1 of 11

2 of 11

SERVER

OCP NIC Community Update�July 2024

�����Sub-group Project wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

NIC3.0

3 of 11

Agenda

  • OCP Global Summit
  • OCP NIC spec Release 1.4.5
  • OCP NIC spec Draft 1.4.6 work in progress
  • Flex I/O

4 of 11

OCP Global Summit

  • October 15-17, 2024 San Jose, CA
  • Abstract submission closed. Track committee to review submission.
  • OCP Innovation Village OCP NIC submitted, pending OCP foundation feedback
  • Interested for F2F OCP NIC meeting during summit?

​

5 of 11

Spec updates

  • Version 1.4.5 released
    • DSFF Mechanical outline locked
    • Electrical complete for DSFF
    • PCIe Channel budget aligned -7.0 dB at 16 GHz for Gen 5

​

Release:

https://www.opencompute.org/w/index.php?title=Server/NIC#Released_Specification_Docs

6 of 11

Spec - 1.4.6 WIP Items

​

  • SI working group - PCIe Gen 6 spec limits for SFF & DSFF
    • Released for public comment/review
    • Conformance insertion loss = -7.0 dB at 16 GHz, adds informative limits
  • DSFF Mechanical Drawings / views
    • No notches in faceplate for internal lock
  • DSFF Shock and Vibe Fixture (drawings)
    • Should be backwards compatible with existing plate
  • DSFF Thermal Test Fixture (Dell Contribution)
  • DSFF PCIe Gen6 CBB (Dell Contribution)
    • In ECAD layout

7 of 11

Spec - New for draft 1.4.6 (in progress)

  • Add option for Flex I/O timing pins along card edge
    • Dell contributed on June 10th
    • Hardware traceable clocking sources
    • Add Telco clock profile capability (e.g. G.8265.1, G.8275.1, and G.8275.2)

​

  • NIC - HPM interface
    • 10 MHz with ePPS (default)
    • 10 MHz with separate 1PPS (alternate option)

​

  • Over-subscribes existing RBT pins
    • Default: isolated
  • Adds 0xC2 OEM Record for timing

8 of 11

Flex I/O Pin Mapping (WIP)

9 of 11

Flex I/O Examples (WIP)

10 of 11

Flex I/O 0xC2 OEM Record

11 of 11

Backup slides