1 of 17

Eltrix

SERVICE

Tape-Out Booster

Choose the service to know

more about Eltrix.

Assembly

Service

Successful

Case

IC Design

Foundry

Service

2 of 17

IC

DESIGN

Eltrix, fabless RFIC design service company, developing state-of-the-art RF integrated circuits to customers worldwide.

Focused in the development of advanced integrated circuits for power amplifiers, low noise amplifiers, and switch.

> Our Design Support

3 of 17

Glad to meet you !

Let us know you to provide customized design support

Chip User

Design House

Please Choose

4 of 17

Design Support

For Chip User

IP Authorization

5 of 17

For Sophisticated Design House

For Young Design House

Design Support

6 of 17

We can design different categories of RFIC such as PA/LNA/Core chip/High power chips, the finished product can be 4" GaN wafers/6" GaAs wafers or bare dies.

For RF

For Power

4" GaN Wafer

6” GaAs Wafer

6” GaN Wafer

Know More pHEMT Process

7 of 17

pHEMT

PROCESS

By leading processes from the foundry, we can help customers to build the variety of RF circuits. They can be MPA(<5W)/Ultra HPA(>20W)/LNA or core chip.

For GaAs, the frequency range can be up to 80GHz, operating lackage 2~6V.

For GaN, the frequency range can be up to 40GHz, power range can be up to 50V.

Back to Foundry Service

8 of 17

Assembly

Material

Assembly Solution Comparison

Metal Ceramic Package

Plastic QFN (Air Cavity)

Plastic QFN (Over Mold)

Die Bonding

Wire Bonding

Sealing

Assembly

Service

Assembly Evaluation Flow

Tooling Reference

EV Board Reference

LTCC

9 of 17

ASSEMBLY

MATERIAL

Back to Assembly Service

Solution Comparison

Cost

Complication

Plastic QFN (Air Cavity)

LTCC

Plastic QFN (Over Mold)

Metal Ceramic Package

10 of 17

ASSEMBLY

MATERIAL

Metal Ceramic Package

All Lids with B-stage Epoxy Preform

Back to Assembly Service

11 of 17

ASSEMBLY

MATERIAL

Plastic QFN

Air Cavity Package

Back to Assembly Service

QFN Size

3x3mm, 4x4mm, 5x5mm, 6x6mm, 7x7mm, 8x8mm

Standard Pin Count

12, 20, 32, 36, 48, 56

12 of 17

ASSEMBLY

MATERIAL

Plastic QFN

Over Mold, Versatile Existing Tools

Back to Assembly Service

13 of 17

ASSEMBLY

MATERIAL

LTCC

Connect your IC with Multilayer Ceramics

Design Rules

Back to Assembly Service

14 of 17

ASSEMBLY

SERVICE

Back to Assembly Service

Assembly Evaluation Flow

Step 1.

Request Form

Contact us to get Request Form

Step 2.

Test Requirement & Discussion

Receives your request and provides reference case basing on your test requirement

  • Hernerticity
  • Die Bond
  • Wire Bond
  • Thermal Test
  • DC Test

Step 3.

Quotation

Unit Price & Tooling

15 of 17

ASSEMBLY

SERVICE

Back to Assembly Service

Tooling Reference

Case Study

Capping

TM10

TM100

Wire Bond

Die Bond

16 of 17

ASSEMBLY

SERVICE

EV Board Reference

Based on our successful case

Back to Assembly Service

17 of 17

SUCCESSFUL CASE

Booster Tape-out

Back to Assembly Service