Electronic conduction in semiconductors
Prof. Stanislav S. Fedotov, Prof. Dmitry Aksyonov
Materials Chemistry
Center for Energy Science and Technology
October 8th, 2025
Main application: active microelectronic devices, such as transistors and microchips
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Semiconductors
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Silicon ingot
Germanium rods
GaAs
Electronic structure of semiconductor: presence of a band gap
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Two types of carriers: holes and electron
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No field
Field applied: e-h appear
Field applied: e, h migrate
Direct vs indirect band gaps
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How to measure?
Measuring band gap: optical adsorption
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Is silicon direct or non-direct?
Band structure of silicon
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What about other elements?
Semiconductors or metalloids
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Si, Ge or
III-V
or
II-VI
Four electrons and formation of sp3 bonds
sp3 hybridization
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Bonding/antibonding and covalency
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Band gap formation in Ge, Si, and C (diamond)
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Cohesive energy vs band gap of semiconductors
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Since the bandgap energy increases as the lattice parameter decreases, one might expect that bandgap energy would increase with pressure in semiconductors or not? Homework task.
EC = 5.47 + 1.78Eg
Typical semiconductors and band gaps
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Since the lattice parameter
increases with temperature due to thermal expansion, the bandgap energy decreases with temperature (only one reason).
from Kittel
Why for PbS it is increasing?
Intrinsic electrical conductivity
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intrinsic carrier concentration:
e is elementary charge
n is concentration of carriers
μ is mobility of carriers
Fermi energy and Fermi level and carrier concentration
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Carrier concentration of semiconductors is a function of band gap and temperature
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n ~ exp(-Eg/2kT)
Mobility and effective mass
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Charge carrier mobility
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Extrinsic conductivity, n-type
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IP = me4/(4πε0)2ℏ2 - first ionization energy of a hydrogen atom, for P ~ 0.05 eV, kT is 0.026 eV at room T
Extrinsic conductivity, p-type
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Ionization energies (eV)
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Fermi-level in doped semiconductors
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Fermi level as a function of T in doped materials
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As the temperature is increased, the ni and pi increases, while the number of donors (or acceptors) remains constant (assuming they are all ionized), which drives EF back toward EiF
Intrinsic vs extrinsic temperature dependence
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Impact of impurity concentration on mobility
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Impact of T on mobility electrons and holes
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At low concentration less than 1024 the mobility is decreasing due to thermal scattering
For n>1024 T has almost no impact on mobility
Conductivity vs T in doped semiconductor
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Conductivity increases exponentially due to increased number of ionized impurities
σ ~ exp(Eg/2kT)
exponential growth
due to intrinsic conductivity
The plot can be used to determine Eg
Decrease of mobility due to thermal scattering
100K
25K
The Hall effect to determine charge concentration and mobility
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RH is Hall coefficient, Ix is current, Bz is field
For metals:
The p-n rectifying junction (diode)
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Forward bias
Reverse bias
No bias
The current–voltage characteristics of a p–n junction
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Rectifying of AC current using a pn junction
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Bipolar (junction) transistor
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hFE is gain (10-100)
Bipolar transistor as a switch
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Field effect transistor (FET)
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FET operates by using an electric field to control the flow of current between the source and drain terminals through a semiconductor channel. The voltage applied to the gate terminal modulates the conductivity of the channel, allowing the FET to act as a switch or amplifier.
Summary on semiconductors
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Task 1
Calculate the electrical conductivity of intrinsic silicon at 150 C.
ni = 4x1019 m-3, μe = 0.06 m2/V-s and μh=0.022 m2/V-s
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Task 2
To high-purity silicon is added 1023 m-3 arsenic atoms.
(a) Is this material n-type or p-type?
(b) Calculate the room-temperature electrical conductivity of this material.
(c) Compute the conductivity at 100C.
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Task 3
An extrinsic p-type silicon material is desired having a room-temperature conductivity of 50 (Ohm-m)-1. Specify an acceptor impurity type that may be used as well as its concentration in atom percent to yield these electrical characteristics.
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0.05
Individual studies:
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α = ΔR/Rroom/ΔT
ΔR = α RroomΔT=
0.004*5*30 = 0.6 Ohm