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SERVER

OCP NIC Community Update�November 2025

for Server Project

�����Sub-group Project Wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

NIC3.0

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Agenda

  • Thermal Test Fixture update
  • SI workstream PCIe Gen7
  • NIC form factor workstream update

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DSFF Thermal Test Fixture Overview

  • Dell developed a new Thermal Test Fixture (TTF) to support SFF / TSFF / DSFF / TDSFF form factors at PCIe® speeds up to Gen 7
  • Dell will be formally contributing the assembly collateral & MCU code

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  • PCB designed to extend PCIe lanes from a DC-MHS compatible server to a mounted OCP 3.0 DUT card
  • Metal housing intended to attach to a wind tunnel or flow bench
  • Each form factor will leverage a different front bracket
  • Pre-defined sensor locations for test repeatability
  • Onboard MCU operates like prior thermal test fixtures and codebase to be contributed to the OCP GitHub repository

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DSFF Thermal Test Fixture

DSFF TTF Airflow Operation

Please note: PCIE® design mark is a registered

trademark and/or service mark of PCI-SIG.

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Proposed OCP NIC 1.7 Inputs for PCIe Budgets

PCIe CEM 7.0 Draft 0.5

Page 17 of the

Draft 0.5 Spec

Now Rev 1.0

Also refer to PCIe Base Spec 7.0 section: 8.3.5

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The following informative limits for PCIe Gen 7 at 128 GT/s are to be specified. Current investigative efforts are ongoing by the OCP NIC sub-group to determine a specified set of values to cover Insertion Loss, Return Loss, PSNEXT and PSFEXT.

New Section 6.1.3.4 PCIe Gen 7 Informative Limits

Proposed OCP NIC 1.7 Inputs for Informative Limits

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Thermal Workstream Update

  • New meeting series sent out last week
    • Email Joe to be added → joseph.hanson@ocproject.net

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  • Workstream Focus
    • TSFF, DSFF/TDSFF thermal spec updates
      • Spec update targeted by end of year

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    • Liquid cooling feasibility and enabling
      • Detailed mechanical feasibility studies in progress

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Form-factor workstream update

  • Shared 64-lanes concept in OCP & Innovation Booth
  • Use-case is niche, a few companies see value. Next best is to incubate and develop with 3-5 companies that express strong interest under a separate CLA

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Thank You

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