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Fabricating Chips with Silicon

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What is a transistor?

  • Silicon is a metalloid: it isn’t a great conductor
  • Need to add charge carriers by "doping", and apply an electric field
    • N-type: floating (-) (electrons)
    • P-type: floating (+) (electron holes - bubbles)
  • Semiconductor charge carrier animation

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Conceptual drawing

  • Source = Drain, just labels
  • Polysilicon: conductor
    • Was metal (metal oxide semiconductor field effect transistor, MOSFET)
  • SiO2: insulator
  • Gate produces electric field
    • Attracts electrons/holes to form an electrically conductive channel
    • Some turn on at zero gate voltage, others turn off (enhancement mode / depletion mode)

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  • Taps: avoid forward bias
    • Keep the substrate neutral, avoid latchup
  • Polysilicon: transistor
    • Backward slash
  • Metal: conductor
    • Forward slash
  • SiO2: insulator
    • Solid gray

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3-input NAND

  • Top - parallel P-MOS
  • Bottom - series N-MOS

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Challenge - Signal Degradation

Not a problem with pure CMOS

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Unrelated

–but cool– Example

A*B C*D (A*B)+(C*D)

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Fabrication - Photolithography

Photolithography steps to form N-Well:

https://www.youtube.com/watch?v=POCuBW7xRUs

Photolithography steps to form CMOS transistor:

https://www.youtube.com/watch?v=OBiu2agne_U

Semiconductor manufacturing economics summary:

https://twitter.com/TubeTimeUS/status/1352676882920083457

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Spacing guidelines (ca 2004, academic)

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4-NAND TTL 7400 chip

First built circa 1964

10ns switching, 4 gates/chip

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ARM1 chip from 1985

25,000 transistors for a 32-bit CPU

Parts of the ARM1 by Ken Shirriff

ARM1 gate-level simulation in WebGL

by Visual6502

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M1 Ultra, 2022 ARM chip

114 billion transistors at 5nm process

20-core CPU (3.2 & 2.0 GHz), 64-core GPU,

and 32-core Neural Engine (32 trillion ops/sec)

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Making things 70 atoms wide is hard

Unsolved lithography issues at 7nm (== about 70 atoms)

  • Extreme Ultraviolet (EUV) light transmission requires a hard vacuum
  • Focusing light on the order of a wavelength requires computational lithography (essentially computational holography)
  • Electron beam measuring features can limit fabrication throughput
  • Machine-specific aberrations might need machine-specific lithography masks
  • Photon shot noise: shorter wavelength -> more energy/photon -> fewer photons
  • Literally getting a few atoms out of place can make the circuit fail

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Lithography: Victim of its own Success?

Transistor scaling means you can make either:

  • The same transistors for a lower price (preferred by microcontrollers)
  • More transistors for the same price (preferred by Intel)

Power scaling is slower than area scaling, so we can build more transistors than we can afford to switch every cycle ("dark silicon crisis").

We have no idea how to productively write code to use billions of transistors.

  • More registers, arithmetic units, or cores are typically not needed (and burn power).
  • Pre-bake in dedicated ASICs for most conceivable tasks?
  • Bigger caches? Deeper branch prediction? Rent out chip area for ads?

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Further Info

Intro: Global Foundries PR summary

Robots moving FOUPs around a fab: https://youtu.be/-SCskPV00kU?t=3m2s

Stories from the fab: https://www.youtube.com/watch?v=NGFhc8R_uO4

Sam Sivakumar (Intel) technical lithography talk in 2012: challenges scaling real photolithography down to 14nm.

CS 441 lecture notes on semiconductor operation

Beautiful die shots: https://zeptobars.com/en/ (they decap chips by boiling them in acid)

Book: CMOS VLSI Design: A Circuits and Systems Perspective (4th Edition)

Sam Zeloof is making working ICs in his garage