1

Dimension: 29.00 X 3.50 X 5.50 mm

Pin: 96 Pins

Current Rating: 1A/Pin (Power: 12 PIN)

Rate Voltage: 3.3VDC

Pitch: 0.50mm

Solder Process: Reflow soldering

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HPC MMC PROPOSAL 1 – PCIe Gen7

© All rights reserved by FIT Hon Teng Limited. Storage, reproduction, printing, distribution or disclosure to any third party is strictly prohibited.

Simulation Result-Temperature contour

• When current load 1.0A, the max T-rise is 25.30℃；

Inside temperature contour

△TC₁=25.30^oC

3

HPC MMC PROPOSAL 2 – PCIe Gen7

Dimension: 28.00 X 3.50 X 5.50 mm

Pin: 92 Pins

Current Rating: 1.6A/Pin (Power: 8 PIN)

Rate Voltage: 3.3VDC

Pitch: 0.50mm

Solder Process: Reflow soldering

​

© All rights reserved by FIT Hon Teng Limited. Storage, reproduction, printing, distribution or disclosure to any third party is strictly prohibited.

Simulation Result-Temperature contour

• When current load 1.0A, the max T-rise is 10.94℃；
• When current load 1.3A, the max T-rise is 18.52℃；
• When current load 1.6A, the max T-rise is 27.94℃；

Inside temperature contour

△TC₁=10.94^oC

△TC₁=18.52 ^oC

△TC₁=27.94 ^oC

Current in：1.0A

Current in：1.3A

Current in：1.6A