OCP NIC Community Update�October 2024

�����Sub-group Project wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

Agenda

• OCP Global Summit
• OCP Spec release candidate
• DSFF Mechanical/Thermal update
• DSFF Signal Integrity update
• DSFF Thermal Test Fixture update

OCP Global Summit

• October 15-17, 2024 San Jose, CA
• 3 presentation in Break-out session
• 1 lightning talk at Expo hall
• OCP Innovation Village OCP NIC demo planned

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Revision 1.5.0 Published

• Review cycle completed. Published Sept 20th, 2024.
• Minor comments received (clarification items)

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• https://www.opencompute.org/w/index.php?title=Server/NIC#Released_Specification_Docs

SFF-TA-1002 Connectors

Cautionary tales for Baseboard vendors

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SFF-TA-1002 Rev 1.5 introduced the idea of “Type 1” and “Type 2” connectors.

• Type 1 connectors have discrete GND pins
• Type 2 connectors bond several GND pins together

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This is NOT an issue for OCP NIC.

This is problematic for connectors in the DC-SCM locations - Type 1 is compatible; Type 2 is not.

DC-SCM repurposes several GND pins as signal pins.

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Download SFF-TA-1002 from SNIA (must be a member): https://members.snia.org/document/dl/27231

Snippet from Rev 1.5.1 (draft)

Mechanical/Thermal Update

• Final DSFF/TDSFF mechanical updates published in 1.5.0 revision of spec
• 3D CAD and 2D drawings need to be posted to wiki page
• Suggest removing/archiving older “Working Draft Docs”
• Suggest replacing old shock & vibe files with new files
• Reduce confusion

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• Mechanical workstream has sunset
• Thank you to all those that helped contribute!

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• Thermal workstream has kicked off
• Will focus on thermal modeling and documentation
• TSFF, DSFF and TDSFF
• Thermal model boundary conditions will match new thermal test fixture
• Geometry, sensor locations

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DSFF SI Update

• Dell contributing DSFF CBB SI fixture, Gen 6 by default
• Incorporated feedback from Broadcom & Intel
• Gerber sent for fabrication
• Board files here: Link
• Proto assembly est Nov 22nd
• Ordered FR4 for OCP Innovation Village demo

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• For DSFF CLB use two of CLB SFFs

DSFF Thermal Test Fixture

• New DSFF TTF will support SFF / TSFF / DSFF form factors at PCIe® speeds up to 64 GT/s
• Metal housing with a PCB designed to extend PCIe® lanes from a DC-MHS compatible server to a mounted OCP 3.0 DUT card
• Intended to attach to a wind tunnel or flow bench
• Pre-defined sensor locations for test repeatability
• Onboard MCU shall operate same as prior thermal test fixtures and codebase will be uploaded to the Github repository
• Currently in schematic Dates pending
• Ordered FR4 PCBs for OCP Innovation Village Demo

MCIO

160pin

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MCIO

160pin

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Primary

4C+

Secondary

4C+

MCU

DSFF TTF Block Diagram

x16

x16

DSFF TTF Rendering

Backup slides

Release Candidate Time!

• Email announcement this week via Groups.io distribution

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• Timeline
• 1.5.0 Release Candidate on Wiki page by Sept 5th, 2024
• 2 week public review cycle & comment feedback

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• 1.5.0 Release published to Wiki page Sept 20th, 2024

Spec Updates - 1.4.8 Draft

• Electrical
• Removed D Flip-Flop requirement from NIC side; added text for baseboard timing analysis and “signal conditioning logic” if required

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DSFF Mechanical Drawings

• Mechanical
• 2D drawings & BOM added
• Backing plate now an option (DSFF, SFF)
• Example 2xSFF / 1xDSFF guiderail
• Updated DSFF BOM

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• Shock and Vibration
• S&V fixture drawing complete

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