OCP NIC Community Update�September 2023

�����Sub-group Project wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

Agenda

• OCP Global Summit – Break-out session
• OCP Global Summit – Experience Lab
• SI test fixture
• PCIe Gen6 discussion
• Dual-wide SFF

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OCP Global Summit 2023

October 17 to 19: San Jose Convention Center

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Break-out session/Presentation:

2 abstracts tentatively accepted

• OCP NIC in 2023: 800G, PCIe Gen6 & Test Integration
• Ensuring Predictable Thermal Performance for Higher Speed OCP 3.0 NICs

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Experience Lab demo:

Request for space approved

Broadcom, Dell, Meta interested

Would like to see more companies participate in demo

SI Test Fixtures

CLB 5.0 32GT/s status:

• Dell to present at IC meeting to release design to Wiki

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CBB 5.0 32GT/s status:

• Multi-vendor testing results within predicted performance, suitable for CEM equivalent testing
• Dell to present at IC meeting to release design to Wiki

Jason

OCP NIC 3.0 SFF CBB 5.0 block diagram

SIWG for PAM4 Gen6 spec

Xtalk spec to meet BER requirement

• SFF-TA-1002 proposal(rev 1.4.1) in progress, will leverage
• SFF-TA-1009 proposal(rev 3.1.1) for device spec
• WIP to check for channel simulations
• Working with device vendor to meet Rx spec

Anthony/Tanmoy

Connector Spec

Channel Simulation

Based on Gen5 models as same Nyquist for Gen6

• Root complex/Switch ~ 20dB + Package model
• AIC/OCP ~7dB + package model
• Tighter PSNEXT proposal (-60dB @16Ghz), ccICN comparison
• Gen5 models are close to meet the spec

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Anthony/Tanmoy

Straddle Mount

AIC/OCP

Channel Gen5 vs Gen6

~32dB

~28dB

CPU

NIC

CPU

NIC

7dB

6dB?

Gen 5

Gen 6

Problem Statement

SFF and LFF are not plug-compatible

Platforms and adapters are commonly SFF today

LFF face lack of system and lack of device card

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Requires Different Connector

Uses same connectors

Motherboard with 1x LFF

Motherboard with 2x SFF

SFF

SFF

LFF

Arnon/Harvey

Presented on: 8/9/2023

4C

4C+

4C+

4C+

Double-wide SFF for Smart NICs

Spans over two 4C+ connectors

Regular and Tall options

160 Watt

x32 PCIe lanes

13% more board space than LFF

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Opens:

• Management scheme
• Latching mechanism
• More

Illustration only

Arnon/Harvey

Presented on: 8/9/2023

OCP NIC 3.0 ejection mechanism

Customer A

Customer B

Customer D

Customer C

Customer X,Y,Z

D-SFF Option 1: FLW rev1.0 SFF recommendation

thumbscrew possible

No thumbscrew

• Dimensions follow M-FLW rev1.0
• Middle NIC card unable to support Pull-tab/Thumbscrew version
• Opens: Does this dimension support “ejector latch” faceplate?

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D-SFF Option 2: Define separation to fit Pull-tab/Thumbscrew

Thumbscrew support

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• Dimensions follow M-HPM Type4 (M-DNO4) and M-HPM Type7 (M-DNO7, aka wide 21” FLW)

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Thumbscrew support

D-SFF option preference

Option 1: Follow M-FLW

Option 2: Increase gap support thumbscrews

Customer A

Required cost for surprise removal is high.

Platform incline to internal latch version

Width of faceplate of thumbscrew became a limitation trade-off for other system feature

Customer B

Embrace internal lock since the start of OCP

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Customer C

Majority thumbscrews. Some internal latch is niche

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Vendor B

Ejector for Customer D, Internal lock Customer A & B

Thumbscrews for channel ODM CSP partners

On website wide distributions is thumbscrews

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Vendor A

Internal lock for OEM

Thumbscrews for the rest of market

Able to support all flavors of OCP NIC including thumbscrews. Give the flexibility to customer

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Customer D Wearing OCP HAT

Which form factor can drive most adoptions?

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OCP NIC 3.0 spec 1.2.1 PCIe mapping

Paul

Mixed mode LFF use case examples

Paul

Gather feedback throughout the year

Provide your feedback at:�https://tinyurl.com/feedback2ocpnic

SmartNIC Summit

• SmartNIC Summit June 13-15, 2023 held in San Jose, CA
• Special session for OCP to share OCP NIC on June 15 10.50-11.00am
• Nvidia/Elad would represents to present

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