Polymerization_2
r1=K11/K12, r2=K22/K21
Phase separation of block copolymers
Phase separation of a blend of PMMA and PS homo-polymer
Typical self-assembly behavior for linear block copolymers
Block copolymer thin films
TEM micrographs of polystyrene-polybutadiene diblock copolymer film masks (a,c) and lithographically patterned silicon nitride (b,d).
Self-assembly of PS-PB di-block copolymer
The most attractive feature of block copolymer self assembly is the extremely high resolution, easily get features down to 10nm.
PS: polystyrene
PB: polybutadiene
B
A
B
A B A
Block copolymer thin films: effect of substrate wetting
Block A is shorter than B
Arranged to minimize surface (interface) energy
Micro-phase separated block copolymer can be directed/aligned by:
Guided block copolymer self assembly for long range ordering and periodicity
Alignment by pre-patterning the substrate
Spherical domains assembled from PS–PFS (polystyrene-polyferrocenyldimethylsilane) block copolymer inside patterned SiO2 grooves.
The 1.5 wt.% PS-PFS block copolymer in toluene solution was spin-coated onto the grooved substrate and then annealed at 140oC for 48h to obtain a monolayer of spherical PFS domains in a PS matrix within the substrate grooves.
Alignment by shear force
(here for silicon nano-wire fabrication)
Co-polymer on substrate
Press
Pull
One way to create shear force.
Here the etch contrast is increased by staining the block copolymer by 2 min exposure to the vapor from 0.5% aqueous RuO4, which selectively reacts with the PS block and increases its etch resistance, thus permitting Si nanowires of greater aspect ratio to be fabricated.
Alignment by shear force (for silicon nano-wire fabrication)
Pitch=30nm
Tapping mode atomic force microscopy (TM-AFM) phase images of PS–PHMA thin films on top of an α-Si layer on a fused silica substrate:
Glassy PS cylinders are shown as light in a dark rubbery PHMA matrix.
Polystyrene-b-poly(n-hexyl methacrylate) (PS–PHMA) diblock copolymer with a molar mass of 21 and 64 kg/mol for the respective blocks.
Chaikin, “Silicon nanowire grid polarizer for very deep ultraviolet fabricated from a shear-aligned diblock copolymer template”, Optics letters, 32(21), 3125-3127 (2007).
Templated self-assembly of block copolymers
Polystyrene “brushes” by EUV-IL (interference lithography) and surface initiated nitroxide mediated living free radical polymerization
The PS brush pitch should match that of PS-PMMA self assembly pitch.
Polymerization of block-copolymers on
chemically pre-patterned substrates
P. F. Nealey, H. H. Solak et al. Nature 424 (2003)
Polystyrene-block-methyl meth acrylate (PS-b-PMMA), L0 = 48nm
Thermodynamics dominates interface widths and domain sizes.
When Ls=47.5nm≈Lo=48nm, block copolymer is almost defect free.
Block copolymer materials that naturally form simple periodic structures were directed to assemble into non-regular device oriented patterns (here an elbow) on chemically nano-patterned substrates.
Mark P. Stoykovich, Marcus Müller,Sang Ouk Kim, Harun H. Solak, Paul F. Nealey, Science, 308, 1442-1446 (2005).
Directed assembly of block copolymer blends into non-regular device oriented structure
Block copolymer lithography (i.e. with pattern transfer)
PS: polystyrene
PB: polybutadiene
Degrade with ozone
Stain with OsO4
Synthesis of nanowires by wetting
Wettability masks:
Au and Ag to PS phase
In, Pb, Sn to PMMA phase
Block copolymer lithography
(PMMA chain can also be broken by UV light at λ=365nm, but need very long time exposure, ~1 h at 40mW/cm2 intensity)
Nanofabrication of vertical nanowires by electroplating
Science, 290, 2126 (2000)
Electric field for vertical alignment
Density multiplication (here by 9×) lithography
C-D. SEM images of ordered BCP spheres formed within a sparse 2D lattice of HSQ
Ross, “Graphoepitaxy of self-assembled block copolymers on two-dimensional periodic patterned templates”, Science, 321, 939-943 (2008).
For the moment, this is considered as the most promising route for bit-patterned magnetic recording media fabrication (make the mold for nanoimprint lithography), up to 10Tbits/in2 for pitch ~8nm.