SERVER
OCP NIC Community Update�August 2023
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Mailing List: https://ocp-all.groups.io/g/OCP-NIC
NIC3.0
Agenda
Thermal Test Fixture for TSFF feedbacks
Faceplate modification that includes side holes for airflow
Aligned the opening holes shall match OCP spec at 72.8 +/- 0.25mm
OCP Global Summit 2023
October 17 to 19: San Jose Convention Center
Break-out session/Presentation:
2 abstracts tentatively accepted
Experience Lab demo:
Request for space approved
Broadcom, Dell, Meta interested
Would like to see more companies participate in demo
SI Test Fixtures
CLB 5.0 32GT/s status:
CBB 5.0 32GT/s status:
OCP NIC 3.0 SFF CLB 5.0 prototype
Calibration
CLB board 1
Impedance Coupon
CLB board 2
Jason
OCP NIC 3.0 SFF CBB 5.0 block diagram
SIWG for PAM4 Gen6 spec
Xtalk spec to meet BER requirement
Anthony/Tanmoy
Connector Spec
Channel Simulation
Based on Gen5 models as same Nyquist for Gen6
Anthony/Tanmoy
Straddle Mount
AIC/OCP
Smart NICs - LFF vs SFF
SFF and LFF are not plug-compatible
Platforms and adapters are commonly SFF today
Ideas: Double-SFF (D-SFF) which fits into two SFF slots
Requires Different Connector
New DSFF
Uses same connectors
Motherboard with 1x LFF
Motherboard with 2x SFF
SFF
SFF
LFF
Arnon
Idea - Double SFF for Smart NICs
Spans over two 4C+ connectors
Spaced per M-FLW HPM specification
Regular and Tall options
160 Watt
x32 PCIe lanes
13% more board space than LFF
Opens:
Illustration
Arnon
Gather feedback throughout the year
Provide your feedback at:�https://tinyurl.com/feedback2ocpnic
SmartNIC Summit