ELECTRONIC DEVICES AND CIRCUITS
UNIT-I: DIODES, SPECIAL DIODES AND APPLICATIONS
PN diode – Operation – Voltage-current characteristics – Transition and diffusion capacitance – Reverse recovery time – Diode models – Applications – Half-wave and Full-wave rectifiers and filters – Power supply regulators – Avalanche and Zener breakdown – Zener diodes –Applications – Varactor and optical diodes.
HISTORY NOTE
Niels Henrik David Bohr (October 7, 1885–November 18, 1962) was a Danish physicist, who made important contributions to understanding the structure of the atom and quantum mechanics by postulating the “planetary” model of the atom. He received the Nobel Prize in physics in 1922. Bohr drew upon the work or collaborated with scientists such as Dalton, Thomson, and Rutherford, among others and has been described as one of the most influential physicists of the 20th century.
Atom
The smallest particle of an element that retains the characteristics of that element
According to the classical Bohr model, atoms have a planetary type of structure that consists of a central nucleus surrounded by orbiting electrons
Protons & neutrons
The nucleus consists of positively
charged particles called protons
and uncharged particles called
neutrons
Electrons
The basic particles of negative charge are called electrons.
Example : Hydrogen atom which has one proton and one electron
Helium atom has two protons and two neutrons in the nucleus and two electrons orbiting the nucleus.
Valence Electrons
Electrons that are in orbits farther from the nucleus have higher energy and are less tightly bound to the atom than those closer to the nucleus Electrons with the highest energy exist in the outermost shell of an atom and are relatively loosely bound to the atom. This outermost shell is known as the valence shell, and electrons in this shell are called valence electrons
Ionization
Materials Used in Electronic Devices
Examples of insulators are rubber, plastics, glass, mica, and quartz.
Examples such as copper (Cu), silver (Ag), gold (Au), and aluminum (Al)
Examples such as Antimony (Sb), arsenic (As), astatine (At), boron (B), polonium (Po), tellurium (Te), silicon (Si), and germanium (Ge)
Band Gap
Current in Semiconductors
Conduction Electrons and Holes
Electron and Hole Current
When a voltage is applied across a piece of intrinsic silicon the thermally generated free electrons in the conduction band, which are free to move randomly in the crystal structure, are now easily attracted toward the positive end.
This movement of free electrons is one type of current in a semi conductive material and is called electron current
Although current in the valence band is produced by valence electrons, it is called hole current to distinguish it from electron current in the conduction band.
N-Type and P-Type Semiconductors
Since semiconductors are generally poor conductors, their conductivity can be drastically increased by the controlled addition of impurities to the intrinsic (pure) semiconductive material. This process, called doping, increases the number of current carriers (electrons or holes).
N-Type Semiconductor
Majority and Minority Carriers
Donor
P-Type Semiconductor
Majority and Minority Carriers
acceptor
Since four electrons are required, a hole results when each trivalent atom is added.
Because the trivalent atom can take an electron, it is often referred to as an acceptor atom
The PN Junction
Formation of the Depletion Region
When the pn junction is formed, the n region loses free electrons as they diffuse across the junction. This creates a layer of positive charges (pentavalent ions) near the junction.
As the electrons move across the junction, the p region loses holes as the electrons and holes combine. This creates a layer of negative charges (trivalent ions) near the junction. These two layers of positive and negative charges form the depletion region
The depletion region is formed very quickly and is very thin compared to the n region and p region
Formation of the Depletion Region
PN diode
as an n region with a pn junction and
depletion region in between
Forward Bias
The Effect of Forward Bias on the Depletion Region
Reverse Bias
The positive side of the bias-voltage source “pulls” the free electrons, which are the majority carriers in the n region, away from the pn junction. As the electrons flow toward the positive side of the voltage source, additional holes are created at the depletion region. This results in a widening of the depletion region and fewer majority carriers.
Reverse Current
Normally, the reverse current is so small that it can be neglected. However, if the external reverse-bias voltage is increased to a value called the breakdown voltage, the reverse current will drastically increase.
Voltage-Current Characteristic of a Diode
Point A corresponds to a zero-bias condition. Point B corresponds where the forward voltage is less than the barrier potential of 0.7 V. Point C corresponds to where the forward voltage approximately equals the barrier potential.
Dynamic Resistance
V-I Characteristic for Reverse Bias
The Complete V-I Characteristic Curve
Temperature Effects
Diode Current Equation
The Ideal Diode Model
The ideal model of a diode is the least accurate approximation and can be represented by a simple switch. When the diode is forward-biased, it ideally acts like a closed (on) switch. When the diode is reverse-biased, it ideally acts like an open (off) switch,
TRANSITION CAPACITANCE
XC = 1/2πfC
DIFFUSION CAPACITANCE
REVERSE RECOVERY TIME
ts
tt
trr =ts + tt
Diode Applications
Half-Wave Rectifiers
Half-Wave Rectifier Operation
Transformer Coupling
Ripple Factor(Г)
PEAK INVERSE VOLTAGE
TRANSFPRMER UTILISATION FACTOR(TUF)
Full-wave rectifiers
Bridge Rectifier
D1, D3
D2, D4
Advantages of Bridge rectifier
Disadvantages of Bridge rectifier
Filters
Types of Filters
Inductor filter
Capacitor filter
LC or L-section filter
CLC or π-type filter
Voltage Regulators
Zener diode
Zener Breakdown
Those with breakdown voltages greater than approximately 5 V operate predominately in avalanche breakdown.
Avalanche breakdown
Varactor Diodes
Optical Diodes
LIGHT-EMITTING DIODE (LED)
LED Biasing
Quantum Dots
The Photodiode
UNIT-II: BI-POLAR JUNCTION TRANSISTORS AND THYRISTOR
BJT, JFET, MOSFET – Structure, operation, characteristics – UJT, Thyristors and IGBT –Structure, operation and characteristics – Photo-transistors and opto couplers – New semiconductor material – Silicon carbide – Gallium Arsenide.
Bipolar Junction Transistor(BJT)
BJT Construction
Biasing
Operation
Operation
Ic
Ib
IE
Types of Configuration
Common base (CB) configuration
Input Characteristics:
Output Characteristics:
Common base (CB) configuration
VEE
B
C
E
VCC
A
IE
A
IC
V
VEB
V
VCB
0 V
Input Characteristics:
VCB is kept constant at zero volt
The emitter current IE is increased from zero in suitable equal steps by increasing VEB
0.7 V
VCB =0
1 V
0.6 V
VCB > 1.5
When VCB is increased keeping VEB constant, the width of the base region will decrease.
Output Characteristics:
The emitter current IE is kept constant at a suitable value by adjusting the emitter-base voltage VEB.
0 V
0 V
1 V
1 mA
1 V
1 mA
2 V
3 V
1.5 V
2 mA
2 mA
1 V
2 V
3 V
Then VCB is increased in suitable equal steps and the collector current IC is noted for each value of IE.
Transistor Parameters
Common emitter (CE) configuration
Input Characteristics:
Output Characteristics:
Transistor Parameters
Common Collector (CC) configuration
Input Characteristics:
Output Characteristics:
Current Amplification Factor
it is clear that α as approaches unity, β approaches infinity. The CE configuration is used for almost all transistor applications because of its high current gain.
Types of FET
FET
JFET
IG -FET
(Junction Field Effect Transistor)
(Insulated Gate Field Effect Transistor)
Types of FET
FET
JFET
MOSFET
(Junction Field Effect Transistor)
(Metal Oxide Semi Conductor Field Effect Transistor)
n-channel
p-channel
Depletion Type
Enhancement Type
JFET
n Type
Base
P
P
Gate (G)
Drain (D)
Source (S)
Construction of n channel JFET
Construction of p channel JFET
p Type
Base
n
n
Gate (G)
Drain (D)
Source (S)
Working of n channel JFET
n
P
Gate (G)
Drain (D)
Source (S)
P
Biasing
VGS
VDS
Source act as a common terminal
0 V
0 V
Depletion region is formed
2 V
VDS = Constant
VGS = - 0.5 V
-0.5 V
pn junction reversed biased , Depletion region penetrates more deeply into the channel
Therefore drain current reduces
VGS = -1 V
- 1 V
- 1.5 V
Pinch off voltage or Threshold voltage
- 1 V
4 V
10 V
VGS = 0 V
ID(mA)
VDS(V)
IDSS
VP
Saturation Level, VGS = 0 V
VGS = -1 V
VGS = -2 V
VGS = -3 V
VGS = -4 V = VP
VGS = -1 V
VGS = -2 V
VGS = -4 V
Ohmic Region
Working of p channel JFET
p
n
Gate (G)
Drain (D)
Source (S)
n
VGS
VDS
0 V
0 V
-2 V
1 V
3V
4 V
5 V
-4 V
-10 V
3 V
TRANSFER CHARACTERISTICS
MOSFET - Basic Construction
P Type
Substrate
n
n
Gate (G)
Drain (D)
Source (S)
Construction of n channel Depletion type MOSFET
n
Substrate (ss)
SiO2
n Type
Substrate
p
p
Gate (G)
Drain (D)
Source (S)
Construction of p channel Depletion type MOSFET
p
SiO2
Working of n channel Depletion type MOSFET
P
n
n
G
D
S
n
ss
VGS = 0 V
VDD
1 V
ID = Is = ISS= 8mA
VGS = -1 V
ID = Is = 5mA
VGS = -3 V
ID = Is = 2 mA
VGS = -6V
ID = Is = 0 mA
VGS = 1 V
ID = Is = 10 mA
MOSFET - Basic Construction
P Type
Substrate
n
n
Gate (G)
Drain (D)
Source (S)
Construction of n channel Enhancement type MOSFET
Substrate (ss)
SiO2
n Type
Substrate
p
p
Gate (G)
Drain (D)
Source (S)
Construction of p channel Enhancement type MOSFET
SiO2
Working of n channel Enhancement type MOSFET
P
n
n
G
D
S
ss
VDD
1 V
ID = Is = 0.5mA
5 V
VGS = 0 V
VGS = 3 V
VGS = 5 V
VGS = 7 V
7 V
10 V
15 V
ID = Is = 8 mA
Working of p channel Enhancement type MOSFET
n
p
p
G
D
S
ss
VDD
-1 V
ID = Is = 0.5mA
-5 V
VGS = -0 V
VGS = -3 V
VGS = -5 V
VGS = -7 V
-7 V
-15 V
ID = Is = 8 mA
UNIJUNCTION TRANSISTOR
n
p
B1
B2
E
VBB
VE
d2 >d1
R2 >R1
10 V
d2
d1
Its acts as a voltage divider
1 V
2 V
5 V
>7 V
Thyristors
Four-layer diode
The Silicon-Controlled Rectifier (SCR )
IGBT (insulated-gate bipolar transistor)
Operation
Operation
The Phototransistor
Working Principle
Optocouplers
UNIT-III: AMPLIFIERS
Biasing: base, emitter and voltage divider – DC operating point – BJT small signal model -Analysis of CE, CB, CC amplifiers – Gain and frequency response – MOSFET small signal model – Analysis of CS and source follower – Gain and frequency response – High frequency equivalent model.
Transistor as an AMPLIFIERS
Large Signal,d.c and small signal CE values of current gain
The output characteristics of CE configuration show that in the cut-off region, the values IE = 0, IC = ICBO and IB = – ICBO
Bias Stability
DC load line
VCC = IC RC + VCE
AC Load Line
Thermal Runaway
Stability Factor (S)
It is defined as the rate of change of collector current IC with respect to the collector–base leakage current ICO, keeping both the current IB and the current gain β constant
Stability Factor S’ & S’’
Methods of Transistor biasing
Fixed bias or base resistor method
Emitter-feedback bias
Collector emitter loop
Collector-to-base bias or collector feedback bias
As can be seen, this value of the stability factor is smaller than the value obtained by fixed bias circuit. Also, S can be made small and the stability can be improved by making RB small or RC large. If RC is very small, then S = (1 + β), i.e. stability is very poor. Hence, the value of RC must be quite large for good stabilization.
Collector – emitter feedback bias
Voltage divider bias, self bias or Emitter Bias
TWO – PORT Network Parameters
Z-parameters or Impedance parameters
Y-parameters or Admittance parameters
h-parameters or Hybrid parameters.
Hybrid Model for Two Port Network
Transistor Hybrid Model
Analysis of transistor Amplifier Using h- Parameters
BJT Large Signal Model
BJT
Amplifier
DC Supply
Biasing
DC Biasing
BJT
Common Emitter
Output
Input
B
C
E
BJT
DC Supply
DC Analysis
AC Analysis
- Operating Point(Q)
- Gain and Frequency response,
Input & Output impedance,
Voltage & Current Gain.
BJT – Large Signal Model
Output
Input
B
C
E
Large Signal Model
Small signal Model
DC (biasing)
+AC (Time Varying signal)
IE = IC+IB
Small signal analysis of BJT
Steps for Small signal
BJT – CE Amplifier
Output
Input
B
C
E
C2
C1
RB
RC
(A) CE amplifier with fixed bias
C2
C1
RB
RC
Vi
AC i/p
AC o/p
Vcc
B
C
E
B
C
E
hie
hfe Ib
B
C
E
hie
hfe Ib
B
C
E
RB
RC
Vout
Vi
IL
Io
IC
Ii
Ib
hie
hfe Ib
B
C
E
RB
RC
Vout
Vi
IL
Io
Ib
Ii
Input Impedance =
Zi
Zo
Voltage Gain:
Current gain
Output Impedance
it is the impedance determined with Vi = 0; Ib=0, input voltage source short circuited
Substituting the re model
hie
hfe Ib
B
C
E
RB
RC
Vout
Vi
IL
Io
Ib
Ii
β re
β Ib
B
C
E
RB
RC
Vout
Vi
IL
Io
Ib
Ii
Input Impedance =
Input Impedance =
Current gain
Current gain
Voltage Gain:
Voltage Gain:
Output Impedance
Output Impedance
(B) CE amplifier with unbypassed Emitter resistor
C2
C1
RB
RC
Vi
AC i/p
AC o/p
Vcc
B
C
E
B
C
E
hie
hfe Ib
B
C
E
hie
hfe Ib
B
C
E
RB
RC
Vout
Vi
IL
Io
IC
Ii
Ib
RE
RE
hie
hfe Ib
B
C
E
RB
RC
Vout
Vi
IL
Io
Ib
Ii
Input Impedance =
Zi
Zo
Voltage Gain:
Current gain
Output Impedance
it is the impedance determined with Vi = 0; Ib=0, input voltage source short circuited
RE
(C) CE amplifier with Voltage divider Bias
C2
C1
R1
RC
Vi
AC i/p
AC o/p
Vcc
B
C
E
hie
hfe Ib
B
C
E
R1
RC
Vout
Vi
IL
Io
IC
Ii
Ib
RE
R2
CE
B
C
E
hie
hfe Ib
B
C
E
R2
hie
hfe Ib
B
C
E
R1
RC
Vi
IL
Io
IC
Ii
Ib
R2
UNIT-IV: MULTISTAGE AMPLIFIERS AND DIFFERENTIAL AMPLIFIER
Cascade amplifier – Differential amplifier – Common mode and difference mode analysis – FET input stages – Single tuned amplifiers – Gain and frequency response – Neutralization methods, power amplifiers –Types (Qualitative analysis).
Differential amplifier:
Differential amplifier Using Operational Amplifier
CMRR
Differential amplifiers using BJT
differential BJT amplifier with resistive loading
SMALL SIGNAL TUNED AMPLIFIERS
single tuned amplifiers
Neutralization
Hazeltine neutralization method.
Power Amplifiers
Class A amplifier
Class B amplifier
Class AB amplifier
Class C amplifier
Class A amplifier
Transformer coupled class A audio power amplifiers
Class B amplifier
(i) possible to obtain greater power output
(ii) efficiency is higher
(iii) negligible power loss (as no output current flows) at no input signal.
PUSH-PULL Amplifier (Class – B)
Advantages:
Class AB amplifier
Class C amplifier
UNIT – V : FEEDBACK AMPLIFIERS AND OSCILLATORS
Feedback amplifier
Positive feedback amplifier
Negative feedback amplifier
Feedback network
Mixer Network
(1) voltage-series feedback or series shunt feedback
(2) current-series feedback or series series feedback
(3) current-shunt feedback or shunt series feedback
(4) voltage-shunt feedback or shunt shunt feedback
The amplifier input and output circuit replaced by its Thevenin’s model. In this circuit AV represents the open-circuit voltage gain taking Rs into account. We have considered Rs to be part of the amplifier throughout the discussion of feedback amplifier. Here, the input impedance with feedback is given by Rif = Vs /Ii.
Current Series feedback
Current Shunt feedback
Voltage Shunt feedback
Effect of negative feedback amplifier characteristics
Oscillators
Classification of oscillators:
1. According to the waveforms generated:
(a) Sinusoidal oscillator
(b) Relaxation oscillator
2. According to the fundamental mechanisms involved:
(a) Negative resistance oscillators
(b) Feedback oscillators
3. According to the frequency generated:
(a) Audio frequency oscillator (AFO): up to 20 kHz
(b) Radio frequency oscillator (RFO): 20 kHz to 30 MHz
(c) Very high frequency (VHF) oscillator: 30 MHz to 300 MHz
(d) Ultra high frequency (UHF) oscillator: 300 MHz to 3 GHz
(e) Microwave frequency oscillator: above 3 GHz
4. According to the type of circuit used, sine-wave oscillators may be classified as
(a) LC tuned oscillator
(b) RC phase shift oscillator.
Condition for oscillation (Barkhausen Criterion)
1. | A β | = 1, i.e. the magnitude of loop gain must be unity.
2. The total phase shift around the closed loop is zero or 360 degrees.
General Form of an Oscillator
Hartley Oscillator
COLPITS OSCILLATOR
RC oscillators
RC Phase shift oscillator
Wien Bridge Oscillator
Crystal oscillators