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SERVER

OCP NIC Community Update�July 2023

For Server Project�����Sub-group Project wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

NIC3.0

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Agenda

  • Thermal Test Fixture modification update
  • SI Test Fixture update

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TSFF Thermal Test fixture: Side holes solution

Holes were added at the sides of the test chamber to allow the leaked airflow to flow to the sides.

Geometry 2 inside the proposed TSFF test fixture

TSFF test fixture

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TSFF Airflow Distribution Issue

NVIDIA performed tests with the new test fixture and encountered an issue related to airflow distribution.

Due to the geometry of the test chamber and front panel perforation, a fraction of the air leaks to the sides of the test fixture but exit through the bracket area. This airflow is not typical for servers where if the leakages occurs – the air pass through the other holes in the front panel of the server

The purpose of this work is:

    • To explore potential solutions to the airflow leakage problem to gain better fit to servers’ environment.
    • Propose a better way to define the airflow during the tests and for thermal simulations.

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Test chamber simulation update

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SI Test Fixtures

CLB 5.0 32GT/s status:

    • Dell to present at IC meeting to release design to Wiki

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CBB 5.0 32GT/s status:

    • Assembled units arrive by July 19th
    • PCB material exposed a solder mask issue with MMPX connectors; layout revised.

OCP NIC 3.0 SFF CLB 5.0 prototype

Calibration

CLB board 1

Impedance Coupon

CLB board 2

Jason

OCP NIC 3.0 SFF CBB 5.0 block diagram

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Double-wide Small Form Factor

  • Discussion about Double-wide Small Form Factor in 8/2 OCP NIC monthly meeting
  • Join us for the discussion

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Gather feedback throughout the year

Provide your feedback at:�https://tinyurl.com/feedback2ocpnic