DC-MHS 03-15-23

DC-MHS Workstream Leads

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

DC-MHS + OCP

DC-MHS Website:

https://www.opencompute.org/projects/dc-mhs

DC-MHS WIKI:

https://www.opencompute.org/wiki/Server/DC-MHS

Training Note

Bottom of WIKI has several useful training videos and presentations that are highly recommended.

Public Email List Subscription

https://ocp-all.groups.io/g/OCP-DC-MHS

Public Meetings

Monthly meetings reoccur 3^rd WED 8am PT monthly. Meeting logistics provided on DC-MHS Home Page Call Calendar. Meeting recordings posted to WIKI.

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*Don’t Overlook

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

DC-MHS Introduction/Workstreams

• DC-MHS envisions interoperability between key elements of Hyperscale, Edge and Enterprise.
• DC-MHS Provides consistent interfaces and form factors among modular building blocks.  
• Close collaboration among nine industry leading companies
• 5 workstreams - covering system architecture, key elements & interfaces. Six Base Specifications released in Nov’2022

*New Members

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Activities and Timeline

Base Specification Introduction

• Form-Factor Base Specifications details include mechanical outlines, mount-points, placement restrictions, entry/exit point electrical requirements, and connector placements. Each form-factor specification may include multiple, related form-factors with a high degree of consistency between them, maximizing design reuse.
• Read these first, you can choose DNO or FLW if you only have one application

• Ingredient Base Specifications define the interfaces from the HPM to other classes of peripheral and infrastructure within a chassis, including but not limited to connector, pin-out, electrical, signaling, sequencing, and protocol requirements.
• The HPM form-factor specifications draw upon these Ingredient specifications for consistency across all DC-MHS Rev 1.0 HPMs.
• Read M-XIO and M-PIC second
• Read M-CRPS and M-PESTI third, after you comprehend the other four Base Specs

Form-Factors

Ingredient

Partner Specifications

DC-SCM r2

Secure Control Module

NIC r3

Network Interface Card

PCISIG Internal Cable Spec

Internal Cable Specification for

PCI Express 5.0 and 6.0

• Partner Specifications are used by DC-MHS and must be understood as they are used as core specifications in DC-MHS.
• Read these last, after you comprehend all for the DC-MHS Base Specs

M-XIO

PCIe/CXL Connectivity to Peripherals

M-PIC

Platform Infrastructure Connectivity

M-PESTI

Sideband Signal Virtualization

M-CRPS

AC/DC and DC/DC 12v/48v Supplies

M-FLW

Full Width Host Processor Module

M-DNO

Partial Width Host Processor Module

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

LTPI r1

LVDS Tunneling Protocol & Interface

DC-MHS 2023 Focus Areas

• New HPM Base Specifications
• HPMs optimized around wider boards and ORv3
• 48V architecture
• M-SIF Base Specification
• Through the collaborative efforts of DC-MHS combined with the advent of new technologies such as CXL, an opportunity exists to create an additional set of specifications around the idea of Shared Infrastructure.
• M-SIF aims to improve interoperability related to shared infrastructure elements with multiple, serviceable modules, particularly focused on shared Cooling, Power, I/O and Management.
• Design/Product Specifications

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These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Compliance to the Base Specifications

• DC-MHS Base Specs are written such that there are two levels
• Required Items for Compliance. These items are called out in the Compliance Tables and must be implemented as defined to claim DC-MHS compliant system. Some specifications such as FLW and DNO will also underline required items and use words such as “shall comply”, “shall place”, “shall implement”, “shall have”, “shall not exceed”, “shall provide”, “shall adhere”, etc.

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• Suggested/Recommended Items for Greater Adoption. These items are called out in implementers notes, figures, and spec text as “special items to consider”. Additional attempt to meet the suggestion should be tried. Not meeting a suggestion doesn’t make you non-compliant, you should consider the impact when not meeting a recommendation. Example from the FLW spec is that all MXIO connectors should be six SFF-TA-1033 but if you had fewer than six, the HPM is still compliant it just may not work in a different application. Recommended Items are there for greatest adoption.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

DC-SCM (Datacenter-Secure Control Module)

• A CLA workgroup of systems management experts distinct from DC-MHS.
• Many inter-dependent requirements.

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• DC-SCM 2.1 Base Spec enhancements being finalized:
• Two vertical form factors definitions
• Dual node only: adding TPM, SGMII as alt-functions
• Interface update: GPIO as alt-function to JTAG TRST
• Errata

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• “HPM Common Circuits Type 1” Design Spec effort underway to gain CPU agnostic, consistent HW interoperability & HPM economies of scale

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• Futures: Public feature requests/clarifications/errata, etc. on wiki. Seek inputs on:
• A) Internal Form Factor
• Remote I/O or all HPM embedded I/O to relieve wall proximity constraints.
• B) Multi-node use cases

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These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

M-PIC Errata and Updates

• Updated to M-PIC R1 v1.01
• Addressed Errata #1
• Added 12V PICPWR pin mating sequence requirements.
• Recommended avoiding damage by using the SB mating sequence to detect and act to limit current flow in partial mate conditions.
• Addressed Errata #2 - Updated 3+16S+3 PICPWR connector requirement from 1080 to 2000W.
• Clarified hot plug as not supported for 12V PICPWR connectors.
• Added an optional SDataIn termination and PDB presence detection method.
• Added a link to the latest M-PIC reference materials.
• Updated to M-PIC R1 v1.02
• Improved the compliance requirement table and visibility throughout.
• Clarified “OR-ing” for remote power distribution to include all +12V sources.
• Investigating 48V power distribution support.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

M-XIO / M-PESTI Errata and Updates

Updated to M-XIO r1.01

• 2 ECNs incorporated:
• Added clarification to 3P3AUX_MGMT usage.
• Added cable construction expectations for HPM to paddle board on SFF-TA-1016.
• 1 Errata incorporated:
• Pinout errata update on FLEXIO interface.

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M-XIO r1.02 coming soon

• Compliance table added.
• Minor clarifications around the document based on feedback.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

M-CRPS Errata and Updates

M-CRPS Errata Rev 1 work in progress:

• Pinout correction in the 185mm by 60mm form factor output connector.
• Imon block diagram concept - added definitions for signals.
• PSON# signal definition has a typo in the logic levels to select between 2-state and 3-state operation.
• VINOK typo in signal definition (it states PWOK instead VINOK).
• Mismatched event offset typo in power supply events table.
• Typo in offsets on latch on fault condition configuration block table.

M-CRPS Base Specification v1.01 work in progress:

• Updating thermal conditions to have 3 different environments at different temperature and altitude combination.
• Addition of new PMBus commands and clarifications.
• Working in alignment of sections 7.1.1 and 8.2 (power levels definitions).

M-CRPS Design Specifications:

• Working on 9 design specifications for different power levels from 600W to 3200W.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Modular Host Processor Module (M-HPM)

M-DNO Errata 1 Published

• M-DNO V1.0 Figure 35 has an error in recommended E1 direct dock location
• Only impacts Type 4 designs that choose to use E1 in Platform Custom Zone
• Recommended dimension causes interferes with NIC
• Corrected placement will allows 2x E1 modules using either 1C or 2C SFF-TA-1002 connectors
• Errata document posted to DC-MHS wiki, will be included in next M-DNO spec revision
• M-DNO Type 4 reference CAD was also updated to include this correction

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Call for feedback: DNO Type 3

• Type 3 length was left TBD in M-DNO V1.0
• Workgroup continues to seek feedback on potential usage models for Type 3

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M-DNO

M-FLW

Questions? Feedback?

M-FLW Reference CAD Updated

• Updated CAD model and Drawings to include missing corner rounds.

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Call for feedback: M-FLW FSPM

• Section 14.8 of M-FLW provides supplemental information on a version of M-FLW with far side panel mounted connectors
• Workgroup is seeking feedback on adding this version to the main body of the M-FLW specification

NEW: Modular Shared Infrastructure (M-SIF)

Part of the DC-MHS Family

March 2023 Update

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Dirk Blevin - Intel

Greg Sellman - AMD

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Modular Shared Infrastructure (M-SIF)

Goal:

• Extend the scope of DC-MHS to comprehend what platforms built for shared infrastructure may look like and to improve industry interoperability through the definition of multiple, serviceable modules or elements.

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Intended Outputs:

• Define a logical, super-set model of a shared infrastructure solution
• Define interfaces between modules and shared infrastructure including signaling and physical connectivity for power, cooling, management, and I/O links, specifically PCIe/CXL
• Enable HPMs to natively support shared infrastructure capabilities in future versions of HPM specifications
• Define use cases and block diagrams of specific solutions
• Show module/sled form factors that may be used in different enclosures
• Show example enclosures that may use the above example sled form factors

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Modular Shared Infrastructure (M-SIF)

Progress Update:

• Achieved alignment related to high-speed data interfaces and management control planes along with beginning to define their connectivity within a shared infrastructure environment

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• Shown examples of platforms that could be constructed through a combination of M-SIF and other supporting DC-MHS specifications

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• Posted M-SIF specification Rev. 1.0 Ver. 0.3 to DC-MHS Wiki
• Provides an early indication as to the direction of M-SIF
• Not yet intended to provide guidance in the development of hardware

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Modular Shared Infrastructure (M-SIF)

Please direct comments and questions to:

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M-SIF Leads – m-sif_leads@opencompute.org

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-or-

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Dirk Blevins (M-SIF Co-lead) – dirk.blevins@intel.com

Greg Sellman (M-SIF Co-lead) – Gregory.Sellman@amd.com

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These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

NEW: Modular Host Processor Module (M-HPM)

Part of the DC-MHS Family

March 2023 Update

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Brian Aspnes - Intel

Corey Hartman - Dell

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Additional HPMs Under Consideration

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.Next 1 (N1)

.Next 2 (N2)

.Next 3 (N3)

.Next 4 (N4)

• DC-MHS HPM workgroup is studying additional HPM form factors in 2023
• Specific number of new HPMs, dimensions and details are to be determined / under discussion
• Any new form factors would target a scalable family approach as depicted below
• Whether a new family or an extension of M-DNO is to be determined