Punya Syon Pandey

No Pictures:

Richard Li

Noam Tal-Siegel

George Fan

Jonathan Manuel

Winston Fournier

Ingrid Wu

Jiya Shah

Darshan Kasundra

Lu-Wai Wong

Christina Zhang

Claire Dimitriuc

Yousef Abdelhadi

Prithvi Seran

Khalil Damouni

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System Architecture

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Continuous Integration

BUILD

Compile Code for respective platforms

MERGE

Merge Working Branch into Project Main Branch

CODE ANALYSIS

Analyze Code for Complexity, Coding Standards, Code Coverage

REPORTING

Compile results of each Stage into a Log file

TESTING

Unit, Functional, Integration

System, Performance,

Hardware In Loop Testing

The Continuous Integration Cycle

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Firmware Interfaces

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The Requirements Model

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The Firmware Tree

Firmware-Interfaces

Pay-Elec

Interface

Telemetry

Storage

ADCS

Interface

Power

Interface

RF

Interface

Remote

Programming

FINCH-Firmware-Platforms

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System Diagram

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The Handlers

ADCS

Communicates with ADCS-10m, specifying reference frame, sending attitude quaternion, selecting mode

Power

Communicates with both the BMS and MPPT chip, facilitating battery charging

RF

Communicates with the SRS-4 Transceiver, obtaining uplinked messages and forwarding packets for downlink

Pay-Elec

Communicates with the Payload MCU, sending commands for image acquisition and getting status on image compression

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Engineering Trades

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ADCS Driver

Stage1:

Write code to READ

from and WRITE to

registers

Test the code on the

development kit

Stage2:

Implement the mode selection code as laid out in the Tensor Tech manual

Test it along with the

Helmholtz coil testing

procedure prepared by

the ADCS team

Stage3:

Implement the higher level code as

Customized by ADCS team and Mission Ops

Test it during Phase D

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ADCS Driver

Results Of Testing In Stage 1:

(Write Function)

Expectation Of Testing In Stage 1:

(Write Function)

MRST:

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RTOS

  • Our previous choice of RTOS was FreeRTOS.

  • In order to satisfy our FINCH-Firmware-RemoteProgramming requirement, we need a bootloader that is capable of switching binary images. We previously had a plan to utilize wolfBoot.

  • Integrating wolfBoot into our system requires extensive assembly level (register level) development. Although, this should be more robust and less work than developing our own bootloader.

* Bootloader is a program that runs first after power up

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RTOS (continuation)

  • Considering we are a student design team, integrating wolfBoot into our system is not feasible due to the significant amount of work required.

  • MCUboot is an alternative solution to wolfBoot. However, it is an OS-dependent bootloader that does not support FreeRTOS; instead, it supports Zephyr, Apache Mynewt, Apache NuttX, RIOT, Mbed, OS Espressif, and Cypress/Infineon.�
  • Therefore, we decided to switch to one of the RTOSs supported by MCUboot.

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Our decision

  • Remove CMSIS-RTOS2 and FreeRTOS and replace them with Zephyr

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Why Zephyr?

  • Zephyr is a Linux Foundation project.

  • Massive open-source community involvement: As of July 5th 2024, Zephyr has 2,162 contributors and 51,185 closed pull requests.

  • Zephyr provides detailed and user-friendly documentation.

  • The source code of Zephyr is well-maintained and adheres to high standards, making it easy to read and understand.

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Why Zephyr?

  • Zephyr is supported by many organizations.�ST, Linaro, and ARM are here!��

* source/credit: The Zephyr Project, a Linux Foundation Project https://www.zephyrproject.org/project-members/

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How the switch impacts us

  • We use the STM32CubeMX tool to automatically generate some of the code and use a GUI for I/O and CLK configurations. Zephyr does not provide a similar tool (everything is text / CLI-based), which may result in a significant learning curve for members.

  • Different interfaces: ST HAL is no longer used; instead, we will need to use the Zephyr API. Therefore, code already written must be rewritten. However, all underlying logic remains the same, so this should not be the most difficult task (We will still need to use ST HAL if no Zephyr API supports what we want to do. For instance, SDMMC).

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How the switch impacts us

  • On the other hand, since everything is CLI-based, automation becomes much easier (testing in general, CI/CD, etc.)

  • Zephyr is more feature-rich while FreeRTOS is minimal. Consequently, footprint size and performance overhead are concerns with Zephyr. Unfortunately, there is no proper study on this.

  • No more licensing issue we previously brought up! One less problem for #regulatory!

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Zephyr API vs ST HAL Example

Image on the left: Contains code and comments which are copyrighted © 2016 Intel Corporation; distributed under the Apache-2.0 license. Image on the right: Contains some code and comments generated by STM32CubeMX, which are copyrighted © 2022 STMicroelectronics.

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Remote Programming Handler

Perform remote device firmware updates

Format the updated firmware image into packets for transmission

Receive the packets on the H7 board and verify their integrity

Write the verified packets to a separate flash memory bank

Validate the firmware image by checking its signature

Execute a firmware image swap if the signature is valid, revert to the original firmware if the swap fails

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Remote Programming: MCUboot

*** Booting Zephyr OS build zephyr-v3.2.0-2310-gcebac69c8ae1 ***

I: Starting bootloader

I: Primary image: magic=unset, swap_type=0x1, copy_done=0x3, image_ok=0x3

I: Scratch: magic=unset, swap_type=0x1, copy_done=0x3, image_ok=0x3

I: Boot source: primary slot

I: Swap type: none

I: Bootloader chainload address offset: 0x40000

I: Jumping to the first image slot

*** Booting Zephyr OS build zephyr-v3.2.0-2310-gcebac69c8ae1 ***

nucleo_h743zi: Hello World!

This message is from image-0!

*** Booting Zephyr OS build zephyr-v3.2.0-2310-gcebac69c8ae1 ***

I: Starting bootloader

I: Primarya image: magic=unset, swap_type=0x1, copy_done=0x3, image_ok=0x3

I: Scratch: magic=unset, swap_type=0x1, copy_done=0x3, image_ok=0x3

I: Boot source: primary slot

I: Swap type: perm

I: Starting swap using scratch algorithm.

I: Bootloader chainload address offset: 0x40000

I: Jumping to the first image slot

*** Booting Zephyr OS build zephyr-v3.2.0-2310-gcebac69c8ae1 ***

nucleo_h743zi: Hello World!

This message is from image-1!

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Phase C Completion Criteria

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Next Steps

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Roadmap – Planning Phase D

Flight Code Guidelines

Integration Testing

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Audience Q&A

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Command & Data Handling

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Agenda

  • CDH Requirement Model
  • System Architecture
    • System Hierarchy
    • System Diagram
  • Engineering Artifacts
    • Parameter Service and Housekeeping Service
    • Firmware Operations Diagrams
  • Next Steps
  • Q&A

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The Requirements Model

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The Command & Data Handling Tree

CDH-CommandAndControl

OperatingModes

FlightSoftware

RTOS

NetworkLayer

CommandFormat

TelemetryToRF

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System Architecture

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System Hierarchy

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System Diagram

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System Diagram

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Housekeeping Service

HK

50 Hz

1. Collect telemetry data from subsystems

2. Log it to Logging Service

Pay Elec

OBC

HK

50 Hz

Logging

Service

CAN Bus

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Parameter Service

HK

50 Hz

Pay Elec

HK

50 Hz

Pay Elec

OBC

1. Stores references to global parameters

2. Access to add, change and get parameters

Parameter

Service

CAN Bus

ADCS

Handler

Logging

Service

Operations

Handler

satellite

orientation

satellite

orientation

satellite

orientation

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Firmware Operations Diagrams

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Phase C Completion Criteria

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Next Steps

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Roadmap – Finishing Up Phase C

TODO

Completed

In Progress

Housekeeping Service, Parameter Service, Logging Service

Software and External Watchdog Timer

Full Port to Zephyr

Other UTAT Services

Firmware Operations Diagrams

I2C Error Detection / Correction

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Audience Q&A

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Payload Firmware

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The Requirements Model

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The Payload Firmware Tree

PayloadController-PayloadFirmware

CameraData

CameraControl

Storage

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System Architecture

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Pay-Firm Architecture

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Engineering Trades

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HyperC

Image Properties

Dimensions: 640 x 512 x 640

Size: ~734 MB

Operations

  • Addition
  • Subtraction
  • Multiplication of powers of 2
  • Division of powers of 2

Local Sum Map

RF Properties

~300 MB: Size

Prediction Neighborhood

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HyperC (Contd.)

  • Removed All Dynamic Allocation
  • Severely improved documentation of code
  • Heavy Refactoring for simplifying code
  • Separation of HyperC into
    • HyperCompressor
    • HyperDecompressor
    • HyperImgen
  • CLI almost complete
  • Logging and Easy-to-use Debugging Model

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HyperC Progress Update

Python Implementation

Implementation Complete

C Implementation

Predictor Complete

Encoder Complete (Not Tested)

Decoder Incomplete

Reconstructor Incomplete (Not Tested)

Next Steps

Complete C Implementation

Convert to Zephyr Code

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where are we? timeline

We have completed the implementation of the algorithm and have partially ported to the MCU code.

Implementation of CCSDS-123-B-2 in the C Language

Port to Pay-ELEC MCU

(Zephyr compatible format)

Fine tune parameters to meet the compression ratio requirement

Further Exploration

1

2

3

4

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Challenges

  • SD Card integration with STM32 using HAL (SDMMC)
    • wires?
    • breakout board?
    • we’ve restarted the SD Card project and there have been some formatting issues (talking to the device itself)
  • Integrating SDMMC into Zephyr

Will 0xDEADBEEF help us debug the issues?�????? HELP!

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Good News

  • Footprint size does not seem to be an issue
    • Target -> ARM Cortex M7 (which is the family of Pay-ELEC MCU)
    • The encoder footprint size is 61304 Bytes / 1024 ≈ 59.87kB
    • One bank of flash on STMH743II is 256kB
    • This suggest that we can let the compiler know that footprint size is not an issue and optimize the compilation for performance.

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Run time concerns? Theoretical Compression Speed

  • Calculated an estimated run time value based on performance on a desktop CPU

  • Different architectures (x86_64 vs arm32) and different compilers�Thus, requiring different numbers of CPU clock/time

  • Assume no throttling (due to heat or power disruptions) happens

  • Different use of RAM, embedded environment will have more overheads�(embedded environment will have more overheads in I/O access overall,�more frequent I/O operations)

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Theoretical Compression Speed

��

Desktop Environment

Embedded Environment

Processor

i7-11800H

STM32H743II

Architecture

x86_64

arm32

Compiler

gcc

arm-none-eabi-gcc

Clock

1.85 GHz

480MHz (max)

Easy to Develop?

Yes

No

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Theoretical Compression Speed

Operation

PC (clock cycles)

MCU (clock cycles)

Arithmetic

~ 1 to 10

~1-10

Load/Store

~ 150

~ 150

File IO

22 us

50-100 us

  • Most time-consuming Operation is SD Card read/write.

  • Up to 5 SD Card writes per pixel
  • MCU is 1.85G / 480M = 3.85 times slower than PC

  • For a full 640x512x640 image,
    • PC Time: 80 mins
    • MCU Time: 303 mins

The mean run time over 27 tests is 104.23 seconds.

�This meets the run time requirement of 24 hours *. �* FINCH-PayloadController-CompressionSpeed requirement

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Compression Summary

�Sufficient evidence to support that our past work and future plan will meet the requirements.

  • Footprint size does not seem like a problem.

  • Runtime powerformance (how long it takes to run, RAM usage etc.) still needs to be confirmed.

  • Next step: run compression on the Pay-ELEC MCU (STM32H743II) and figure out bottlenecks to optimize it for the embedded environment.

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Flir Tau Driver

Our Tau is finally back!

Testing DCMI and DMA with a cheap camera (OV2640 & OV7675)

Port to Flir Tau Code

Test and then integrate to the Pay-Firm software

Collaborate with #science, #dataprocessing, and #optics to determine and test capture settings

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Phase C Completion Criteria

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Phase C Completion Criteria

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Next Steps

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Completing Phase C Tasks

Run the compression algorithm on the flight hardware and prove that our solution is able to meet the requirements��Finally our Tau is back! Test image acquisition with the Flir Tau using DCMI and DMA (we’ve had our code for a while, but we finally get to test it!)

Make SDMMC work with Zephyr

Automated compression performance evaluation

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Audience Q&A

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10-Minute Break

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Data Processing

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Team Introduction: The People

Aidan

Anoushka

Dav

Denny

Diljot

Falak

Hari

Hector

Ian

Isha

JP

Josh

Jude

Matthew

Nooh

Nusaiba

Prithvi

Rishit

Ritik

Shivesh

Heidi

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Team Introduction: The Subsystem

Augment Capabilities

Correct Errors

  • Destriping
  • Smile
  • Keystone
  • And more…
  • Super resolution
  • Sensor model
  • And more…

Datacube

  • Downlinked
  • Decompressed
  • Reconstructed

Datacube

  • Corrected
  • Georeferenced

Mission Ops

Science

Data Processing

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Requirements Model: Driving Requirement

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Requirements Model: System Requirements

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Requirements Model: Correction Requirements

And many more…

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DONE*

DONE*

DONE*

DONE

WIP

WIP

WIP

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Engineering Artifacts: Destriping

  • Remove stripe noise caused by the pushbroom payload

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Engineering Artifacts: Destriping

  • Remove stripe noise caused by the pushbroom payload

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Engineering Artifacts: Destriping

  • Remove stripe noise caused by the pushbroom payload

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Engineering Artifacts: Keystone

  • Correct for geometric distortions in the image caused by the optics

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Engineering Artifacts: Keystone

  • Correct for geometric distortions in the image caused by the optics

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Engineering Artifacts: Sensor Model

  • Model the satellite’s position and attitude to orthorectify, georeference

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Engineering Artifacts: Sensor Model

  • Model the satellite’s position and attitude to orthorectify, georeference

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Risk Management: Risks that DP Manages

  • Manage risks in the spacecraft with the data processing pipeline

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Risk Management: Risks that DP Manages

  • Manage risks in the spacecraft with the data processing pipeline

Dark noise correction

Sensor model

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Risk Management: Risks within DP

  • Manage risks in the pipeline through testing procedures, redundancy

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Risk Management: Risks within DP

  • Manage risks in the pipeline through testing procedures, redundancy

Implement multiple methods

Test on the ground

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Next Steps

Completion Criteria

Questions

Finish the Pipeline

  • None!
  • How do I trust ML?
  • Best dev practices?
  • Current projects
  • Future projects
  • Payload verification

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Audience Q&A

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Regulatory

Navigating the legal landscape, for a seamless launch!

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We Are The RegTeam - Diverse In Expertise & Interdisciplinary!

Christina Mai

Riddhiman Roy

Sakeena Qureshi

Isha Ruparelia

Alex Apostolu

Lead & Researcher

Export Control License

Remote Sensing License Point

Frequency Licenses Point

Member & Assistant Government Liaison

Shokoofa Dehghani

Export Control License

Regulatory & Thermal

Regulatory & Mechanical

Regulatory & Data Processing

Regulatory & Firmware

Optics & UTAT Policy

Space Systems Regulatory�UTAT Policy

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Our Responsibilities

  • File, submit, and maintain satellite-specific regulatory licenses�
  • Research the regulatory bodies and licenses we must comply with�
  • “Translating legalese”: Liaison between technical leads and governing bodies, providing expertise on legal matters and helping the team come to decisions wherever regulations are involved�
  • Consolidate high-level technical parameters from our systems and deliver them to regulatory bodies in our license applications

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Our Licenses: Overview

Frequency License

  • The governing bodies are the International Telecommunications Union (ITU) and the Innovation, Science and Economic Development Canada Department of the Government of Canada (ISED)

Remote Sensing License

  • The governing body is Global Affairs Canada (GAC)
  • We need a license for operating a Remote Sensing Space System (RSSSA). The application contains a Space, Ground, and Data segment and must include a System Disposal, Command and Data Protection Plan
  • GAC is very specific about the information needed from these plans

Export Licensing

  • The governing body is Global Affairs Canada (GAC)
  • To export FINCH for launch, we need a controlled goods application
  • GAC will review our application to let us know what permits and/or declarations we need to apply for

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Phase C Completion Criteria

SHOULD

Begun application process for all licenses

SHALL

Submitted ITU filling

SHALL

Begun remote sensing license application

SHALL

Submitted permit for GAC to attain notice of export control status

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Frequency Licence (ITU & ISED)

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ITU Frequency Licensing

Progress:

Formal Briefing Documents

1st Step in Licencing

The International Telecommunication Union.

  • In progress for:
    • RF licensing
      • ITU license
      • ISED license
    • Export control license
    • Remote sensing license
  • Working towards completion

Aligning next step tasks with the FINCH Phase C, which comes to a close on August 31, 2024. During Phase C, we have accomplished the following:

    • Created an ITU account
    • Met with ITU and ISED representatives.
    • Beginning online filing.

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ITU License Progress

Submission Info

Submit API Info

  • Submit using SpaceCom to start 9 month minimum process�
  • Application can be approved/accepted by the ITU after 3 months (API/A)�
  • Application can be commented on over 4 more months (API/B)�
  • License will be valid for a maximum of 7 years from the first submission date

RF Information

Environmental impact assessment

Technical requirements

Business information

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ISED Frequency License

Developing Timeline

Progress

    • UTAT must submit an online filing through ITU and provide insight into technical requirements such as link budgets, emissions characteristics, and orbital parameters.
    • ISED applications will be needed for the following licenses:
      • Space Station Spectrum Licence
      • Site-Approved Earth Stations Spectrum Licence
      • Site-Approved Fixed Earth Station

  • Aligning next step tasks with the FINCH Phase C, which comes to a close on August 31, 2024
  • ISED application submission date is tentative
  • ~ 130 day process

Innovation, Science, and Economic Development Canada

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ISED License Progress

Gather information from subdivisions

Meet with ISED representative

Create ITU user account

Submit ITU filing and send confirmation to ISED

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SUMMER 2024

RF + Ground Station Information

Emissions information

Orbit information

Financial + Business Information

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Remote Sensing License

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Remote Sensing License Overview

  • We need a Remote Sensing License from Global Affairs Canada (GAC) to operate our payload
  • We can submit a reduced version of the application since our spatial resolution is coarse
  • We are able to submit for review multiple times until application is ready

Cost: Free!

Application Process Time: 180 days

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Remote Sensing License Application

Satellite disposal plan

Uplink/Downlink Information

Sensor Information

Ground Station Information

Command Protection Plan

Business and Security Information

Orbit Information

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Remote Sensing License

Timeline

Meet with GAC official

Work with subsystems to gather information

Submit application

for feedback

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SUMMER 2024

SPRING 2025

FALL 2024

Writing first draft for review

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Submit application for approval

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Export Licence

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Export Control License Overview

Export Controls Lists (ECL) determines which products need a license

  • Group 5 - Miscellaneous items

Through our knowledge gathering process we don't fall under any controlled goods, however through our liaison with a GAC official, we are still required to submit the permit

License to export controlled goods into US

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Export Control License Timeline

Reach out to subsystems to gather information

Submit application

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SUMMER 2024

SEPTEMBER 2024

Reach out to GAC to find out about permit process

Begin Permit Application

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Audience Q&A

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Team Q&A

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