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Power Dissipation

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Activity Factor

  • Suppose the system clock frequency = f
  • Let fsw = αf, where α = activity factor
    • If the signal is a clock, α = 1
    • If the signal switches once per cycle, α = ½

  • Dynamic power:

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Power Dissipation Sources

  • Ptotal = Pdynamic + Pstatic
  • Dynamic power: Pdynamic = Pswitching + Pshortcircuit
    • Switching load capacitances
    • Short-circuit current
  • Static power: Pstatic = (Isub + Igate + Ijunct + Icontention)VDD
    • Subthreshold leakage
    • Gate leakage
    • Junction leakage
    • Contention current

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Dynamic Power Reduction

  • Try to minimize:
    • Activity factor
    • Capacitance
    • Supply voltage
    • Frequency

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Clock Gating

  • The best way to reduce the activity is to turn off the clock to registers in unused blocks
    • Saves clock activity (α = 1)
    • Eliminates all switching activity in the block
    • Requires determining if block will be used

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Capacitance

  • Gate capacitance
    • Fewer stages of logic
    • Small gate sizes
  • Wire capacitance
    • Good floorplanning to keep communicating blocks close to each other
    • Drive long wires with inverters or buffers rather than complex gates

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Voltage / Frequency

  • Run each block at the lowest possible voltage and frequency that meets performance requirements
  • Voltage Domains
    • Provide separate supplies to different blocks
    • Level converters required when crossing

from low to high VDD domains

  • Dynamic Voltage Scaling
    • Adjust VDD and f according to

workload

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Static Power

  • Static power is consumed even when chip is quiescent.
    • Leakage draws power from nominally OFF devices
    • Ratioed circuits burn power in fight between ON transistors

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Leakage Control

  • Leakage and delay trade off
    • Aim for low leakage in sleep and low delay in active mode
  • To reduce leakage:
    • Increase Vt: multiple Vt
      • Use low Vt only in critical circuits
    • Increase Vs: stack effect
      • Input vector control in sleep
    • Decrease Vb
      • Reverse body bias in sleep
      • Or forward body bias in active mode

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Gate Leakage

  • Extremely strong function of tox and Vgs
    • Negligible for older processes
    • Approaches subthreshold leakage at 65 nm and below in some processes
  • An order of magnitude less for pMOS than nMOS
  • Control leakage in the process using tox > 10.5 Å
    • High-k gate dielectrics help
    • Some processes provide multiple tox
      • e.g. thicker oxide for 3.3 V I/O transistors
  • Control leakage in circuits by limiting VDD

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Junction Leakage

  • From reverse-biased p-n junctions
    • Between diffusion and substrate or well
  • Ordinary diode leakage is negligible
  • Band-to-band tunneling (BTBT) can be significant
    • Especially in high-Vt transistors where other leakage is small
    • Worst at Vdb = VDD
  • Gate-induced drain leakage (GIDL) exacerbates
    • Worst for Vgd = -VDD (or more negative)

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Power Gating

  • Turn OFF power to blocks when they are idle to save leakage
    • Use virtual VDD (VDDV)
    • Gate outputs to prevent

invalid logic levels to next block

  • Voltage drop across sleep transistor degrades performance during normal operation
    • Size the transistor wide enough to minimize impact
  • Switching wide sleep transistor costs dynamic power
    • Only justified when circuit sleeps long enough

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