Non-Contact Wafer Surface Inspection Metrology
40+
Years in Business
1,000+
Systems Installed
100+
Customers Worldwide
Milpitas, CA
Headquarters
Product Portfolio at a Glance
Manual and robot-controlled metrology systems for every stage of the fab
FSM 128 / 128NT
Room-temp bow & stress, manual load
FSM 128C2C
Automated bow & stress, robotic C2C
FSM 500TC
High-temp bow & stress to 500°C
FSM 900TC-Vac
High-temp bow & stress to 900/1100°C, vacuum
FSM 900TC-VAC-C2C
Fully automated, 900°C vacuum, 300mm
FSM 413MOT
Semi-automatic thickness metrology
Explore full datasheets and technical specifications for every system at metrosemi.com
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 128 Series
Film Stress & Wafer Bow Measurement — Room Temperature
50–300mm
Wafer Size (128NT-200mm / 128L-300mm)
Key Features & Benefits
✓
Non-contact laser scanning with patented dual-laser switching for accuracy across diverse film types
✓
Programmable single or multi-line diametric scans for intuitive 2D/3D stress mapping
✓
32 scan lines (6 recommended) at 40 data points per millimeter
✓
Windows 7–11 software with one-click export to Excel™ and JPEG
1 MPa–1.4 GPa
Stress Range
≤2,000 µm
Bow Range
1% (1σ)
Repeatability
<2.5%
Accuracy
Best for: R&D labs, incoming QC, and pilot-line process monitoring where compact, benchtop precision is essential.
FSM | Frontier Semiconductor | www.MetroSemi.com
5
FSM 128C2C Series
Automated Film Stress & Wafer Bow Measurement — Room Temperature
150–300mm
Wafer Size, Robotic C2C
Key Features & Benefits
✓
Robotic cassette-to-cassette wafer handling for unattended, high-throughput operation
✓
Same proven non-contact optics and dual-laser switching as the FSM 128 platform
✓
Open cassette, SMIF, and single/dual FOUP configurations available
✓
Optional wafer slot mappers, cassette ID readers, and SECS/GEM communication for full fab integration
1 MPa–1.4 GPa
Stress Range
≤2,000 µm
Bow Range
1% (1σ)
Repeatability
Class 1
Laser Safety
Best for: High-volume 200mm and 300mm production fabs, and MEMS or III-V manufacturing lines requiring unattended throughput.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 500TC
High-Temperature Bow & Stress Measurement — Ambient to 500°C
500°C
Max Operating Temperature
Key Features & Benefits
✓
Accommodates 50mm to 300mm wafers without changing sample holders or jigs
✓
Patented auto-switching dual laser (650nm / 780nm) adapts to sample reflectivity
✓
Programmable temperature cycling with configurable ramp rates and annealing recipes
✓
Automatic Coefficient of Thermal Expansion (CTE) calculation with one-click export
1–20°C/min
Ramp Rate
1% (1σ)
Repeatability
<2.5%
Accuracy
208V, 20A
Power
Best for: Thermal stability studies on nitrides, polyimides, low-k, high-k, and metal films.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 900TC-Vac
Comprehensive High-Temperature Thermal-Mechanical Characterization
900°C / 1100°C
Standard / Optional Max Temp
Key Features & Benefits
✓
Programmable thermal cycling in inert gas (to 900°C) or vacuum (to 1100°C optional)
✓
Integrated metrology: stress hysteresis, TDS, film shrinkage, resistivity, and reflectivity in one platform
✓
Whole-wafer outgas trend monitoring across up to 100 channels
✓
RTP-type chamber with gold-plated reflective walls and water cooling for stable, repeatable cycles
1–50°C/min
Ramp Rate
5×10⁻⁶ Torr
Vacuum Level
50–300mm
Wafer Size
TDS
Gas Analyzer
Best for: New-material screening and process integration for low-k dielectrics, copper, and advanced packaging R&D.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 900TC-VAC-C2C-300mm
Fully Automated 300mm System — Bow & Stress to 900°C in Vacuum
300mm
Fully Automated Cassette-to-Cassette
Key Features & Benefits
✓
Fully automated cassette-to-cassette wafer handling for 300mm production fabs
✓
User-programmable thermal cycling from room temperature up to 900°C, in vacuum or inert gas
✓
Patented automatic dual laser (780nm & 810nm); optional wafer rotation for 2D/3D deformation mapping
✓
Optional Thermal Desorption Spectroscopy (1–100 AMU) and SECS/GEM factory automation
1 µm–2,000 µm
Bow Range
900C/1100C
Vacuum
SECS/GEM
Automation (Opt.)
TDS
Gas Analyzer
Best for: Production fabs requiring unattended, high-temperature stress and bow metrology at 300mm scale.
FSM | Frontier Semiconductor | www.MetroSemi.com
9
FSM 413MOT
Semi-Automatic Wafer & Thin-Film Thickness Metrology
0.1 µm
Display Repeatability (Single Probe)
Key Features & Benefits
✓
Non-contact IR interferometry (Echoprobe™) for Si, GaAs, InP, SiC, glass, quartz, and polymer materials
✓
Optional dual-probe configuration measures total thickness on non-transparent materials, including metals
✓
High-precision X-Y stage (0.5 µm) for automated wafer mapping (optional)
✓
Measures TTV, bonding uniformity, trench/TSV depth, etch/scribe uniformity, and bump height
15–780 µm
Single Probe Range
Up to 3mm
Dual Probe Range
300mm
Max Wafer Size
1.3±0.03µm
Wavelength
Best for: MEMS, stacked-die, and backside-grind processes requiring precise metrology on ultra-thin or bonded wafers.
FSM | Frontier Semiconductor | www.MetroSemi.com
10
TSV Metrology & Defect Inspection
Precision coverage across substrate, thin-film, and multi-layer stacks
TSV Metrology
Precise measurement of through-silicon via physical dimensions using single- or dual-probe non-contact optical configurations.
< 10
TSV Aspect Ratio
> 8 µm
CD Diameter
0.1 µm
CD Repeatability
> 50 µm
Via Depth
Via depth repeatability: 0.2 µm | Other configurations available for smaller via depths
Defect Inspection
XY-scan, bare-silicon surface inspection with manual load/unload for high-sensitivity particle and defect detection.
0.22 µm
Sensitivity (PSL)
< 5%
Repeatability
Wafer sizes: 100mm, 125mm, 150mm, 200mm
Size channels: 0.22, 0.3, 0.5, 1.0, 3.0, 5.0 µm+
Compact footprint: 30" × 30" × 30", ~250 lbs
FSM | Frontier Semiconductor | www.MetroSemi.com
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Competitive Advantage
Setting the benchmark for non-contact thermal-mechanical characterization
Capability | FSM | Other Vendors |
Measurement | Bow, stress, profiling, hysteresis, TDS | Bow, stress, profiling |
Technology | Non-contact | Contact |
Temperature Range | Room temperature to 900°C (1100°C optional) | Not supported |
Vacuum Compatibility | Yes | No |
Automation | Manual to fully automated cassette-to-cassette | Typically manual only |
FSM is the only vendor in this comparison to combine non-contact optical metrology with true high-vacuum, high-temperature capability — enabling measurements that contact-based tools simply cannot perform.
FSM | Frontier Semiconductor | www.MetroSemi.com
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Thanks
Our team is ready to help you select the right non-contact metrology platform for your fab, R&D lab, or packaging line.
Get in Touch
Frontier Semiconductor (FSM)
165 Topaz St., Milpitas, CA 95035
Mo Alam • (408) 582-4997
alam@metrosemi.com
For More Information
Explore full product specifications, datasheets, application notes, and support resources on our website.
https://metrosemi.com/
FSM | Non-Contact Wafer Surface Inspection Metrology