Non-Contact Wafer Surface
Inspection Metrology
Precision, non-contact metrology systems for wafer bow, film stress, thickness, TSV, and defect inspection.
Trusted by 100+ leading semiconductor manufacturers worldwide
Learn more at metrosemi.com
40+
Years in Business
1,000+
Systems Installed
100+
Customers Worldwide
Milpitas, CA
Headquarters
What We'll Cover
A complete overview of FSM's non-contact metrology platform
Company Overview
Who we are and what sets FSM apart
Product Portfolio at a Glance
Six platforms, one integrated metrology strategy
Bow, Stress & Hysteresis Systems
Room temperature through 900°C, manual to fully automated
Automated Cassette-to-Cassette Platforms
Production-ready 300mm systems for high-volume fabs
Thickness, TSV & Defect Inspection
Precision metrology for advanced packaging
Why FSM
Competitive advantages and applications across the industry
FSM | Frontier Semiconductor | www.MetroSemi.com
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Company Overview
Four decades of precision metrology innovation
Frontier Semiconductor (FSM) is a leading manufacturer of non-contact wafer surface inspection metrology systems, with more than 2,000 systems installed across the global semiconductor industry over more than 40 years.
Headquartered in Milpitas, California, FSM partners closely with customers on R&D initiatives to deliver new metrology solutions tailored to advanced process and device requirements. FSM systems are deployed by more than 100 customers worldwide — including many of the industry's leading integrated device manufacturers, foundries, and OSAT providers — spanning North America, Europe, and Asia.
40+
Years in Business
1,000+
Systems Installed
100+
Customers
200+
Employees
Global installed base across North America, Europe, and Asia
FSM | Frontier Semiconductor | www.MetroSemi.com
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Product Portfolio at a Glance
Manual and robot-controlled metrology systems for every stage of the fab
FSM 128 / 128NT
Room-temp bow & stress, manual load
FSM 128C2C
Automated bow & stress, robotic C2C
FSM 500TC
High-temp bow & stress to 500°C
FSM 900TC-Vac
High-temp bow & stress to 900/1100°C, vacuum
FSM 900TC-VAC-C2C
Fully automated, 900°C vacuum, 300mm
FSM 413MOT
Semi-automatic thickness metrology
Explore full datasheets and technical specifications for every system at metrosemi.com
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 128 Series
Film Stress & Wafer Bow Measurement — Room Temperature
50–300mm
Wafer Size (128NT-200mm / 128L-300mm)
Key Features & Benefits
✓
Non-contact laser scanning with patented dual-laser switching for accuracy across diverse film types
✓
Programmable single or multi-line diametric scans for intuitive 2D/3D stress mapping
✓
32 scan lines (6 recommended) at 40 data points per millimeter
✓
Windows 7–11 software with one-click export to Excel™ and JPEG
1 MPa–1.4 GPa
Stress Range
≤2,000 µm
Bow Range
1% (1σ)
Repeatability
<2.5%
Accuracy
Best for: R&D labs, incoming QC, and pilot-line process monitoring where compact, benchtop precision is essential.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 128C2C Series
Automated Film Stress & Wafer Bow Measurement — Room Temperature
150–300mm
Wafer Size, Robotic C2C
Key Features & Benefits
✓
Robotic cassette-to-cassette wafer handling for unattended, high-throughput operation
✓
Same proven non-contact optics and dual-laser switching as the FSM 128 platform
✓
Open cassette, SMIF, and single/dual FOUP configurations available
✓
Optional wafer slot mappers, cassette ID readers, and SECS/GEM communication for full fab integration
1 MPa–1.4 GPa
Stress Range
≤2,000 µm
Bow Range
1% (1σ)
Repeatability
Class 1
Laser Safety
Best for: High-volume 200mm and 300mm production fabs, and MEMS or III-V manufacturing lines requiring unattended throughput.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 500TC
High-Temperature Bow & Stress Measurement — Ambient to 500°C
500°C
Max Operating Temperature
Key Features & Benefits
✓
Accommodates 50mm to 300mm wafers without changing sample holders or jigs
✓
Patented auto-switching dual laser (650nm / 780nm) adapts to sample reflectivity
✓
Programmable temperature cycling with configurable ramp rates and annealing recipes
✓
Automatic Coefficient of Thermal Expansion (CTE) calculation with one-click export
1–20°C/min
Ramp Rate
1% (1σ)
Repeatability
<2.5%
Accuracy
208V, 20A
Power
Best for: Thermal stability studies on nitrides, polyimides, low-k, high-k, and metal films.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 900TC-Vac
Comprehensive High-Temperature Thermal-Mechanical Characterization
900°C / 1100°C
Standard / Optional Max Temp
Key Features & Benefits
✓
Programmable thermal cycling in inert gas (to 900°C) or vacuum (to 1100°C optional)
✓
Integrated metrology: stress hysteresis, TDS, film shrinkage, resistivity, and reflectivity in one platform
✓
Whole-wafer outgas trend monitoring across up to 100 channels
✓
RTP-type chamber with gold-plated reflective walls and water cooling for stable, repeatable cycles
1–50°C/min
Ramp Rate
5×10⁻⁶ Torr
Vacuum Level
50–300mm
Wafer Size
400 lbs
System Weight
Best for: New-material screening and process integration for low-k dielectrics, copper, and advanced packaging R&D.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 900TC-VAC-C2C-300mm
Fully Automated 300mm System — Bow & Stress to 900°C in Vacuum
300mm
Fully Automated Cassette-to-Cassette
Key Features & Benefits
✓
Fully automated cassette-to-cassette wafer handling for 300mm production fabs
✓
User-programmable thermal cycling from room temperature up to 900°C, in vacuum or inert gas
✓
Patented automatic dual laser (780nm & 810nm); optional wafer rotation for 2D/3D deformation mapping
✓
Optional Thermal Desorption Spectroscopy (1–100 AMU) and SECS/GEM factory automation
1 µm–1,000 µm
Bow Range
≥32 GB RAM
Control Module
SECS/GEM
Automation (Opt.)
24"+
Color Display
Best for: Production fabs requiring unattended, high-temperature stress and bow metrology at 300mm scale.
FSM | Frontier Semiconductor | www.MetroSemi.com
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FSM 413MOT
Semi-Automatic Wafer & Thin-Film Thickness Metrology
0.1 µm
Display Repeatability (Single Probe)
Key Features & Benefits
✓
Non-contact IR interferometry (Echoprobe™) for Si, GaAs, InP, SiC, glass, quartz, and polymer materials
✓
Optional dual-probe configuration measures total thickness on non-transparent materials, including metals
✓
High-precision X-Y stage (0.5 µm) for automated wafer mapping (optional)
✓
Measures TTV, bonding uniformity, trench/TSV depth, etch/scribe uniformity, and bump height
15–780 µm
Single Probe Range
Up to 3mm
Dual Probe Range
300mm
Max Wafer Size
1.3±0.03µm
Wavelength
Best for: MEMS, stacked-die, and backside-grind processes requiring precise metrology on ultra-thin or bonded wafers.
FSM | Frontier Semiconductor | www.MetroSemi.com
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TSV Metrology & Defect Inspection
Precision coverage across substrate, thin-film, and multi-layer stacks
TSV Metrology
Precise measurement of through-silicon via physical dimensions using single- or dual-probe non-contact optical configurations.
< 10
TSV Aspect Ratio
> 8 µm
CD Diameter
0.1 µm
CD Repeatability
> 50 µm
Via Depth
Via depth repeatability: 0.2 µm | Other configurations available for smaller via depths
Defect Inspection
XY-scan, bare-silicon surface inspection with manual load/unload for high-sensitivity particle and defect detection.
0.22 µm
Sensitivity (PSL)
< 5%
Repeatability
Wafer sizes: 100mm, 125mm, 150mm, 200mm
Size channels: 0.22, 0.3, 0.5, 1.0, 3.0, 5.0 µm+
Compact footprint: 30" × 30" × 30", ~250 lbs
FSM | Frontier Semiconductor | www.MetroSemi.com
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Competitive Differentiation
Setting the benchmark for non-contact thermal-mechanical characterization
Capability | FSM | Contact-Based Alternatives |
Measurement | Bow, stress, profiling, hysteresis, TDS | Bow, stress, profiling |
Technology | Non-contact | Contact |
Temperature Range | Room temperature to 900°C (1100°C optional) | Not supported |
Vacuum Compatibility | Yes | No |
Automation | Manual to fully automated cassette-to-cassette | Typically manual only |
FSM is the only vendor in this comparison to combine non-contact optical metrology with true high-vacuum, high-temperature capability — enabling measurements that contact-based tools simply cannot perform.
FSM | Frontier Semiconductor | www.MetroSemi.com
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Applications Across the Semiconductor Ecosystem
One metrology platform, five high-growth markets
Semiconductor Wafer Fabrication
Film stress and bow monitoring for process control, plus thickness and defect metrology for wafer qualification.
MEMS & Advanced Packaging
Bonding uniformity, TSV metrology, and stacked-die thickness measurement for 2.5D/3D integration.
III-V, Optoelectronics & Compound Semiconductors
High-temperature stress hysteresis and thermal stability data for new material and process development.
Solar, LED & FPD
Wafer stress and bow measurement across large-format substrates, room temperature to 900°C/1100°C.
Fab Automation
SECS/GEM-enabled, cassette-to-cassette systems for seamless integration into production fabs.
FSM | Frontier Semiconductor | www.MetroSemi.com
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Let's Talk Metrology.
Our team is ready to help you select the right non-contact metrology platform for your fab, R&D lab, or packaging line.
Get in Touch
Frontier Semiconductor (FSM)
165 Topaz St., Milpitas, CA 95035
Mo Alam • (408) 582-4997
alam@metrosemi.com
For More Information
Explore full product specifications, datasheets, application notes, and support resources on our website.
https://metrosemi.com/
FSM | Non-Contact Wafer Surface Inspection Metrology